Infineon launches EconoDUAL™ 3 module based on 1700 V TRENCHSTOP™ IGBT7 chip | Heisener Electronics
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Infineon launches EconoDUAL™ 3 module based on 1700 V TRENCHSTOP™ IGBT7 chip

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Date de Parution: 2022-06-13, Infineon Technologies

     Infineon Technologies AG recently released a new 1700 V TRENCHSTOP™ IGBT7 module in EconoDUAL™ 3 standard industrial package. With this new chip technology, EconoDUAL 3 modules offer industry-leading current ratings of 900 A and 750 A, further extending the power range of the inverter. The module can be widely used in applications such as wind power, motor drives and static var generators (SVG).

     Compared with past modules using IGBT4 chipset, the FF900R17ME7_B11 module based on TRENCHSTOP IGBT7 chip can increase the output current value of the inverter by 40% under the same package size. The new 1700 V IGBT7 modules also significantly reduce static and dynamic losses, while addressing the high static losses common to diode chips in many applications. In addition, this new chip technology enhances du/dt controllability and improves diode softness. Under the influence of cosmic rays, the FIT rate is also significantly reduced - an important parameter when operating at HVDC bus voltages. Not only that, the maximum overload junction temperature of this new power module is 175°C.

        The industry-leading 1700 V EconoDUAL 3 modules are available in two current classes, 900 A and 750 A, with the 750 A module using larger diodes to further increase the flexibility of the product portfolio. Overall, the new 1700V EconoDUAL3 module with TRENCHSTOP IGBT 7 chip can improve the power density of the inverter and achieve a comprehensive improvement in the performance level in a variety of application scenarios.

       FF900R17ME7_B11, FF750R17ME7D_B11 and FF225R17ME7_B11 are now available for ordering. The product portfolio will continue to expand, and follow-up products (especially those with current ratings between 300 A and 750 A) will be launched by the end of 2022.

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