Page 12 - Embarqués - Modules de FPGA, microcontrôleurs, microprocesseurs | Circuits intégrés (CI) | Heisener Electronics
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Embarqués - Modules de FPGA, microcontrôleurs, microprocesseurs

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Image
Référence
Fabricant
Description
paquet
Stock
Quantité
Core Processor
Co-Processor
Speed
Flash Size
RAM Size
Connector Type
Size / Dimension
Operating Temperature
SOMDM3730-30-1880AKIR
Logic

SYSTEM ON MODULE TORP

  • Module/Board Type: MPU, DSP Core
  • Core Processor: ARM? Cortex?-A8, DM3730
  • Co-Processor: TMS320C64x (DSP)
  • Speed: 800MHz
  • Flash Size: 512MB
  • RAM Size: 512MB
  • Connector Type: Board-to-Board (BTB) Socket - 200
  • Size / Dimension: 0.59" x 1.06" (15mm x 27mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Stock3 376
ARM? Cortex?-A8, DM3730
TMS320C64x (DSP)
800MHz
512MB
512MB
Board-to-Board (BTB) Socket - 200
0.59" x 1.06" (15mm x 27mm)
-40°C ~ 85°C
DC-SP-01R-C-W
Digi International

ADAPTER SP CUSTOMIZABLE MODEL

  • Module/Board Type: MPU Core
  • Core Processor: ARM7TDMI, NS7520
  • Co-Processor: -
  • Speed: 55MHz
  • Flash Size: 4MB
  • RAM Size: 16MB
  • Connector Type: RJ45
  • Size / Dimension: 3.88" x 1.68" (98.5mm x 42.7mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Stock7 600
ARM7TDMI, NS7520
-
55MHz
4MB
16MB
RJ45
3.88" x 1.68" (98.5mm x 42.7mm)
-40°C ~ 85°C
DC-ME-Y413-C-B
Digi International

MOD ME 9210 16MB SDRAM 8MB FLASH

  • Module/Board Type: MPU Core
  • Core Processor: ARM926EJ-S, NS9210
  • Co-Processor: -
  • Speed: 75MHz
  • Flash Size: 16MB
  • RAM Size: 8MB
  • Connector Type: RJ45
  • Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
  • Operating Temperature: -40°C ~ 80°C
paquet: -
Stock7 968
ARM926EJ-S, NS9210
-
75MHz
16MB
8MB
RJ45
1.45" x 0.75" (36.7mm x 19.1mm)
-40°C ~ 80°C
20-101-1307
Digi International

CORE MODULE RCM5760

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 5000
  • Co-Processor: -
  • Speed: 50MHz
  • Flash Size: 1MB (Internal), 2MB (External)
  • RAM Size: 128KB (Internal), 512KB (External)
  • Connector Type: Edge Connector - 52
  • Size / Dimension: 1.2" x 2" (30mm x 51mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Stock5 920
Rabbit 5000
-
50MHz
1MB (Internal), 2MB (External)
128KB (Internal), 512KB (External)
Edge Connector - 52
1.2" x 2" (30mm x 51mm)
-40°C ~ 85°C
20-101-1235
Digi International

CORE MODULE RCM5700

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 5000
  • Co-Processor: -
  • Speed: 50MHz
  • Flash Size: 1MB
  • RAM Size: 128KB
  • Connector Type: Edge Connector - 52
  • Size / Dimension: 1.2" x 2" (30mm x 51mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Stock4 128
Rabbit 5000
-
50MHz
1MB
128KB
Edge Connector - 52
1.2" x 2" (30mm x 51mm)
-40°C ~ 85°C
101-0521
Digi International

MODULE RABBITCORE RCM3210

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 3000
  • Co-Processor: -
  • Speed: 29.5MHz
  • Flash Size: 256KB
  • RAM Size: 128KB
  • Connector Type: 2 IDC Headers 2x17
  • Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
  • Operating Temperature: -40°C ~ 70°C
paquet: -
Stock3 408
Rabbit 3000
-
29.5MHz
256KB
128KB
2 IDC Headers 2x17
1.85" x 2.73" (47mm x 69mm)
-40°C ~ 70°C
CENGLH79524-10-403HC
Logic

CARD ENGINE 16MB FLASH 32MB RAM

  • Module/Board Type: MPU Core
  • Core Processor: ARM720T, LH79524
  • Co-Processor: -
  • Speed: 77.4MHz
  • Flash Size: 16MB
  • RAM Size: 32MB
  • Connector Type: SO-DIMM-144
  • Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Stock5 120
ARM720T, LH79524
-
77.4MHz
16MB
32MB
SO-DIMM-144
2.37" x 2.67" (60.2mm x 67.8mm)
0°C ~ 70°C
101-0950
Digi International

MODULE RABBITCORE RCM3370

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 3000
  • Co-Processor: -
  • Speed: 44.2MHz
  • Flash Size: 512KB
  • RAM Size: 1MB
  • Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5
  • Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
  • Operating Temperature: -40°C ~ 70°C
paquet: -
Stock2 096
Rabbit 3000
-
44.2MHz
512KB
1MB
2 IDC Headers 2x17, 1 IDC Header 2x5
1.85" x 2.73" (47mm x 69mm)
-40°C ~ 70°C
101-0497
Digi International

MODULAR RABBIT CORE OP6810

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 2000
  • Co-Processor: -
  • Speed: 22.1MHz
  • Flash Size: 256KB
  • RAM Size: 128KB
  • Connector Type: IDC Header 2x20
  • Size / Dimension: 2.6" x 3" (66mm x 76mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Stock7 856
Rabbit 2000
-
22.1MHz
256KB
128KB
IDC Header 2x20
2.6" x 3" (66mm x 76mm)
-40°C ~ 85°C
TE0712-02-100-2C3
Trenz Electronic GmbH

SOM ARTIX7 XC7A100T-2C 1GB LOPRO

  • Module/Board Type: FPGA
  • Core Processor: Artix-7 A100T
  • Co-Processor: -
  • Speed: 200MHz
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Stock3 872
Artix-7 A100T
-
200MHz
32MB
1GB
Samtec LSHM
1.97" x 1.57" (50mm x 40mm)
0°C ~ 70°C
CC-7U-Z111-Z1
Digi International

MODULE 7U 16MB SDRAM 2MB FLASH

  • Module/Board Type: MPU Core
  • Core Processor: ARM7TDMI, NS7520
  • Co-Processor: -
  • Speed: 55MHz
  • Flash Size: 2MB
  • RAM Size: 16MB
  • Connector Type: 48-DIP
  • Size / Dimension: 2.48" x 0.73" (62.9mm x 18.5mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Stock2 960
ARM7TDMI, NS7520
-
55MHz
2MB
16MB
48-DIP
2.48" x 0.73" (62.9mm x 18.5mm)
0°C ~ 70°C
CC-MX-L96C-Z1-1
Digi International

MOD WI-I.MX6

  • Module/Board Type: MPU Core
  • Core Processor: ARM? Cortex?-A9, i.MX6Quad
  • Co-Processor: -
  • Speed: 800MHz
  • Flash Size: 4GB
  • RAM Size: 512MB
  • Connector Type: -
  • Size / Dimension: 1.97" x 1.97" (50mm x 50mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Stock4 336
ARM? Cortex?-A9, i.MX6Quad
-
800MHz
4GB
512MB
-
1.97" x 1.97" (50mm x 50mm)
-40°C ~ 85°C
20-101-0453
Digi International

MODULE RABBITCORE RCM2300

  • Module/Board Type: MPU Core
  • Core Processor: Rabbit 2000
  • Co-Processor: -
  • Speed: 22.1MHz
  • Flash Size: 256KB
  • RAM Size: 128KB
  • Connector Type: 2 IDC Headers 2x26
  • Size / Dimension: 1.15" x 1.6" (29mm x 41mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Stock7 608
Rabbit 2000
-
22.1MHz
256KB
128KB
2 IDC Headers 2x26
1.15" x 1.6" (29mm x 41mm)
-40°C ~ 85°C
OSD3358-512M-ISM
Octavo Systems LLC

IC SIP ARM A8 21MM 256BGA

  • Module/Board Type: MPU Core
  • Core Processor: ARM® Cortex®-A8, AM3358
  • Co-Processor: NEON™ SIMD
  • Speed: 1GHz
  • Flash Size: -
  • RAM Size: 512MB
  • Connector Type: 256-BGA
  • Size / Dimension: 0.83" x 0.83" (21mm x 21mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Stock15 444
ARM® Cortex®-A8, AM3358
NEON™ SIMD
1GHz
-
512MB
256-BGA
0.83" x 0.83" (21mm x 21mm)
-40°C ~ 85°C
TE0820-03-03CG-1ED
Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 1GB 128MB

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU3CG-1SFVC784E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 1GB
  • Connector Type: B2B
  • Size / Dimension: 1.57" x 1.97" (40mm x 50mm)
  • Operating Temperature: 0°C ~ 85°C
paquet: -
Stock6 416
Zynq UltraScale+ XCZU3CG-1SFVC784E
-
-
128MB
1GB
B2B
1.57" x 1.97" (40mm x 50mm)
0°C ~ 85°C
TE0630-02IBF
Trenz Electronic GmbH

IC MOD SPARTAN-6 100MHZ 128MB

  • Module/Board Type: FPGA, USB Core
  • Core Processor: Spartan-6 LX-75
  • Co-Processor: Cypress EZ-USB FX2LP
  • Speed: 100MHz
  • Flash Size: 8MB
  • RAM Size: 128MB
  • Connector Type: B2B
  • Size / Dimension: 1.6" x 1.9" (40.5mm x 47.5mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Stock6 960
Spartan-6 LX-75
Cypress EZ-USB FX2LP
100MHz
8MB
128MB
B2B
1.6" x 1.9" (40.5mm x 47.5mm)
-40°C ~ 85°C
MRZG2LS-BAA
ARIES Embedded

SOM RZ/G2L

  • Module/Board Type: MCU Core
  • Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
  • Co-Processor: -
  • Speed: 1.5GHz
  • Flash Size: 4GB eMMC, 128MB (NOR)
  • RAM Size: 1GB
  • Connector Type: Pin(s)
  • Size / Dimension: 32.283" L x 19.685" W (820.00mm x 500.00mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Request a Quote
ARM® Cortex®-A55, ARM® Cortex®-M33
-
1.5GHz
4GB eMMC, 128MB (NOR)
1GB
Pin(s)
32.283" L x 19.685" W (820.00mm x 500.00mm)
-40°C ~ 85°C
TE0726-03-41C64-A
Trenz Electronic GmbH

IC MODULE ZYNQBERRY

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7010)
  • Speed: -
  • Flash Size: 16MB
  • RAM Size: 512MB
  • Connector Type: CSI, DSI
  • Size / Dimension: 1.180" L x 1.570" W (30.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 70°C
paquet: -
Request a Quote
ARM Cortex-A9
Zynq-7000 (Z-7010)
-
16MB
512MB
CSI, DSI
1.180" L x 1.570" W (30.00mm x 40.00mm)
0°C ~ 70°C
TE0630-03-63I22-A
Trenz Electronic GmbH

IC MOD SPARTAN-6 100MHZ 128MB

  • Module/Board Type: -
  • Core Processor: -
  • Co-Processor: -
  • Speed: -
  • Flash Size: -
  • RAM Size: -
  • Connector Type: -
  • Size / Dimension: -
  • Operating Temperature: -
paquet: -
Request a Quote
-
-
-
-
-
-
-
-
ME-XU8-7EV-2I-D12E-R2-2
Enclustra FPGA Solutions

SOM ZYNQ XU8 US+ ZU7EV

  • Module/Board Type: MPU, FPGA Core
  • Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
  • Co-Processor: -
  • Speed: 533MHz, 1.333GHz
  • Flash Size: 16GB
  • RAM Size: 4GB
  • Connector Type: 168 Pin
  • Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Request a Quote
ARM® Cortex®-A53, ARM® Cortex®-R5
-
533MHz, 1.333GHz
16GB
4GB
168 Pin
2.910" L x 2.130" W (74.00mm x 54.00mm)
-40°C ~ 85°C
TE0710-02-72I21-A
Trenz Electronic GmbH

MOD FPGA ARTIX7 100T 512MB 78BGA

  • Module/Board Type: FPGA Core
  • Core Processor: Artix-7 A100T
  • Co-Processor: -
  • Speed: 100MHz
  • Flash Size: 32MB
  • RAM Size: 512MB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Request a Quote
Artix-7 A100T
-
100MHz
32MB
512MB
Samtec LSHM
1.970" L x 1.570" W (50.00mm x 40.00mm)
-40°C ~ 85°C
TE0715-04-51I33-L
Trenz Electronic GmbH

IC SOC MODULE 1GB DDR3L

  • Module/Board Type: MCU, FPGA
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Zynq-7000 (Z-7015)
  • Speed: 125MHz
  • Flash Size: 32MB
  • RAM Size: 1GB
  • Connector Type: Samtec LSHM
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Request a Quote
ARM Cortex-A9
Zynq-7000 (Z-7015)
125MHz
32MB
1GB
Samtec LSHM
1.970" L x 1.570" W (50.00mm x 40.00mm)
-40°C ~ 85°C
TE0803-03-3BE11-AS
Trenz Electronic GmbH

MODULE SOM TE0803-03

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: B2B
  • Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature: 0°C ~ 85°C
paquet: -
Request a Quote
Zynq UltraScale+ XCZU3EG-1SFVC784E
-
-
128MB
2GB
B2B
2.050" L x 2.990" W (52.00mm x 76.00mm)
0°C ~ 85°C
TE0820-05-3BE21ML
Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

  • Module/Board Type: MPU Core
  • Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
  • Co-Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 2GB
  • Connector Type: Pin(s)
  • Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature: 0°C ~ 85°C
paquet: -
Request a Quote
ARM® Cortex®-A53, ARM® Cortex®-R5
Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E
-
128MB
2GB
Pin(s)
1.970" L x 1.570" W (50.00mm x 40.00mm)
0°C ~ 85°C
6231-IX-XXA-RI
Critical Link LLC

SOM WITH TI SITARA AM6231, 1GHZ,

  • Module/Board Type: MPU Core
  • Core Processor: ARM® Cortex®-A53
  • Co-Processor: NEON SIMD
  • Speed: 800MHz
  • Flash Size: -
  • RAM Size: 1GB
  • Connector Type: SO-DIMM-260
  • Size / Dimension: 2.740" L x 1.500" W (69.60mm x 38.10mm)
  • Operating Temperature: -40°C ~ 85°C
paquet: -
Request a Quote
ARM® Cortex®-A53
NEON SIMD
800MHz
-
1GB
SO-DIMM-260
2.740" L x 1.500" W (69.60mm x 38.10mm)
-40°C ~ 85°C
TE0745-03-93E31-A
Trenz Electronic GmbH

SOM WITH AMD ZYNQ 7045-3E, 1 GBY

  • Module/Board Type: MPU Core
  • Core Processor: ARM Cortex-A9
  • Co-Processor: Xilinx Zynq 7045 SoC XC7Z045-3FFG676E
  • Speed: -
  • Flash Size: 64MB
  • RAM Size: 1GB
  • Connector Type: Samtec ST5
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: 0°C ~ 85°C
paquet: -
Request a Quote
ARM Cortex-A9
Xilinx Zynq 7045 SoC XC7Z045-3FFG676E
-
64MB
1GB
Samtec ST5
2.990" L x 2.050" W (76.00mm x 52.00mm)
0°C ~ 85°C
TE0818-02-9BE81-A
Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH AMD

  • Module/Board Type: MPU Core
  • Core Processor: Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: Board-to-Board (BTB) Socket - 4 x 240
  • Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature: 0°C ~ 85°C
paquet: -
Request a Quote
Xilinx Zynq UltraScale+ XCZU9EG-1FFVC900E
-
-
128MB
4GB
Board-to-Board (BTB) Socket - 4 x 240
2.990" L x 2.050" W (76.00mm x 52.00mm)
0°C ~ 85°C
TE0808-04-9BE21-A
Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 4GB 128MB

  • Module/Board Type: MPU Core
  • Core Processor: Zynq UltraScale+ XCZU9EG-1FFVC900E
  • Co-Processor: -
  • Speed: -
  • Flash Size: 128MB
  • RAM Size: 4GB
  • Connector Type: B2B
  • Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature: 0°C ~ 85°C
paquet: -
Request a Quote
Zynq UltraScale+ XCZU9EG-1FFVC900E
-
-
128MB
4GB
B2B
2.050" L x 2.990" W (52.00mm x 76.00mm)
0°C ~ 85°C