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Produits Xilinx Inc.

Dossiers 7 167
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XCZU17EG-1FFVB1517E
Xilinx Inc.

IC FPGA 644 I/O 1517FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 926K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
paquet: 1517-BBGA, FCBGA
Stock4 576
XCZU5EG-1FBVB900I
Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
paquet: 900-BBGA, FCBGA
Stock6 288
XCZU2EG-2SFVC784E
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
paquet: 784-BBGA, FCBGA
Stock4 704
XC7Z030-2FBG676I
Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
paquet: 676-BBGA, FCBGA
Stock6 256
XC4VLX25-12FFG676C
Xilinx Inc.

IC FPGA 448 I/O 676FCBGA

  • Number of LABs/CLBs: 2688
  • Number of Logic Elements/Cells: 24192
  • Total RAM Bits: 1327104
  • Number of I/O: 448
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
paquet: 676-BBGA, FCBGA
Stock4 320
XA3SD3400A-4CSG484I
Xilinx Inc.

IC FPGA 309 I/O 484CSBG

  • Number of LABs/CLBs: 5968
  • Number of Logic Elements/Cells: 53712
  • Total RAM Bits: 2322432
  • Number of I/O: 309
  • Number of Gates: 3400000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-FBGA, CSPBGA
  • Supplier Device Package: 484-CSPBGA (19x19)
paquet: 484-FBGA, CSPBGA
Stock5 632
hot XCV600E-7FG676C
Xilinx Inc.

IC FPGA 444 I/O 676FBGA

  • Number of LABs/CLBs: 3456
  • Number of Logic Elements/Cells: 15552
  • Total RAM Bits: 294912
  • Number of I/O: 444
  • Number of Gates: 985882
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
paquet: 676-BBGA, FCBGA
Stock4 800
hot XCS10XL-4PC84C
Xilinx Inc.

IC FPGA 61 I/O 84PLCC

  • Number of LABs/CLBs: 196
  • Number of Logic Elements/Cells: 466
  • Total RAM Bits: 6272
  • Number of I/O: 61
  • Number of Gates: 10000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 84-LCC (J-Lead)
  • Supplier Device Package: 84-PLCC (29.31x29.31)
paquet: 84-LCC (J-Lead)
Stock4 736
hot XC4044XL-1HQ304I
Xilinx Inc.

IC FPGA 256 I/O 304HQFP

  • Number of LABs/CLBs: 1600
  • Number of Logic Elements/Cells: 3800
  • Total RAM Bits: 51200
  • Number of I/O: 256
  • Number of Gates: 44000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 304-BFQFP Exposed Pad
  • Supplier Device Package: 304-PQFP (40x40)
paquet: 304-BFQFP Exposed Pad
Stock9 324
XC4044XL-1HQ208I
Xilinx Inc.

IC FPGA 160 I/O 208HQFP

  • Number of LABs/CLBs: 1600
  • Number of Logic Elements/Cells: 3800
  • Total RAM Bits: 51200
  • Number of I/O: 160
  • Number of Gates: 44000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 208-BFQFP Exposed Pad
  • Supplier Device Package: 208-PQFP (28x28)
paquet: 208-BFQFP Exposed Pad
Stock7 472
hot XC4013E-2PQ240I
Xilinx Inc.

IC FPGA 192 I/O 240QFP

  • Number of LABs/CLBs: 576
  • Number of Logic Elements/Cells: 1368
  • Total RAM Bits: 18432
  • Number of I/O: 192
  • Number of Gates: 13000
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
paquet: 240-BFQFP
Stock3 840
XC4006E-1PQ208C
Xilinx Inc.

IC FPGA 128 I/O 208QFP

  • Number of LABs/CLBs: 256
  • Number of Logic Elements/Cells: 608
  • Total RAM Bits: 8192
  • Number of I/O: 128
  • Number of Gates: 6000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
paquet: 208-BFQFP
Stock5 264
XC6VLX550T-L1FFG1760I
Xilinx Inc.

IC FPGA 1200 I/O 1760FBGA

  • Number of LABs/CLBs: 42960
  • Number of Logic Elements/Cells: 549888
  • Total RAM Bits: 23298048
  • Number of I/O: 1200
  • Number of Gates: -
  • Voltage - Supply: 0.91 V ~ 0.97 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
paquet: 1760-BBGA, FCBGA
Stock5 424
XQ5VFX130T-1EF1738I
Xilinx Inc.

IC FPGA VIRTEX 5 130K 1738FFGBGA

  • Number of LABs/CLBs: 10240
  • Number of Logic Elements/Cells: 131072
  • Total RAM Bits: 10985472
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1738-BBGA, FCBGA
  • Supplier Device Package: 1738-FCBGA (42.5x42.5)
paquet: 1738-BBGA, FCBGA
Stock3 200
hot XC5VLX220-1FF1760C
Xilinx Inc.

IC FPGA 800 I/O 1760FBGA

  • Number of LABs/CLBs: 17280
  • Number of Logic Elements/Cells: 221184
  • Total RAM Bits: 7077888
  • Number of I/O: 800
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
paquet: 1760-BBGA, FCBGA
Stock6 048
XQ4VFX100-10FF1152I
Xilinx Inc.

IC FPGA VIRTEX-4FX 1152FFBGA

  • Number of LABs/CLBs: 10544
  • Number of Logic Elements/Cells: 94896
  • Total RAM Bits: 6930432
  • Number of I/O: 576
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-CFCBGA (35x35)
paquet: 1152-BBGA, FCBGA
Stock2 192
XC7VX330T-2FF1157C
Xilinx Inc.

IC FPGA 600 I/O 1157FCBGA

  • Number of LABs/CLBs: 25500
  • Number of Logic Elements/Cells: 326400
  • Total RAM Bits: 27648000
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1157-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock3 584
XC2VP70-5FFG1704C
Xilinx Inc.

IC FPGA 996 I/O 1704FCBGA

  • Number of LABs/CLBs: 8272
  • Number of Logic Elements/Cells: 74448
  • Total RAM Bits: 6045696
  • Number of I/O: 996
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1704-BBGA, FCBGA
  • Supplier Device Package: 1704-FCBGA (42.5x42.5)
paquet: 1704-BBGA, FCBGA
Stock3 600
XC5VLX110-2FFG1760C
Xilinx Inc.

IC FPGA 800 I/O 1760FBGA

  • Number of LABs/CLBs: 8640
  • Number of Logic Elements/Cells: 110592
  • Total RAM Bits: 4718592
  • Number of I/O: 800
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
paquet: 1760-BBGA, FCBGA
Stock5 872
hot XC4VFX60-10FF672I
Xilinx Inc.

IC FPGA 352 I/O 672FCBGA

  • Number of LABs/CLBs: 6320
  • Number of Logic Elements/Cells: 56880
  • Total RAM Bits: 4276224
  • Number of I/O: 352
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FCBGA (27x27)
paquet: 672-BBGA, FCBGA
Stock6 464
XC5VSX35T-3FF665C
Xilinx Inc.

IC FPGA 360 I/O 665FCBGA

  • Number of LABs/CLBs: 2720
  • Number of Logic Elements/Cells: 34816
  • Total RAM Bits: 3096576
  • Number of I/O: 360
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 665-BBGA, FCBGA
  • Supplier Device Package: 665-FCBGA (27x27)
paquet: 665-BBGA, FCBGA
Stock5 984
hot XC5VLX30T-2FF323C
Xilinx Inc.

IC FPGA 172 I/O 323FCBGA

  • Number of LABs/CLBs: 2400
  • Number of Logic Elements/Cells: 30720
  • Total RAM Bits: 1327104
  • Number of I/O: 172
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 323-BBGA, FCBGA
  • Supplier Device Package: 323-FCBGA (19x19)
paquet: 323-BBGA, FCBGA
Stock5 376
XC5VLX30T-2FFG323C
Xilinx Inc.

IC FPGA 172 I/O 323FCBGA

  • Number of LABs/CLBs: 2400
  • Number of Logic Elements/Cells: 30720
  • Total RAM Bits: 1327104
  • Number of I/O: 172
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 323-BBGA, FCBGA
  • Supplier Device Package: 323-FCBGA (19x19)
paquet: 323-BBGA, FCBGA
Stock7 232
XC7A200T-L1FBG484I
Xilinx Inc.

IC FPGA ARTIX7 285 I/O 484FCBGA

  • Number of LABs/CLBs: 16825
  • Number of Logic Elements/Cells: 215360
  • Total RAM Bits: 13455360
  • Number of I/O: 285
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA, FCBGA
  • Supplier Device Package: 484-FCBGA (23x23)
paquet: 484-BBGA, FCBGA
Stock5 632
XC6SLX100T-3FG900I
Xilinx Inc.

IC FPGA 498 I/O 900FBGA

  • Number of LABs/CLBs: 7911
  • Number of Logic Elements/Cells: 101261
  • Total RAM Bits: 4939776
  • Number of I/O: 498
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA
  • Supplier Device Package: 900-FBGA (31x31)
paquet: 900-BBGA
Stock5 648
XC7A75T-L2FGG676E
Xilinx Inc.

IC FPGA 300 I/O 676FCBGA

  • Number of LABs/CLBs: 5900
  • Number of Logic Elements/Cells: 75520
  • Total RAM Bits: 3870720
  • Number of I/O: 300
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
paquet: 676-BGA
Stock2 288
hot XC95288-20HQ208C
Xilinx Inc.

IC CPLD 288MC 20NS 208HQFP

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 20.0ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 16
  • Number of Macrocells: 288
  • Number of Gates: 6400
  • Number of I/O: 168
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 208-BFQFP Exposed Pad
  • Supplier Device Package: 208-PQFP (28x28)
paquet: 208-BFQFP Exposed Pad
Stock8 052
XCR3064XL-10CS48I
Xilinx Inc.

IC CPLD 64MC 9.1NS 48CSP

  • Programmable Type: In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max: 9.1ns
  • Voltage Supply - Internal: 2.7 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 4
  • Number of Macrocells: 64
  • Number of Gates: 1500
  • Number of I/O: 40
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-FBGA, CSPBGA
  • Supplier Device Package: 48-CSBGA (7x7)
paquet: 48-FBGA, CSPBGA
Stock4 352