Page 890 - Produits NXP | Heisener Electronics

Référence	Fabricant	Description	paquet	Stock
PMD9001D,115	NXP	IC MOSFET DRIVER 6TSOP Transistor Type: 2 NPN (Totem Pole) Applications: MOSFET Driver Voltage - Rated: 50V NPN, 45V NPN Current Rating: 100mA NPN, 100mA NPN Mounting Type: Surface Mount Package / Case: SC-74, SOT-457 Supplier Device Package: 6-TSOP	paquet: SC-74, SOT-457	Stock5 024
PCF8594C-2P/02,112	NXP	IC EEPROM 4KBIT 100KHZ 8DIP Memory Type: Non-Volatile Memory Format: EEPROM Technology: EEPROM Memory Size: 4Kb (512 x 8) Memory Interface: I2C Clock Frequency: 100kHz Write Cycle Time - Word, Page: - Access Time: - Voltage - Supply: 2.5 V ~ 6.0 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-DIP	paquet: 8-DIP (0.300", 7.62mm)	Stock5 232
74ABT373AN,112	NXP	IC OCTAL TRANSP LATCH 3ST 20DIP Logic Type: D-Type Transparent Latch Circuit: 8:8 Output Type: Tri-State Voltage - Supply: 4.5 V ~ 5.5 V Independent Circuits: 1 Delay Time - Propagation: 3.6ns Current - Output High, Low: 32mA, 64mA Operating Temperature: -40°C ~ 85°C Mounting Type: Through Hole Package / Case: 20-DIP (0.300", 7.62mm) Supplier Device Package: 20-DIP	paquet: 20-DIP (0.300", 7.62mm)	Stock5 968
N74F579N,602	NXP	IC COUNTER 8BIT BINARY 20DIP Logic Type: Binary Counter Direction: Up, Down Number of Elements: 1 Number of Bits per Element: 8 Reset: Asynchronous Timing: Synchronous Count Rate: 115MHz Trigger Type: Positive Edge Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: 0°C ~ 70°C Mounting Type: Through Hole Package / Case: 20-DIP (0.300", 7.62mm) Supplier Device Package: 20-DIP	paquet: 20-DIP (0.300", 7.62mm)	Stock7 520
NE5234D,518	NXP	IC OPAMP GP 2.5MHZ RRO 14SO Amplifier Type: General Purpose Number of Circuits: 4 Output Type: Rail-to-Rail Slew Rate: 0.8 V/µs Gain Bandwidth Product: - -3db Bandwidth: 2.5MHz Current - Input Bias: 90nA Voltage - Input Offset: 200µV Current - Supply: 2.8mA Current - Output / Channel: 12mA Voltage - Supply, Single/Dual (±): 2 V ~ 5.5 V, ±1 V ~ 2.75 V Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	paquet: 14-SOIC (0.154", 3.90mm Width)	Stock3 392
TDA1552Q/N4,112	NXP	IC AMP AUDIO PWR 22W QUAD 13SIL Type: Class B Output Type: 4-Channel (Quad) Max Output Power x Channels @ Load: 22W x 2 @ 4 Ohm Voltage - Supply: 6 V ~ 18 V Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Through Hole Operating Temperature: - Supplier Device Package: 13-PDBS Package / Case: 13-SIP Formed Leads	paquet: 13-SIP Formed Leads	Stock6 272
MPC8572LPXARLD	NXP	IC MPU MPC85XX 1.067GHZ 1023BGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.067GHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 1023-BFBGA, FCBGA Supplier Device Package: 1023-FCPBGA (33x33)	paquet: 1023-BFBGA, FCBGA	Stock5 712
KMPC870ZT133	NXP	IC MPU MPC8XX 133MHZ 256BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23)	paquet: 256-BBGA	Stock7 424
MPC8377EVRAGDA	NXP	IC MPU MPC83XX 400MHZ 689TEBGA Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Security; SEC 3.0 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	paquet: 689-BBGA Exposed Pad	Stock5 888
MPC8241LVR200D	NXP	IC MPU MPC82XX 200MHZ 357BGA Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Co-Processors/DSP: - RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	paquet: 357-BBGA	Stock15 228
MPC8313ECVRAFFC	NXP	IC MPU MPC83XX 333MHZ 516BGA Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Co-Processors/DSP: Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27x27)	paquet: 516-BBGA Exposed Pad	Stock8 280
PCF52254CAF66	NXP	IC MCU 32BIT 512KB FLASH 100LQFP Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 66MHz Connectivity: CAN, Ethernet, I2C, QSPI, UART/USART, USB OTG Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 56 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	paquet: 100-LQFP	Stock7 456
MC908EY8AMFJE	NXP	IC MCU 8BIT 8KB FLASH 32LQFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: LIN, SCI, SPI Peripherals: POR, PWM Number of I/O: 24 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	paquet: 32-LQFP	Stock7 272
MC9S08RC32CFJE	NXP	IC MCU 8BIT 32KB FLASH 32LQFP Core Processor: S08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI Peripherals: LVD, POR, PWM, WDT Number of I/O: 25 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	paquet: 32-LQFP	Stock7 616
MC908EY8VFAE	NXP	IC MCU 8BIT 8KB FLASH 32LQFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: LIN, SCI, SPI Peripherals: POR, PWM Number of I/O: 24 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	paquet: 32-LQFP	Stock88 800
MC9S12DJ128MPVE	NXP	IC MCU 16BIT 128KB FLASH 112LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: PWM, WDT Number of I/O: 91 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	paquet: 112-LQFP	Stock5 824
MC56F82348MLH	NXP	IC MCU 32BIT 64KB FLASH 64LQFP Core Processor: 56800EX Core Size: 32-Bit Speed: 50MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V Data Converters: A/D 16x12b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	paquet: 64-LQFP	Stock2 016
S9S12G96F0CLFR	NXP	IC MCU 16BIT 96KB FLASH 48LQFP Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, IrDA, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: 3K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	paquet: 48-LQFP	Stock4 528
MPC9229AC	NXP	IC PECL CLOCK SYNTHESIZER 32LQFP Type: Clock/Frequency Synthesizer, Clock Generator PLL: Yes with Bypass Input: Crystal Output: LVPECL Number of Circuits: 1 Ratio - Input:Output: 1:1 Differential - Input:Output: No/Yes Frequency - Max: 400MHz Divider/Multiplier: Yes/No Voltage - Supply: 3.135 V ~ 3.465 V Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	paquet: 32-LQFP	Stock8 892
MPXM2053GS	NXP	SENS PRESSURE 7.25 PSI MAX MPAK Pressure Type: Vented Gauge Operating Pressure: 7.25 PSI (50 kPa) Output Type: Wheatstone Bridge Output: 0 mV ~ 40 mV (10V) Accuracy: -0.6% ~ 0.4% Voltage - Supply: 10 V ~ 16 V Port Size: Male - 0.12" (2.97mm) Tube Port Style: Barbless Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 29.01 PSI (200 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 5-SMD Module Supplier Device Package: 5-MPAK	paquet: 5-SMD Module	Stock144 480
PT5010A0HN/C1,151	NXP	IC NFC CARD UNIV 32HVQFN Type: - Frequency: - Standards: - Interface: - Voltage - Supply: - Operating Temperature: - Package / Case: - Supplier Device Package: -	paquet: -	Stock3 006
SLEV900/AFB	NXP	KIT EVAL I.CODE RFID 13.56MHZ Type: Read/Write Frequency: 13.56MHz For Use With/Related Products: ICODE Transponders Supplied Contents: Board, Cables	paquet: -	Stock4 014
PNEV5180BM	NXP	PN5180 DEVELOPMENT BOARD Type: - Frequency: - For Use With/Related Products: - Supplied Contents: -	paquet: -	Stock7 632
SA605DK,112	NXP	IC MIXER FM IF SYSTEM LP 20-SSOP Frequency: 0Hz ~ 500MHz Sensitivity: - Data Rate (Max): - Modulation or Protocol: ASK, FSK Applications: FM Remote Receiver Current - Receiving: 5.7mA Data Interface: PCB, Surface Mount Memory Size: - Antenna Connector: PCB, Surface Mount Features: RSSI Equipped Voltage - Supply: 4.5 V ~ 8 V Operating Temperature: -40°C ~ 85°C Package / Case: 20-LSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-SSOP	paquet: 20-LSSOP (0.173", 4.40mm Width)	Stock7 200
S912XEG128BVAL	NXP	16-BIT MCU S12X CORE 128KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	paquet: 112-LQFP	Stock7 600
S9S08RNA48W1MLF	NXP	8-BIT MCU S08 CORE 48KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	paquet: 48-LQFP	Stock6 608
S9S12GN32BCLC	NXP	16-BIT32K FLASH2K RAM Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 26 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	paquet: 32-LQFP	Stock7 344
MC32PF8121EUEPR2	NXP	POWER MANAGEMENT IC I.MX8 PRE-PR Applications: Industrial, IoT Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	paquet: -	Request a Quote

PMD9001D,115

NXP

IC MOSFET DRIVER 6TSOP

Transistor Type: 2 NPN (Totem Pole)
Applications: MOSFET Driver
Voltage - Rated: 50V NPN, 45V NPN
Current Rating: 100mA NPN, 100mA NPN
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Supplier Device Package: 6-TSOP

paquet: SC-74, SOT-457

Stock5 024

PCF8594C-2P/02,112

NXP

IC EEPROM 4KBIT 100KHZ 8DIP

Memory Type: Non-Volatile
Memory Format: EEPROM
Technology: EEPROM
Memory Size: 4Kb (512 x 8)
Memory Interface: I2C
Clock Frequency: 100kHz
Write Cycle Time - Word, Page: -
Access Time: -
Voltage - Supply: 2.5 V ~ 6.0 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Through Hole
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-DIP

paquet: 8-DIP (0.300", 7.62mm)

Stock5 232

74ABT373AN,112

NXP

IC OCTAL TRANSP LATCH 3ST 20DIP

Logic Type: D-Type Transparent Latch
Circuit: 8:8
Output Type: Tri-State
Voltage - Supply: 4.5 V ~ 5.5 V
Independent Circuits: 1
Delay Time - Propagation: 3.6ns
Current - Output High, Low: 32mA, 64mA
Operating Temperature: -40°C ~ 85°C
Mounting Type: Through Hole
Package / Case: 20-DIP (0.300", 7.62mm)
Supplier Device Package: 20-DIP

paquet: 20-DIP (0.300", 7.62mm)

Stock5 968

N74F579N,602

NXP

IC COUNTER 8BIT BINARY 20DIP

Logic Type: Binary Counter
Direction: Up, Down
Number of Elements: 1
Number of Bits per Element: 8
Reset: Asynchronous
Timing: Synchronous
Count Rate: 115MHz
Trigger Type: Positive Edge
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: 0°C ~ 70°C
Mounting Type: Through Hole
Package / Case: 20-DIP (0.300", 7.62mm)
Supplier Device Package: 20-DIP

paquet: 20-DIP (0.300", 7.62mm)

Stock7 520

NE5234D,518

NXP

IC OPAMP GP 2.5MHZ RRO 14SO

Amplifier Type: General Purpose
Number of Circuits: 4
Output Type: Rail-to-Rail
Slew Rate: 0.8 V/µs
Gain Bandwidth Product: -
-3db Bandwidth: 2.5MHz
Current - Input Bias: 90nA
Voltage - Input Offset: 200µV
Current - Supply: 2.8mA
Current - Output / Channel: 12mA
Voltage - Supply, Single/Dual (±): 2 V ~ 5.5 V, ±1 V ~ 2.75 V
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 14-SO

paquet: 14-SOIC (0.154", 3.90mm Width)

Stock3 392

TDA1552Q/N4,112

NXP

IC AMP AUDIO PWR 22W QUAD 13SIL

Type: Class B
Output Type: 4-Channel (Quad)
Max Output Power x Channels @ Load: 22W x 2 @ 4 Ohm
Voltage - Supply: 6 V ~ 18 V
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Mounting Type: Through Hole
Operating Temperature: -
Supplier Device Package: 13-PDBS
Package / Case: 13-SIP Formed Leads

paquet: 13-SIP Formed Leads

Stock6 272

MPC8572LPXARLD

NXP

IC MPU MPC85XX 1.067GHZ 1023BGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.067GHz
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 1023-BFBGA, FCBGA
Supplier Device Package: 1023-FCPBGA (33x33)

paquet: 1023-BFBGA, FCBGA

Stock5 712

KMPC870ZT133

NXP

IC MPU MPC8XX 133MHZ 256BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 133MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (2)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 256-BBGA
Supplier Device Package: 256-PBGA (23x23)

paquet: 256-BBGA

Stock7 424

MPC8377EVRAGDA

NXP

IC MPU MPC83XX 400MHZ 689TEBGA

Core Processor: PowerPC e300c4s
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 125°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

paquet: 689-BBGA Exposed Pad

Stock5 888

MPC8241LVR200D

NXP

IC MPU MPC82XX 200MHZ 357BGA

Core Processor: PowerPC 603e
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 200MHz
Co-Processors/DSP: -
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

paquet: 357-BBGA

Stock15 228

MPC8313ECVRAFFC

NXP

IC MPU MPC83XX 333MHZ 516BGA

Core Processor: PowerPC e300c3
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 333MHz
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography
Package / Case: 516-BBGA Exposed Pad
Supplier Device Package: 516-TEPBGA (27x27)

paquet: 516-BBGA Exposed Pad

Stock8 280

PCF52254CAF66

NXP

IC MCU 32BIT 512KB FLASH 100LQFP

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 66MHz
Connectivity: CAN, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 56
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

paquet: 100-LQFP

Stock7 456

MC908EY8AMFJE

NXP

IC MCU 8BIT 8KB FLASH 32LQFP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: LIN, SCI, SPI
Peripherals: POR, PWM
Number of I/O: 24
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

paquet: 32-LQFP

Stock7 272

MC9S08RC32CFJE

NXP

IC MCU 8BIT 32KB FLASH 32LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: SCI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 25
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

paquet: 32-LQFP

Stock7 616

MC908EY8VFAE

NXP

IC MCU 8BIT 8KB FLASH 32LQFP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: LIN, SCI, SPI
Peripherals: POR, PWM
Number of I/O: 24
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

paquet: 32-LQFP

Stock88 800

MC9S12DJ128MPVE

NXP

IC MCU 16BIT 128KB FLASH 112LQFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, I2C, SCI, SPI
Peripherals: PWM, WDT
Number of I/O: 91
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

paquet: 112-LQFP

Stock5 824

MC56F82348MLH

NXP

IC MCU 32BIT 64KB FLASH 64LQFP

Core Processor: 56800EX
Core Size: 32-Bit
Speed: 50MHz
Connectivity: CAN, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
Data Converters: A/D 16x12b, D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

paquet: 64-LQFP

Stock2 016

S9S12G96F0CLFR

NXP

IC MCU 16BIT 96KB FLASH 48LQFP

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, IrDA, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 96KB (96K x 8)
Program Memory Type: FLASH
EEPROM Size: 3K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

paquet: 48-LQFP

Stock4 528

MPC9229AC

NXP

IC PECL CLOCK SYNTHESIZER 32LQFP

Type: Clock/Frequency Synthesizer, Clock Generator
PLL: Yes with Bypass
Input: Crystal
Output: LVPECL
Number of Circuits: 1
Ratio - Input:Output: 1:1
Differential - Input:Output: No/Yes
Frequency - Max: 400MHz
Divider/Multiplier: Yes/No
Voltage - Supply: 3.135 V ~ 3.465 V
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

paquet: 32-LQFP

Stock8 892

MPXM2053GS

NXP

SENS PRESSURE 7.25 PSI MAX MPAK

Pressure Type: Vented Gauge
Operating Pressure: 7.25 PSI (50 kPa)
Output Type: Wheatstone Bridge
Output: 0 mV ~ 40 mV (10V)
Accuracy: -0.6% ~ 0.4%
Voltage - Supply: 10 V ~ 16 V
Port Size: Male - 0.12" (2.97mm) Tube
Port Style: Barbless
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: 29.01 PSI (200 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 5-SMD Module
Supplier Device Package: 5-MPAK

paquet: 5-SMD Module

Stock144 480

PT5010A0HN/C1,151

NXP

IC NFC CARD UNIV 32HVQFN

Type: -
Frequency: -
Standards: -
Interface: -
Voltage - Supply: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

paquet: -

Stock3 006

SLEV900/AFB

NXP

KIT EVAL I.CODE RFID 13.56MHZ

Type: Read/Write
Frequency: 13.56MHz
For Use With/Related Products: ICODE Transponders
Supplied Contents: Board, Cables

paquet: -

Stock4 014

PNEV5180BM

NXP

PN5180 DEVELOPMENT BOARD

Type: -
Frequency: -
For Use With/Related Products: -
Supplied Contents: -

paquet: -

Stock7 632

SA605DK,112

NXP

IC MIXER FM IF SYSTEM LP 20-SSOP

Frequency: 0Hz ~ 500MHz
Sensitivity: -
Data Rate (Max): -
Modulation or Protocol: ASK, FSK
Applications: FM Remote Receiver
Current - Receiving: 5.7mA
Data Interface: PCB, Surface Mount
Memory Size: -
Antenna Connector: PCB, Surface Mount
Features: RSSI Equipped
Voltage - Supply: 4.5 V ~ 8 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-SSOP

paquet: 20-LSSOP (0.173", 4.40mm Width)

Stock7 200

S912XEG128BVAL

NXP

16-BIT MCU S12X CORE 128KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 91
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 12K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

paquet: 112-LQFP

Stock7 600

S9S08RNA48W1MLF

NXP

8-BIT MCU S08 CORE 48KB FLASH

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 39
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

paquet: 48-LQFP

Stock6 608

S9S12GN32BCLC

NXP

16-BIT32K FLASH2K RAM

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 26
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 1K x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

paquet: 32-LQFP

Stock7 344

MC32PF8121EUEPR2

NXP

POWER MANAGEMENT IC I.MX8 PRE-PR

Applications: Industrial, IoT
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

paquet: -

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