Vishay Intertechnology, Inc. has released a new low-spec, AEC-Q200 qualified DC-Link metallized polypropylene film capacitor. Automotive class capacitors are available in four building heights - 12mm, 15mm, 18mm and 24mm - and 12 standard sizes to choose from. MKP1848Se dc-link capacitors offer rated capacitance from 1 μ F to 75 μ F with ESR down to 3mOhm
Microchip Technologies announces manufacturing eligibility for the MPFS250T and the previously announced MPFS025T. OlarFire SoC FPgas offer new configurable processing opportunities with a rugged real-time, Linux-enabled RISC-V microprocessor subsystem on fast FPGA architectures, supporting the company's commitment to product roadmap and long-term availability. The ecosystem is equally important for risC-V adoption, which spans a wide variety of IPS, hardware, operating systems, debuggers, middleware, compilers, and design services.
The new Intel Sharp A380 graphics card brings next-generation technology to mainstream gamers and content creators.
Advantech has released the WIS-2410X explosion-proof LoRaWAN wireless condition monitoring sensor. It provides triaxial vibration detection and equipment temperature 24 hours, and complies with ISO 10816 standards to facilitate successful predictive maintenance. The device offers an integrated ARM Cortex-M4 processor, LoRa transceiver, triaxial accelerometer, and temperature sensor. The device is a plug-and-play solution powered by an internal 3.6V AA battery using company-proven LPWAN technology.
PVL has introduced a new line of IO-Link sensors for deployment in Industry 4.0. What the new sensors have in common is the combination of the IO-Link protocol for point-to-point communication between compatible IO systems and field devices. Io-link communication offers many advantages, including the possibility of using standard unshielded three-wire cables, advanced diagnostics and increased data availability, remote configuration and monitoring, and simplified equipment replacement
TDK has introduced tdK-Lambda PXD40 and PXD60 series 40W and 60W DC-DC converters. These latest models offer single output of 3.3,5,12,15,24, and 48V, or ±12, ±15, and ±24V dual output voltages. The device measures 2 "x 1" x 0.4 "(50.8mm x 25.4mm x 10.2mm) and can operate at temperatures from -40 ° C to +105C.
Renesas high-performance RZ/T2M motor control microprocessors for AC servo drives and industrial robots. The microprocessor consists of two Arm cortex-r52 cores and operates at a maximum frequency of 800MHz. In addition, for major industrial networking protocols such as EtherCAT, PROFINET RT and EtherNet/IP, the company has added support for the PROFINET IRT protocol to RZ/T2M.
The global semiconductor industry productivity crisis suffered in the past two years, lead to all sorts of chips are appeared out of stock, the price situation, influence the automotive, consumer electronics and other industries, originally supply will be improved significantly in the second half of 2022 chip, TSMC suddenly spread bad news at this time, however, warn customer productivity than expected next year, the year after next.
Car charger is a charging accessory that every car owner will not be unfamiliar with. If you want to charge your mobile phone in the car, it depends on it. Many charging brands have launched a variety of car chargers to provide consumers with sufficient choices. BMW also launched a series of car charger products, with single USB-A port, dual USB-A port and 1A1C three interface configurations.
ASIL certification has become the admittance rule for automotive supply chain manufacturers. In particular, if IC practitioners want to enter the field of automotive electronics and produce chip products in the field of vehicle functional safety, they must pass ASIL certification before being adopted by vehicle enterprises and Tier1.
Japan will cooperate with the United States to mass-produce 2-nanometer chips locally as early as 2025
Intel reiterated that it is consolidating its roadmap for high-performance CPUs and GPUs as it moves to newer manufacturing processes and packaging technologies in the coming years. The company is combining the CPU and GPU lineups into a single chip (code-named Falcon Shores), which Intel calls the XPU.
The GT308L offers eight LED drivers and a 16-step light controller. For the touch output result, it can be used through I2C or 1:1 direct output interface. I2C interfaces may be useful for MCU IO or applications where connector resources are insufficient. The GT308L can be used in a wide supply voltage range of 2.5V to 5.5V.
Apple unveiled a new M2 chip with a second-generation 5nm process and 20 billion transistors. Apple compared its performance to that of the previous M1 model and the i5-8210Y MacBook from years ago.
Infineon Technologies inc. has released the new 1700 V TRENCHSTOP™ IGBT7 module in the EconoDUAL™ 3 standard industrial package. With this new chip technology, the EconoDUAL 3 module delivers industry-leading 900 A and 750 A current ratings to further extend the power range of the inverter. The module can be widely used in wind power, motor drive and static reactive power generator (SVG) applications.
Schurter has introduced the new 4750 series IEC Strip block, IEC connector Type F, to meet the highly specific power distribution needs of data centers. The series power supplies are neatly arranged and compactly combined with functions, saving space in dense PDUs. The series is rated for international safety under IEC/CCC at 10A / 250 VAC 50Hz and UL at 15A / 250 VAC 60Hz. Available in black, grey and white.
Murata introduced the small RAIN RFID tag at Pharmapack in Europe. Tags are created to provide unique identifiers that allow RFID readers to determine the identity and authenticity of items in healthcare applications. The company integrated the antenna in a multi-layer ceramic substrate to produce a small, robust RFID tag capable of automatic identification and batch reading in excess of 400 units/min to improve throughput efficiency.
Ams OSRAM AS7056 and AS7057 Medical and health sensors, currently available in Mouser, are the next generation OF AFE vital signs sensors. The sensor is optimized to support space-constrained applications such as in-ear vital sign monitoring. They were placed in a WLCSP.
