Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Protocol | Number of Drivers/Receivers | Duplex | Receiver Hysteresis | Data Rate | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Rohm Semiconductor |
IC TXRX MSDL MOBILE 63VBGA
|
paquet: 63-VFBGA |
Stock5 616 |
|
- | - | Full | - | - | 1.65 V ~ 1.95 V | -30°C ~ 85°C | Surface Mount | 63-VFBGA | VBGA063W050 |
||
Rohm Semiconductor |
IC TRANSMITTER LVDS 64-TQFP
|
paquet: 64-TQFP |
Stock3 040 |
|
LVDS | 5/0 | - | - | - | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 64-TQFP | 64-TQFP (10x10) |
||
Rohm Semiconductor |
IC DRIVER SER/PAR I/O 8BIT DIP18
|
paquet: 18-DIP (0.300", 7.62mm) |
Stock2 496 |
|
- | - | - | - | - | 4.5 V ~ 5.5 V | -25°C ~ 70°C | Through Hole | 18-DIP (0.300", 7.62mm) | 18-DIP |
||
Rohm Semiconductor |
IC DRIVER SER/PAR I/O 8BIT SOP16
|
paquet: 16-SOIC (0.173", 4.40mm Width) |
Stock2 240 |
|
- | 8/0 | - | - | - | 4.5 V ~ 5.5 V | -25°C ~ 75°C | Surface Mount | 16-SOIC (0.173", 4.40mm Width) | 16-SOP |
||
Rohm Semiconductor |
IC DRIVER SER IN PARAL OUT DIP16
|
paquet: 16-DIP (0.300", 7.62mm) |
Stock4 624 |
|
- | 8/0 | - | - | - | 4.5 V ~ 5.5 V | -25°C ~ 75°C | Through Hole | 16-DIP (0.300", 7.62mm) | 16-DIP |