Produits Xilinx Inc.

XC17S200APDG8C

Xilinx Inc.

IC PROM SER 200K C-TEMP 8-DIP

• Programmable Type: OTP
• Memory Size: 2Mb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

paquet: 8-DIP (0.300", 7.62mm)

XC17512LPC20I

Xilinx Inc.

IC PROM SER I-TEMP 512K 20-PLCC

• Programmable Type: OTP
• Memory Size: 512kb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-LCC (J-Lead)
• Supplier Device Package: 20-PLCC (9x9)

paquet: 20-LCC (J-Lead)

XC17512LPC20C

Xilinx Inc.

IC PROM SER C-TEMP 512K 20-PLCC

• Programmable Type: OTP
• Memory Size: 512kb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 20-LCC (J-Lead)
• Supplier Device Package: 20-PLCC (9x9)

paquet: 20-LCC (J-Lead)

XCZU15EG-1FFVB1156E

Xilinx Inc.

IC FPGA 328 I/O 1156FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 747K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

paquet: 1156-BBGA, FCBGA

XCZU7EG-L1FBVB900I

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

paquet: 900-BBGA, FCBGA

XCZU4EG-1FBVB900E

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

paquet: 900-BBGA, FCBGA

XQ3S700A-DIE0628

Xilinx Inc.

IC SPARTAN-3E FPGA 700K DIE

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: -
• Total RAM Bits: -
• Number of I/O: -
• Number of Gates: -
• Voltage - Supply: -
• Mounting Type: Surface Mount
• Operating Temperature: -
• Package / Case: Die
• Supplier Device Package: Die

paquet: Die

XCV200-4BG256I

Xilinx Inc.

IC FPGA 180 I/O 256BGA

• Number of LABs/CLBs: 1176
• Number of Logic Elements/Cells: 5292
• Total RAM Bits: 57344
• Number of I/O: 180
• Number of Gates: 236666
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (27x27)

paquet: 256-BBGA

XC4044XL-3HQ160I

Xilinx Inc.

IC FPGA 129 I/O 160HQFP

• Number of LABs/CLBs: 1600
• Number of Logic Elements/Cells: 3800
• Total RAM Bits: 51200
• Number of I/O: 129
• Number of Gates: 44000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 160-BQFP Exposed Pad
• Supplier Device Package: 160-PQFP (28x28)

paquet: 160-BQFP Exposed Pad

XC4044XL-3BG432I

Xilinx Inc.

IC FPGA 320 I/O 432MBGA

• Number of LABs/CLBs: 1600
• Number of Logic Elements/Cells: 3800
• Total RAM Bits: 51200
• Number of I/O: 320
• Number of Gates: 44000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 432-LBGA, Metal
• Supplier Device Package: 432-MBGA (40x40)

paquet: 432-LBGA, Metal

XC4036XL-1HQ240I

Xilinx Inc.

IC FPGA 193 I/O 240HQFP

• Number of LABs/CLBs: 1296
• Number of Logic Elements/Cells: 3078
• Total RAM Bits: 41472
• Number of I/O: 193
• Number of Gates: 36000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 240-BFQFP Exposed Pad
• Supplier Device Package: 240-PQFP (32x32)

paquet: 240-BFQFP Exposed Pad

XC4025E-2PG299C

Xilinx Inc.

IC FPGA 256 I/O 299CPGA

• Number of LABs/CLBs: 1024
• Number of Logic Elements/Cells: 2432
• Total RAM Bits: 32768
• Number of I/O: 256
• Number of Gates: 25000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Through Hole
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 299-BCPGA
• Supplier Device Package: 299-CPGA (52.3x52.3)

paquet: 299-BCPGA

XC4006E-1TQ144C

Xilinx Inc.

IC FPGA 113 I/O 144TQFP

• Number of LABs/CLBs: 256
• Number of Logic Elements/Cells: 608
• Total RAM Bits: 8192
• Number of I/O: 113
• Number of Gates: 6000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

paquet: 144-LQFP

XCVU095-3FFVB2104E

Xilinx Inc.

IC FPGA 702 I/O 2104FCBGA

• Number of LABs/CLBs: 67200
• Number of Logic Elements/Cells: 1176000
• Total RAM Bits: 62259200
• Number of I/O: 702
• Number of Gates: -
• Voltage - Supply: 0.970 V ~ 1.030 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2104-BBGA, FCBGA
• Supplier Device Package: 2104-FCBGA (47.5x47.5)

paquet: 2104-BBGA, FCBGA

XC5VSX240T-1FF1738I

Xilinx Inc.

IC FPGA 960 I/O 1738FCBGA

• Number of LABs/CLBs: 18720
• Number of Logic Elements/Cells: 239616
• Total RAM Bits: 19021824
• Number of I/O: 960
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1738-BBGA, FCBGA
• Supplier Device Package: 1738-FCBGA (42.5x42.5)

paquet: 1738-BBGA, FCBGA

XCVU095-1FFVA2104I

Xilinx Inc.

IC FPGA 832 I/O 2104FCBGA

• Number of LABs/CLBs: 67200
• Number of Logic Elements/Cells: 1176000
• Total RAM Bits: 62259200
• Number of I/O: 832
• Number of Gates: -
• Voltage - Supply: 0.922 V ~ 0.979 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2104-BBGA, FCBGA
• Supplier Device Package: 2104-FCBGA (47.5x47.5)

paquet: 2104-BBGA, FCBGA

XC2VP100-6FF1696I

Xilinx Inc.

IC FPGA 1164 I/O 1696FCBGA

• Number of LABs/CLBs: 11024
• Number of Logic Elements/Cells: 99216
• Total RAM Bits: 8183808
• Number of I/O: 1164
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1696-BBGA, FCBGA
• Supplier Device Package: 1696-FCBGA (42.5x42.5)

paquet: 1696-BBGA, FCBGA

XCKU115-3FLVA2104E

Xilinx Inc.

IC FPGA 832 I/O 2104FCBGA

• Number of LABs/CLBs: 82920
• Number of Logic Elements/Cells: 1451100
• Total RAM Bits: 77721600
• Number of I/O: 832
• Number of Gates: -
• Voltage - Supply: 0.970 V ~ 1.030 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2104-BBGA, FCBGA
• Supplier Device Package: 2104-FCBGA (47.5x47.5)

paquet: 2104-BBGA, FCBGA

XC6VLX365T-1FF1759C

Xilinx Inc.

IC FPGA 720 I/O 1759FCBGA

• Number of LABs/CLBs: 28440
• Number of Logic Elements/Cells: 364032
• Total RAM Bits: 15335424
• Number of I/O: 720
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1759-FCBGA (42.5x42.5)

paquet: 1760-BBGA, FCBGA

XC2VP7-6FFG672C

Xilinx Inc.

IC FPGA 396 I/O 672FCBGA

• Number of LABs/CLBs: 1232
• Number of Logic Elements/Cells: 11088
• Total RAM Bits: 811008
• Number of I/O: 396
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 672-BBGA, FCBGA
• Supplier Device Package: 672-FCBGA (27x27)

paquet: 672-BBGA, FCBGA

XQ6SLX75T-3CSG484I

Xilinx Inc.

IC FPGA SPARTAN-6Q 484-CSBGA

• Number of LABs/CLBs: 5831
• Number of Logic Elements/Cells: 74637
• Total RAM Bits: 3170304
• Number of I/O: 292
• Number of Gates: -
• Voltage - Supply: 1.2 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-FBGA, CSPBGA
• Supplier Device Package: 484-CSPBGA (19x19)

paquet: 484-FBGA, CSPBGA

XC7A100T-2FG484I

Xilinx Inc.

IC FPGA 285 I/O 484FCBGA

• Number of LABs/CLBs: 7925
• Number of Logic Elements/Cells: 101440
• Total RAM Bits: 4976640
• Number of I/O: 285
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

paquet: 484-BBGA

XC7A100T-1FG484I

Xilinx Inc.

IC FPGA 285 I/O 484FCBGA

• Number of LABs/CLBs: 7925
• Number of Logic Elements/Cells: 101440
• Total RAM Bits: 4976640
• Number of I/O: 285
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

paquet: 484-BBGA

XC3S700A-4FT256I

Xilinx Inc.

IC FPGA 161 I/O 256FTBGA

• Number of LABs/CLBs: 1472
• Number of Logic Elements/Cells: 13248
• Total RAM Bits: 368640
• Number of I/O: 161
• Number of Gates: 700000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

paquet: 256-LBGA

XC6SLX4-L1CSG225C

Xilinx Inc.

IC FPGA 132 I/O 225CSBGA

• Number of LABs/CLBs: 300
• Number of Logic Elements/Cells: 3840
• Total RAM Bits: 221184
• Number of I/O: 132
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 225-LFBGA, CSPBGA
• Supplier Device Package: 225-CSPBGA (13x13)

paquet: 225-LFBGA, CSPBGA

XC9536XL-7VQG64C

Xilinx Inc.

IC CPLD 36MC 7.5NS 64VQFP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 2
• Number of Macrocells: 36
• Number of Gates: 800
• Number of I/O: 36
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP
• Supplier Device Package: 64-VQFP (10x10)

paquet: 64-TQFP

XC7S6-2CPGA196I

Xilinx Inc.

XC7S6-2CPGA196I

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: 6000
• Total RAM Bits: 184320
• Number of I/O: 100
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 196-TFBGA, CSBGA
• Supplier Device Package: 196-CSPBGA (8x8)

paquet: 196-TFBGA, CSBGA

XCKU15P-1FFVA1156I

Xilinx Inc.

XCKU15P-1FFVA1156I

• Number of LABs/CLBs: 65340
• Number of Logic Elements/Cells: 1143450
• Total RAM Bits: 82329600
• Number of I/O: 516
• Number of Gates: -
• Voltage - Supply: 0.825 V ~ 0.876 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

paquet: 1156-BBGA, FCBGA