Amphenol Advanced Sensors GE-1920 are HVAC refrigerant temperature sensors which measure the refrigerant temperature at both the high and low pressure side of the line.
Cypress Semiconductor has introduced a new kit with a complete reference design for a tiny, battery-free sensor beacon for a broad range of fast-growing Internet of Things (IoT) applications.
The new 16-bit AD9162 digital-to-analog converter (DAC) from Analog Devices. Announced at the 2016 IEEE International Microwave Symposium (IMS), the device is a high-performance radio frequency (RF) DAC that supports data rates up to 6 gigasamples per second (GSPS) and update rates up to 12GSPS.
The Maxim MAX31912 ultra-low power translator/serialisers are an industrial interface serialiser that translates, conditions, and serialises the 24V digital output of sensors and switches.
Intersil has announced the adoption of the company’s ISL91110 switching regulators in Huawei’s new P9 smartphone.
The Texas Instruments FDC2x1x-Q1 is a multi-channel family of noise and EMI-resistant, high-resolution, high-speed capacitance-to-digital converters for implementing capacitive sensing solutions.
Analog Devices has introduced a low power, high-performance radio transceiver for battery-powered applications. It enables more reliable wireless radio connections with fewer retries and packet losses as well as longer battery lifetime.
Microchip has announced two next-generation Bluetooth Low Energy (BLE) solutions with an easy-to-use ASCII-style command interface that makes the devices easy to configure and eliminates any complicated code compiling.
Texas Instruments’ TPS61021A provides a power supply solution for portable or smart devices powered by alkaline, NiMH, Li-Mn, or Li-ion batteries.
The Murata LBWA1ZV1CD Wi-Fi Module is a smart module that provides connectivity to the internet via Wi-Fi with embedded OS that works with the Electric Imp cloud service.
The Littelfuse SP814x diode array 1.0pF 22KV integrates 4 or 6 channels of ultra low capacitance rail-to-rail diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharge (ESD).
Molex Pico-Clasp wire-to-board connectors are claimed to be the smallest pitch (1mm) wire-to-board connectors with positive lock.
JAE Electronics DX07 Series USB Type-C connectors are compatible with the next generation USB Type-C specifications.
Optimized to deliver a low forward-voltage drop in a small form factor while maintaining low reverse-current leakage, the SBRT3M40P1 Trench Super Barrier Rectifier (SBR) has been introduced by Diodes Incorporated.
Luminus Devices SST-10 infrared LEDs have a high power density and uniform emission with excellent wall-plug efficiencies.
Amphenol Pcd µCom-10Gb+ Series is designed to meet the need for miniaturised connectors with rapid transmission speeds and high resistance to environmental extremes and now includes a push pull version.
Microsemi has announced availability of the RTG4 Development Kit featuring its recently announced RTG4 PROTO field programmable gate arrays (FPGAs).
Silicon Labs CP21xx Smart Interface ICs leverage the company’s world-class mixed-signal design expertise to provide a family of high-performance interface devices that enable designers to differentiate their products and speed time-to-market.
