Page 2 - Les dernières technologies de Nexperia USA Inc. | Heisener Electronics
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Les dernières technologies de Nexperia USA Inc.

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Technology Cover

2022-03-05, The circuit board simplifies the prototyping of ultra-low power wireless networks

NeoCortec has launched a series of ground-breaking prototypes and development boards that provide a simple and easy way for designers to start working with NeoMESH. These modules address the broad application of iot and cloud-based sensor networks, integrating smart homes and smart workplaces, metrology, security, agriculture, transportation, industry 4.0, healthcare and food distribution. The new splitter board provides easy access to GPIO to simplify customization

Technology Cover

2022-03-03, Two new high temperature film capacitors are released

New Yorker Electronics now offers two new Electrocube high temperature film capacitors for very high temperature applications. The equipment is specially designed and optimized for ac and pulse signals in high-temperature applications. The two new series feature extended electrode construction and standard tin-plated, oxygen-free solid copper leads, with most units available in BOTH RoHS and non-RoHS. They can be used at frequencies up to 100kHz and at temperatures ranging from -55℃ to +150℃ without derating

Technology Cover

2021-11-03, Zener Diode combination extends battery time and saves PCB space

Nexperia offers A range of low current stabilized diodes, 50µA Zener diodes and three different SMD package options, providing customers with greater choice and flexibility. An additional 40 new types per package options cover nominal operating voltages from 1.8V to 75V, meeting the q combination component requirements

Technology Cover

2020-02-05, Nexperia - Low RDS(on) MOSFET performance sets a new standard

Nexperia has released its lowest-ever RDS(on) power MOSFET. The PSMNR51-25YLH sets a new standard of 0.57mOhm at 25V. Employing the company's NextPowerS3 technology, this excellent performance is provided without compromising other important parameters such as maximum drain current (ID(max)), SOA or gate charge QG.

Technology Cover

2018-10-03, Nexperia - Small logic package can be used without a step-down mask

Nexperia has released the four-pin X2SON4 package which is claimed to be the smallest logic package that can be used without necessitating an expensive and fragile step-down mask. Consequently, PCB assembly is easier, quicker, more reliable and more cost-effective.