Produits Preci-Dip - Supports pour CI, transistors

540-88-084-17-400-TR

Preci-Dip

CONN SOCKET PLCC 84POS TIN

• Type: PLCC
• Number of Positions or Pins (Grid): 84 (4 x 21)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Tin
• Contact Finish Thickness - Mating: -
• Contact Material - Mating: Phosphor Bronze
• Mounting Type: Surface Mount
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Phosphor Bronze
• Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
• Operating Temperature: -

paquet: -

518-77-652M35-001106

Preci-Dip

CONN SOCKET PGA 652POS GOLD

• Type: PGA
• Number of Positions or Pins (Grid): 652 (35 x 35)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Surface Mount
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: Flash
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

paquet: -

518-77-652M35-001105

Preci-Dip

CONN SOCKET PGA 652POS GOLD

• Type: PGA
• Number of Positions or Pins (Grid): 652 (35 x 35)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: Flash
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

paquet: -

558-10-652M35-001104

Preci-Dip

BGA SURFACE MOUNT 1.27MM

• Type: BGA
• Number of Positions or Pins (Grid): 652 (35 x 35)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Brass
• Mounting Type: Surface Mount
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

paquet: -

558-10-652M35-001101

Preci-Dip

PGA SOLDER TAIL 1.27MM

• Type: PGA
• Number of Positions or Pins (Grid): 652 (35 x 35)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

paquet: -

518-77-600M35-001106

Preci-Dip

CONN SOCKET PGA 600POS GOLD

• Type: PGA
• Number of Positions or Pins (Grid): 600 (35 x 35)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Surface Mount
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: Flash
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

paquet: -

518-77-600M35-001105

Preci-Dip

CONN SOCKET PGA 600POS GOLD

• Type: PGA
• Number of Positions or Pins (Grid): 600 (35 x 35)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: Flash
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

paquet: -

558-10-600M35-001104

Preci-Dip

BGA SURFACE MOUNT 1.27MM

• Type: BGA
• Number of Positions or Pins (Grid): 600 (35 x 35)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Brass
• Mounting Type: Surface Mount
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

paquet: -

518-77-576M30-001106

Preci-Dip

CONN SOCKET PGA 576POS GOLD

• Type: PGA
• Number of Positions or Pins (Grid): 576 (30 x 30)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Surface Mount
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: Flash
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

paquet: -

550-10-652M35-001152

Preci-Dip

BGA SOLDER TAIL

• Type: BGA
• Number of Positions or Pins (Grid): 652 (35 x 35)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Brass
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

paquet: -

518-77-576M30-001105

Preci-Dip

CONN SOCKET PGA 576POS GOLD

• Type: PGA
• Number of Positions or Pins (Grid): 576 (30 x 30)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: Flash
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

paquet: -

558-10-576M30-001104

Preci-Dip

BGA SURFACE MOUNT 1.27MM

• Type: BGA
• Number of Positions or Pins (Grid): 576 (30 x 30)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Brass
• Mounting Type: Surface Mount
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

paquet: -

518-77-560M33-001106

Preci-Dip

CONN SOCKET PGA 560POS GOLD

• Type: PGA
• Number of Positions or Pins (Grid): 560 (33 x 33)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Surface Mount
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: Flash
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

paquet: -

558-10-600M35-001101

Preci-Dip

PGA SOLDER TAIL 1.27MM

• Type: PGA
• Number of Positions or Pins (Grid): 600 (35 x 35)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

paquet: -

518-77-560M33-001105

Preci-Dip

CONN SOCKET PGA 560POS GOLD

• Type: PGA
• Number of Positions or Pins (Grid): 560 (33 x 33)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: Flash
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

paquet: -

558-10-560M33-001104

Preci-Dip

BGA SURFACE MOUNT 1.27MM

• Type: BGA
• Number of Positions or Pins (Grid): 560 (33 x 33)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Brass
• Mounting Type: Surface Mount
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

paquet: -

558-10-500M30-001104

Preci-Dip

BGA SURFACE MOUNT 1.27MM

• Type: BGA
• Number of Positions or Pins (Grid): 500 (30 x 30)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Brass
• Mounting Type: Surface Mount
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

paquet: -

514-83-652M35-001148

Preci-Dip

CONN SOCKET BGA 652POS GOLD

• Type: BGA
• Number of Positions or Pins (Grid): 652 (35 x 35)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 29.5µin (0.75µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Surface Mount
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.100" (2.54mm)
• Contact Finish - Post: Tin
• Contact Finish Thickness - Post: -
• Contact Material - Post: Brass
• Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
• Operating Temperature: -55°C ~ 125°C

paquet: -

550-10-560M33-001152

Preci-Dip

BGA SOLDER TAIL

• Type: BGA
• Number of Positions or Pins (Grid): 560 (33 x 33)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Brass
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

paquet: -

558-10-576M30-001101

Preci-Dip

PGA SOLDER TAIL 1.27MM

• Type: PGA
• Number of Positions or Pins (Grid): 576 (30 x 30)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: 10µin (0.25µm)
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Features: Closed Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: 10µin (0.25µm)
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

paquet: -

518-77-480M29-001106

Preci-Dip

CONN SOCKET PGA 480POS GOLD

• Type: PGA
• Number of Positions or Pins (Grid): 480 (29 x 29)
• Pitch - Mating: 0.050" (1.27mm)
• Contact Finish - Mating: Gold
• Contact Finish Thickness - Mating: Flash
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Surface Mount
• Features: Open Frame
• Termination: Solder
• Pitch - Post: 0.050" (1.27mm)
• Contact Finish - Post: Gold
• Contact Finish Thickness - Post: Flash
• Contact Material - Post: Brass
• Housing Material: FR4 Epoxy Glass
• Operating Temperature: -55°C ~ 125°C

paquet: -