Page 53 - Embarqués - Modules de FPGA, microcontrôleurs, microprocesseurs | Circuits intégrés (CI)

Référence	Fabricant	Description	paquet	Stock	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
CC-MX-PE47-ZM-B	Digi International	MOD WI-I.MX280128M FLASH 25/PK Module/Board Type: MPU Core Core Processor: ARM926EJ-S i.mx287 Co-Processor: - Speed: 454MHz Flash Size: 128MB RAM Size: 128MB Connector Type: Edge Connector - 52 Size / Dimension: 2" x 1.38" (51mm x 35mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock3 024	ARM926EJ-S i.mx287	-	454MHz	128MB	128MB	Edge Connector - 52	2" x 1.38" (51mm x 35mm)	-40°C ~ 85°C
101-0522	Digi International	MODULE RABBITCORE RCM3220 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 44.2MHz Flash Size: 512KB RAM Size: 768KB Connector Type: 2 IDC Headers 2x17 Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock6 784	Rabbit 3000	-	44.2MHz	512KB	768KB	2 IDC Headers 2x17	1.85" x 2.73" (47mm x 69mm)	0°C ~ 70°C
CENGLH7A404-11-504HCR-B	Logic	CARD ENGINE 64MB SDRAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A404 Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock4 640	ARM922T, LH7A404	-	200MHz	32MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
CENGLH79520-10-403HCR-A	Logic	CARD ENGINE 32MB SDRAM Module/Board Type: MPU Core Core Processor: ARM720T, LH79520 Co-Processor: - Speed: 77.4MHz Flash Size: 16MB RAM Size: 32MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock4 400	ARM720T, LH79520	-	77.4MHz	16MB	32MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
DC-ME-Y402-LX-B	Digi International	ME 9210 8MB RAM 4MB FLASH LINUX Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9210 Co-Processor: - Speed: 75MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 80°C	paquet: -	Stock5 696	ARM926EJ-S, NS9210	-	75MHz	4MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 80°C
DC-ME-Y402-C-B	Digi International	ME 9210 8MB SDRAM 4MB FLASH 50PK Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9210 Co-Processor: - Speed: 75MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 80°C	paquet: -	Stock2 016	ARM926EJ-S, NS9210	-	75MHz	4MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 80°C
20-101-1194	Digi International	MODULE RABBITCORE RCM3309 ROHS Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 44.2MHz Flash Size: 512KB (Internal), 8MB (External) RAM Size: 1MB Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5 Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock3 184	Rabbit 3000	-	44.2MHz	512KB (Internal), 8MB (External)	1MB	2 IDC Headers 2x17, 1 IDC Header 2x5	1.85" x 2.73" (47mm x 69mm)	-40°C ~ 85°C
5CSX-H6-42A-RI	Critical Link LLC	MITYSOM-5CSX W/ ALTERA CYCLONE V Module/Board Type: MPU, FPGA Core Core Processor: ARM? Cortex?-A9, Cyclone V SX/SE Co-Processor: NEON SIMD Speed: 800MHz Flash Size: 32MB RAM Size: 1.25GB Connector Type: Edge Connector Size / Dimension: 3.2" x 1.5" (82mm x 39mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock3 600	ARM? Cortex?-A9, Cyclone V SX/SE	NEON SIMD	800MHz	32MB	1.25GB	Edge Connector	3.2" x 1.5" (82mm x 39mm)	-40°C ~ 85°C
100-1500-1	Bluetechnix GmbH	MODULE QSEVEN-I.MX537 Module/Board Type: MPU Core Core Processor: i.MX537 Co-Processor: - Speed: 800MHz Flash Size: 2GB (NAND), 4MB (NOR) RAM Size: 1GB Connector Type: Qseven Card-Edge 230 Size / Dimension: 2.76" x 2.76" (70mm x 70mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock4 096	i.MX537	-	800MHz	2GB (NAND), 4MB (NOR)	1GB	Qseven Card-Edge 230	2.76" x 2.76" (70mm x 70mm)	-40°C ~ 85°C
SOMOMAP3530-21-1780AGIR	Logic	SYSTEM ON MODULE LV OMAP3530 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, OMAP3530 Co-Processor: - Speed: 600MHz Flash Size: 512MB RAM Size: 256MB Connector Type: Board-to-Board (BTB) Socket - 200 Size / Dimension: 0.59" x 1.06" (15mm x 27mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock4 544	ARM? Cortex?-A8, OMAP3530	-	600MHz	512MB	256MB	Board-to-Board (BTB) Socket - 200	0.59" x 1.06" (15mm x 27mm)	-40°C ~ 85°C
MOD5272-100IR	NetBurner Inc.	PROCESSOR MODULE FLASH MOD5272 Module/Board Type: MCU, Ethernet Core Core Processor: ColdFire 5272 Co-Processor: - Speed: 62MHz Flash Size: 2MB RAM Size: 8.004MB Connector Type: RJ-45, 2x50 Header Size / Dimension: 2.6" x 2" (66.04mm x 50.8mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock6 320	ColdFire 5272	-	62MHz	2MB	8.004MB	RJ-45, 2x50 Header	2.6" x 2" (66.04mm x 50.8mm)	-40°C ~ 85°C
20-101-1320	Digi International	MODULE MINICORE RCM6750 Module/Board Type: MPU Core Core Processor: Rabbit 6000 Co-Processor: - Speed: 162.5MHz Flash Size: 4MB RAM Size: 1.032MB (Internal), 1MB (External) Connector Type: Edge Connector - 52 Size / Dimension: 1.2" x 2" (30mm x 51mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock7 488	Rabbit 6000	-	162.5MHz	4MB	1.032MB (Internal), 1MB (External)	Edge Connector - 52	1.2" x 2" (30mm x 51mm)	-40°C ~ 85°C
BS1-IC	Parallax Inc.	BASIC STAMP I MODULE Module/Board Type: MCU Core Core Processor: PIC16C56A Co-Processor: - Speed: 4MHz Flash Size: 256B EEPROM RAM Size: 16B Connector Type: - Size / Dimension: 1.4" x 0.6" (35.6mm x 15.2mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock6 456	PIC16C56A	-	4MHz	256B EEPROM	16B	-	1.4" x 0.6" (35.6mm x 15.2mm)	0°C ~ 70°C
DC-ME4-01T-DYN	Digi International	MODULE DIGI CONNECT ME Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock2 656	ARM7TDMI, NS7520	-	55MHz	4MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
DC-EM-02T	Digi International	MODULE EM CUSTOMIZABLE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Stock6 016	-	-	-	-	-	-	-	-
SOMOMAP3530-12-1783IFXR	Logic	SOM OMAP3530 SOM-LV TY Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Stock4 336	-	-	-	-	-	-	-	-
DLP-FR256	DLP Design Inc.	MICROCONTROLLER FERROELECTRIC Module/Board Type: MCU Core Core Processor: 16-Bit RISC Co-Processor: - Speed: 16MHz Flash Size: 256KB FRAM RAM Size: 8K x 8 Connector Type: USB - B Size / Dimension: 2.22" x 0.9" (56.4mm x 22.9mm) Operating Temperature: -	paquet: -	Stock5 296	16-Bit RISC	-	16MHz	256KB FRAM	8K x 8	USB - B	2.22" x 0.9" (56.4mm x 22.9mm)	-
TE0803-03-4BE11-A	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 85°C	paquet: -	Stock3 568	Zynq UltraScale+ XCZU4EG-1SFVC784E	-	-	128MB	2GB	B2B	2.05" x 2.99" (52mm x 76mm)	0°C ~ 85°C
TE0803-03-4AE11-A	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 85°C	paquet: -	Stock6 816	Zynq UltraScale+ XCZU4EG-1SFVC784E	-	-	128MB	2GB	B2B	2.05" x 2.99" (52mm x 76mm)	0°C ~ 85°C
TE0741-05-G2C-1-A	Trenz Electronic GmbH	MODULE FPGA KINTEX Module/Board Type: FPGA Core Processor: Xilinx Kintex-7 FPGA XC7K410T-2FBG676C Co-Processor: - Speed: - Flash Size: 32MB RAM Size: - Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Request a Quote	Xilinx Kintex-7 FPGA XC7K410T-2FBG676C	-	-	32MB	-	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
CYCLONE-10-LP	Intel	PROTOTYPE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Request a Quote	-	-	-	-	-	-	-	-
TE0820-03-2AI21FA	Trenz Electronic GmbH	MOD MPSOC Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784I Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	Zynq UltraScale+ XCZU2CG-1SFVC784I	-	-	128MB	2GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0820-03-3BE21FA	Trenz Electronic GmbH	MOD MPSOC Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	paquet: -	Request a Quote	Zynq UltraScale+ XCZU3EG-1SFVC784E	-	-	128MB	2GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
TE0715-04-30-3E	Trenz Electronic GmbH	IC SOC MODULE 1GB DDR3L Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7030) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7030)	125MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
A10S-P8-A5E-RI-SB	Critical Link LLC	ARRIA 10 SOC MODULE, 270KLE, 6GB Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A9 Co-Processor: NEON™ SIMD Speed: 1.2GHz Flash Size: - RAM Size: 4GB Connector Type: Board-to-Board (BTB) Size / Dimension: 4.000" L x 4.000" W (101.50mm x 101.50mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock51	ARM® Cortex®-A9	NEON™ SIMD	1.2GHz	-	4GB	Board-to-Board (BTB)	4.000" L x 4.000" W (101.50mm x 101.50mm)	-40°C ~ 85°C
MYC-CZU5EV-V2-4E4D-1200-I	MYIR Tech Limited	MYC-CZU5EV-V2 CPU Module Module/Board Type: MCU, Ethernet Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E / XCZU4EV-1SFVC784I/ XCZU5EV-2SFVC784I Speed: 2.4GHz Flash Size: 4GB eMMC, 128MB QSPI RAM Size: 4GB Connector Type: Pin(s) Size / Dimension: 2.362" L x 2.047" W (60.00mm x 52.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E / XCZU4EV-1SFVC784I/ XCZU5EV-2SFVC784I	2.4GHz	4GB eMMC, 128MB QSPI	4GB	Pin(s)	2.362" L x 2.047" W (60.00mm x 52.00mm)	-40°C ~ 85°C
TE0741-04-A2C-1-A	Trenz Electronic GmbH	MODULE FPGA KINTEX Module/Board Type: FPGA Core Core Processor: Xilinx Kintex-7 FPGA XC7K70T-2FBG676C Co-Processor: - Speed: - Flash Size: 32MB RAM Size: - Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Request a Quote	Xilinx Kintex-7 FPGA XC7K70T-2FBG676C	-	-	32MB	-	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
SOMIMX8MMQ-11-1BE4SMIR	Beacon EmbeddedWorks	IC MOD I.MX 8M MINI QUAD 4GB Module/Board Type: MCU Core Core Processor: ARM® Cortex™-A53, ARM® Cortex™-M4 Co-Processor: - Speed: 1.8GHz, 400MHz Flash Size: - RAM Size: 4GB Connector Type: USB Size / Dimension: 1.100" L x 1.500" W (28.00mm x 38.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	ARM® Cortex™-A53, ARM® Cortex™-M4	-	1.8GHz, 400MHz	-	4GB	USB	1.100" L x 1.500" W (28.00mm x 38.00mm)	-40°C ~ 85°C

CC-MX-PE47-ZM-B

Digi International

MOD WI-I.MX280128M FLASH 25/PK

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S i.mx287
Co-Processor: -
Speed: 454MHz
Flash Size: 128MB
RAM Size: 128MB
Connector Type: Edge Connector - 52
Size / Dimension: 2" x 1.38" (51mm x 35mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock3 024

ARM926EJ-S i.mx287

-

454MHz

128MB

Edge Connector - 52

2" x 1.38" (51mm x 35mm)

-40°C ~ 85°C

101-0522

Digi International

MODULE RABBITCORE RCM3220

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 44.2MHz
Flash Size: 512KB
RAM Size: 768KB
Connector Type: 2 IDC Headers 2x17
Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock6 784

Rabbit 3000

-

44.2MHz

512KB

768KB

2 IDC Headers 2x17

1.85" x 2.73" (47mm x 69mm)

0°C ~ 70°C

CENGLH7A404-11-504HCR-B

Logic

CARD ENGINE 64MB SDRAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A404
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock4 640

ARM922T, LH7A404

-

200MHz

32MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

CENGLH79520-10-403HCR-A

Logic

CARD ENGINE 32MB SDRAM

Module/Board Type: MPU Core
Core Processor: ARM720T, LH79520
Co-Processor: -
Speed: 77.4MHz
Flash Size: 16MB
RAM Size: 32MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock4 400

ARM720T, LH79520

-

77.4MHz

16MB

32MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

DC-ME-Y402-LX-B

Digi International

ME 9210 8MB RAM 4MB FLASH LINUX

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9210
Co-Processor: -
Speed: 75MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 80°C

paquet: -

Stock5 696

ARM926EJ-S, NS9210

-

75MHz

4MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 80°C

DC-ME-Y402-C-B

Digi International

ME 9210 8MB SDRAM 4MB FLASH 50PK

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9210
Co-Processor: -
Speed: 75MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 80°C

paquet: -

Stock2 016

ARM926EJ-S, NS9210

-

75MHz

4MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 80°C

20-101-1194

Digi International

MODULE RABBITCORE RCM3309 ROHS

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 44.2MHz
Flash Size: 512KB (Internal), 8MB (External)
RAM Size: 1MB
Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5
Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock3 184

Rabbit 3000

-

44.2MHz

512KB (Internal), 8MB (External)

1MB

2 IDC Headers 2x17, 1 IDC Header 2x5

1.85" x 2.73" (47mm x 69mm)

-40°C ~ 85°C

5CSX-H6-42A-RI

Critical Link LLC

MITYSOM-5CSX W/ ALTERA CYCLONE V

Module/Board Type: MPU, FPGA Core
Core Processor: ARM? Cortex?-A9, Cyclone V SX/SE
Co-Processor: NEON SIMD
Speed: 800MHz
Flash Size: 32MB
RAM Size: 1.25GB
Connector Type: Edge Connector
Size / Dimension: 3.2" x 1.5" (82mm x 39mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock3 600

ARM? Cortex?-A9, Cyclone V SX/SE

NEON SIMD

800MHz

32MB

1.25GB

Edge Connector

3.2" x 1.5" (82mm x 39mm)

-40°C ~ 85°C

100-1500-1

Bluetechnix GmbH

MODULE QSEVEN-I.MX537

Module/Board Type: MPU Core
Core Processor: i.MX537
Co-Processor: -
Speed: 800MHz
Flash Size: 2GB (NAND), 4MB (NOR)
RAM Size: 1GB
Connector Type: Qseven Card-Edge 230
Size / Dimension: 2.76" x 2.76" (70mm x 70mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock4 096

i.MX537

-

800MHz

2GB (NAND), 4MB (NOR)

1GB

Qseven Card-Edge 230

2.76" x 2.76" (70mm x 70mm)

-40°C ~ 85°C

SOMOMAP3530-21-1780AGIR

Logic

SYSTEM ON MODULE LV OMAP3530

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, OMAP3530
Co-Processor: -
Speed: 600MHz
Flash Size: 512MB
RAM Size: 256MB
Connector Type: Board-to-Board (BTB) Socket - 200
Size / Dimension: 0.59" x 1.06" (15mm x 27mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock4 544

ARM? Cortex?-A8, OMAP3530

-

600MHz

512MB

256MB

Board-to-Board (BTB) Socket - 200

0.59" x 1.06" (15mm x 27mm)

-40°C ~ 85°C

MOD5272-100IR

NetBurner Inc.

PROCESSOR MODULE FLASH MOD5272

Module/Board Type: MCU, Ethernet Core
Core Processor: ColdFire 5272
Co-Processor: -
Speed: 62MHz
Flash Size: 2MB
RAM Size: 8.004MB
Connector Type: RJ-45, 2x50 Header
Size / Dimension: 2.6" x 2" (66.04mm x 50.8mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock6 320

ColdFire 5272

-

62MHz

2MB

8.004MB

RJ-45, 2x50 Header

2.6" x 2" (66.04mm x 50.8mm)

-40°C ~ 85°C

20-101-1320

Digi International

MODULE MINICORE RCM6750

Module/Board Type: MPU Core
Core Processor: Rabbit 6000
Co-Processor: -
Speed: 162.5MHz
Flash Size: 4MB
RAM Size: 1.032MB (Internal), 1MB (External)
Connector Type: Edge Connector - 52
Size / Dimension: 1.2" x 2" (30mm x 51mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock7 488

Rabbit 6000

-

162.5MHz

4MB

1.032MB (Internal), 1MB (External)

Edge Connector - 52

1.2" x 2" (30mm x 51mm)

-40°C ~ 85°C

BS1-IC

Parallax Inc.

BASIC STAMP I MODULE

Module/Board Type: MCU Core
Core Processor: PIC16C56A
Co-Processor: -
Speed: 4MHz
Flash Size: 256B EEPROM
RAM Size: 16B
Connector Type: -
Size / Dimension: 1.4" x 0.6" (35.6mm x 15.2mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock6 456

PIC16C56A

-

4MHz

256B EEPROM

16B

-

1.4" x 0.6" (35.6mm x 15.2mm)

0°C ~ 70°C

DC-ME4-01T-DYN

Digi International

MODULE DIGI CONNECT ME

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock2 656

ARM7TDMI, NS7520

-

55MHz

4MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

DC-EM-02T

Digi International

MODULE EM CUSTOMIZABLE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Stock6 016

-

SOMOMAP3530-12-1783IFXR

Logic

SOM OMAP3530 SOM-LV TY

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Stock4 336

-

DLP-FR256

DLP Design Inc.

MICROCONTROLLER FERROELECTRIC

Module/Board Type: MCU Core
Core Processor: 16-Bit RISC
Co-Processor: -
Speed: 16MHz
Flash Size: 256KB FRAM
RAM Size: 8K x 8
Connector Type: USB - B
Size / Dimension: 2.22" x 0.9" (56.4mm x 22.9mm)
Operating Temperature: -

paquet: -

Stock5 296

16-Bit RISC

-

16MHz

256KB FRAM

8K x 8

USB - B

2.22" x 0.9" (56.4mm x 22.9mm)

-

TE0803-03-4BE11-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4EG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 85°C

paquet: -

Stock3 568

Zynq UltraScale+ XCZU4EG-1SFVC784E

-

128MB

2GB

B2B

2.05" x 2.99" (52mm x 76mm)

0°C ~ 85°C

TE0803-03-4AE11-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4EG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 85°C

paquet: -

Stock6 816

Zynq UltraScale+ XCZU4EG-1SFVC784E

-

128MB

2GB

B2B

2.05" x 2.99" (52mm x 76mm)

0°C ~ 85°C

TE0741-05-G2C-1-A

Trenz Electronic GmbH

MODULE FPGA KINTEX

Module/Board Type: FPGA
Core Processor: Xilinx Kintex-7 FPGA XC7K410T-2FBG676C
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: -
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Request a Quote

Xilinx Kintex-7 FPGA XC7K410T-2FBG676C

-

32MB

-

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

CYCLONE-10-LP

Intel

PROTOTYPE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Request a Quote

-

TE0820-03-2AI21FA

Trenz Electronic GmbH

MOD MPSOC

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784I
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Request a Quote

Zynq UltraScale+ XCZU2CG-1SFVC784I

-

128MB

2GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0820-03-3BE21FA

Trenz Electronic GmbH

MOD MPSOC

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

paquet: -

Request a Quote

Zynq UltraScale+ XCZU3EG-1SFVC784E

-

128MB

2GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

TE0715-04-30-3E

Trenz Electronic GmbH

IC SOC MODULE 1GB DDR3L

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7030)
Speed: 125MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Request a Quote

ARM Cortex-A9

Zynq-7000 (Z-7030)

125MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

A10S-P8-A5E-RI-SB

Critical Link LLC

ARRIA 10 SOC MODULE, 270KLE, 6GB

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A9
Co-Processor: NEON™ SIMD
Speed: 1.2GHz
Flash Size: -
RAM Size: 4GB
Connector Type: Board-to-Board (BTB)
Size / Dimension: 4.000" L x 4.000" W (101.50mm x 101.50mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock51

ARM® Cortex®-A9

NEON™ SIMD

1.2GHz

-

4GB

Board-to-Board (BTB)

4.000" L x 4.000" W (101.50mm x 101.50mm)

-40°C ~ 85°C

MYC-CZU5EV-V2-4E4D-1200-I

MYIR Tech Limited

MYC-CZU5EV-V2 CPU Module

Module/Board Type: MCU, Ethernet Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E / XCZU4EV-1SFVC784I/ XCZU5EV-2SFVC784I
Speed: 2.4GHz
Flash Size: 4GB eMMC, 128MB QSPI
RAM Size: 4GB
Connector Type: Pin(s)
Size / Dimension: 2.362" L x 2.047" W (60.00mm x 52.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Request a Quote

ARM® Cortex®-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E / XCZU4EV-1SFVC784I/ XCZU5EV-2SFVC784I

2.4GHz

4GB eMMC, 128MB QSPI

4GB

Pin(s)

2.362" L x 2.047" W (60.00mm x 52.00mm)

-40°C ~ 85°C

TE0741-04-A2C-1-A

Trenz Electronic GmbH

MODULE FPGA KINTEX

Module/Board Type: FPGA Core
Core Processor: Xilinx Kintex-7 FPGA XC7K70T-2FBG676C
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: -
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Request a Quote

Xilinx Kintex-7 FPGA XC7K70T-2FBG676C

-

32MB

-

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

SOMIMX8MMQ-11-1BE4SMIR

Beacon EmbeddedWorks

IC MOD I.MX 8M MINI QUAD 4GB

Module/Board Type: MCU Core
Core Processor: ARM® Cortex™-A53, ARM® Cortex™-M4
Co-Processor: -
Speed: 1.8GHz, 400MHz
Flash Size: -
RAM Size: 4GB
Connector Type: USB
Size / Dimension: 1.100" L x 1.500" W (28.00mm x 38.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Request a Quote

ARM® Cortex™-A53, ARM® Cortex™-M4

-

1.8GHz, 400MHz

-

4GB

USB

1.100" L x 1.500" W (28.00mm x 38.00mm)

-40°C ~ 85°C