Produits NXP

PHT6N06LT,135

NXP

MOSFET N-CH 55V 2.5A SOT223

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 55V
• Current - Continuous Drain (Id) @ 25°C: 2.5A (Ta)
• Drive Voltage (Max Rds On, Min Rds On): 5V
• Vgs(th) (Max) @ Id: 2V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 4.5nC @ 5V
• Input Capacitance (Ciss) (Max) @ Vds: 330pF @ 25V
• Vgs (Max): ±13V
• FET Feature: -
• Power Dissipation (Max): 1.8W (Ta), 8.3W (Tc)
• Rds On (Max) @ Id, Vgs: 150 mOhm @ 5A, 5V
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: SOT-223
• Package / Case: TO-261-4, TO-261AA

paquet: TO-261-4, TO-261AA

PSMN020-150W,127

NXP

MOSFET N-CH 150V 73A SOT429

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 150V
• Current - Continuous Drain (Id) @ 25°C: 73A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 10V
• Vgs(th) (Max) @ Id: 4V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 227nC @ 10V
• Input Capacitance (Ciss) (Max) @ Vds: 9537pF @ 25V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 300W (Tc)
• Rds On (Max) @ Id, Vgs: 20 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Supplier Device Package: TO-247-3
• Package / Case: TO-247-3

paquet: TO-247-3

BLF8G22L-160BV,112

NXP

TRANSISTOR CDFM6

• Transistor Type: -
• Frequency: -
• Gain: -
• Voltage - Test: -
• Current Rating: -
• Noise Figure: -
• Current - Test: -
• Power - Output: -
• Voltage - Rated: -
• Package / Case: SOT-1120B
• Supplier Device Package: CDFM6

paquet: SOT-1120B

LD6806F/12H,115

NXP

IC REG LINEAR 1.2V 200MA 6-XSON

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 1.2V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.13V @ 200mA
• Current - Output: 200mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 100µA ~ 250µA
• PSRR: 55dB (1kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 6-XFDFN
• Supplier Device Package: 6-XSON, SOT886 (1.45x1)

paquet: 6-XFDFN

MC33899VW

NXP

IC MOTOR DRIVER SPI 30HSOP

• Motor Type - Stepper: -
• Motor Type - AC, DC: Brushed DC
• Function: Driver - Fully Integrated, Control and Power Stage
• Output Configuration: Half Bridge (2)
• Interface: SPI
• Technology: Power MOSFET
• Step Resolution: -
• Applications: General Purpose
• Current - Output: -
• Voltage - Supply: 4.75 V ~ 5.25 V
• Voltage - Load: 6 V ~ 26.5 V
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 30-BSOP (0.433", 11.00mm Width) Exposed Pad
• Supplier Device Package: 30-HSOP

paquet: 30-BSOP (0.433", 11.00mm Width) Exposed Pad

MC34845DEPR2

NXP

IC LED DRVR RGLTR DIM 2.6A 24QFN

• Type: DC DC Regulator
• Topology: Step-Up (Boost)
• Internal Switch(s): Yes
• Number of Outputs: 6
• Voltage - Supply (Min): 5V
• Voltage - Supply (Max): 21V
• Voltage - Output: 8 V ~ 60 V
• Current - Output / Channel: 2.6A (Switch)
• Frequency: 300kHz
• Dimming: PWM
• Applications: Backlight
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-UFQFN Exposed Pad
• Supplier Device Package: 24-QFN-EP (4x4)

paquet: 24-UFQFN Exposed Pad

SSTL16877DGG,512

NXP

IC REG DRIVER 14BIT 48TSSOP

• Logic Type: SSTL_2 Registered Driver with Differential Clock Inputs
• Number of Circuits: 14
• Current - Output High, Low: 20mA, 20mA
• Voltage - Supply: 2.3 V ~ 2.7 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 48-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 48-TSSOP

paquet: 48-TFSOP (0.240", 6.10mm Width)

74AVC16T245DGV-Q1J

NXP

IC TXRX 16BIT TRANSL 3ST 48TSSOP

• Translator Type: Voltage Level
• Channel Type: Bidirectional
• Number of Circuits: 2
• Channels per Circuit: 8
• Voltage - VCCA: 0.8V ~ 3.6V
• Voltage - VCCB: 0.8V ~ 3.6V
• Input Signal: -
• Output Signal: -
• Output Type: Tri-State, Non-Inverted
• Data Rate: 380Mbps
• Operating Temperature: -40°C ~ 125°C (TA)
• Features: -
• Mounting Type: Surface Mount
• Package / Case: 48-TFSOP (0.173", 4.40mm Width)
• Supplier Device Package: 48-TSSOP

paquet: 48-TFSOP (0.173", 4.40mm Width)

74ABT541PW-Q100J

NXP

IC BUFFER/LINE DVR OCT 20TSSOP

• Logic Type: -
• Number of Elements: -
• Number of Bits per Element: -
• Input Type: -
• Output Type: -
• Current - Output High, Low: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

74ALVT16240DGG,518

NXP

IC BUFF DVR TRI-ST 16BIT 48TSSOP

• Logic Type: Buffer, Inverting
• Number of Elements: 4
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 48-TSSOP

paquet: 48-TFSOP (0.240", 6.10mm Width)

SCC68692C1A44,512

NXP

IC UART DUAL 44-PLCC

• Features: Configurable GPIO, Internal Oscillator, Timer/Counter
• Number of Channels: 2, DUART
• FIFO's: -
• Protocol: -
• Data Rate (Max): 1Mbps
• Voltage - Supply: 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: -
• With False Start Bit Detection: Yes
• With Modem Control: -
• Mounting Type: Surface Mount
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

paquet: 44-LCC (J-Lead)

MCZ33905CD5EK

NXP

IC SBC CAN HS 5.0V 54SOIC

• Applications: System Basis Chip
• Interface: CAN, LIN
• Voltage - Supply: 5.5 V ~ 28 V
• Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 54-SOIC W EP
• Mounting Type: Surface Mount

paquet: 54-SSOP (0.295", 7.50mm Width) Exposed Pad

PCA9674ABS,118

NXP

IC I/O EXPANDER I2C 8B 16HVQFN

• Number of I/O: 8
• Interface: I2C
• Interrupt Output: Yes
• Features: POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 100µA, 25mA
• Clock Frequency: 1MHz
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-VFQFN Exposed Pad
• Supplier Device Package: 16-HVQFN (3x3)

paquet: 16-VFQFN Exposed Pad

MC8610TPX1066JB

NXP

IC MPU MPC86XX 1.066GHZ 783BGA

• Core Processor: PowerPC e600
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.066GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: DIU, LCD
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

paquet: 783-BBGA, FCBGA

MPC8270ZQMIBA

NXP

IC MPU MPC82XX 333MHZ 516BGA

• Core Processor: PowerPC G2_LE
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 333MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 516-BBGA
• Supplier Device Package: 516-FPBGA (27x27)

paquet: 516-BBGA

P1015NXE5DFB

NXP

IC MPU Q OR IQ 667MHZ 561TEBGA1

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: Security; SEC 3.3
• RAM Controllers: DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 561-FBGA
• Supplier Device Package: 561-TEPBGA1 (23x23)

paquet: 561-FBGA

MC9S12UF32PU

NXP

IC MCU 16BIT 32KB FLASH 100LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 30MHz
• Connectivity: ATA, Compact Flash, EBI/EMI, Memory Card, SCI, SD, Smart Media, USB
• Peripherals: POR, WDT
• Number of I/O: 73
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 3.5K x 8
• Voltage - Supply (Vcc/Vdd): 2.25 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

paquet: 100-LQFP

S9S12DG12F1VPVE

NXP

IC MCU 16BIT 128KB FLASH 112LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: PWM, WDT
• Number of I/O: 91
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

paquet: 112-LQFP

MSC8122TMP4800V

NXP

DSP 16BIT 300MHZ MULTI 431FCBGA

• Type: SC140 Core
• Interface: DSI, Ethernet, RS-232
• Clock Rate: 300MHz
• Non-Volatile Memory: External
• On-Chip RAM: 1.436MB
• Voltage - I/O: 3.30V
• Voltage - Core: 1.10V
• Operating Temperature: -40°C ~ 105°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 431-BFBGA, FCBGA
• Supplier Device Package: 431-FCPBGA (20x20)

paquet: 431-BFBGA, FCBGA

MSC8101VT1500F

NXP

IC DSP 16BIT 250MHZ 332FCBGA

• Type: SC140 Core
• Interface: Communications Processor Module (CPM)
• Clock Rate: 300MHz
• Non-Volatile Memory: External
• On-Chip RAM: 512kB
• Voltage - I/O: 3.30V
• Voltage - Core: 1.60V
• Operating Temperature: -40°C ~ 75°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 332-BFBGA, FCPBGA
• Supplier Device Package: 332-FCBGA (17x17)

paquet: 332-BFBGA, FCPBGA

MMA6361LT

NXP

ACCELEROMETER 1.5-6G ANAL 14LGA

• Type: Analog
• Axis: X, Y
• Acceleration Range: ±1.5g, 6g
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): 800 (±1.5g) ~ 206 (±6g)
• Bandwidth: 400Hz
• Output Type: Analog Voltage
• Voltage - Supply: 2.2 V ~ 3.6 V
• Features: Selectable Scale, Sleep Mode
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 14-VFLGA
• Supplier Device Package: 14-LGA (3x5)

paquet: 14-VFLGA

T1042NXN7MQB

NXP

QORIQ 4X E5500 1200MHZ DDR3L/

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

MCIMX6X2EVN10ABR

NXP

I.MX 6 SERIES 32-BIT MPU ARM CO

• Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 200MHz, 1GHz
• Co-Processors/DSP: Multimedia; NEON™ MPE
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
• Operating Temperature: -20°C ~ 105°C (TJ)
• Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
• Package / Case: 400-LFBGA
• Supplier Device Package: 400-MAPBGA (17x17)

paquet: 400-LFBGA

MIMXRT1061DVL6A

NXP

I.MXRT1061 MPU 196MAPBGA

• Core Processor: ARM® Cortex®-M7
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 600MHz
• Co-Processors/DSP: -
• RAM Controllers: SDRAM
• Graphics Acceleration: Yes
• Display & Interface Controllers: LCD
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 OTG + PHY (2)
• Voltage - I/O: 1.8V, 2.8V, 3.3V
• Operating Temperature: 0°C ~ 95°C (TJ)
• Security Features: BEE, DCP, HAB, SJC, SNVS, TRNG
• Package / Case: 196-LFBGA
• Supplier Device Package: 196-MAPBGA (10x10)

paquet: 196-LFBGA

MKS22FN128VLH12

NXP

KINETIS S 32-BIT MCU ARM CORTEX

• Core Processor: ARM® Cortex®-M4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CANbus, I²C, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 1x16b. D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

paquet: 64-LQFP

S912ZVM16F1WKFR

NXP

S12Z CORE,16K FLASH

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: SCI
• Peripherals: DMA, POR, WDT
• Number of I/O: 31
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
• Data Converters: A/D 4x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP-EP (7x7)

paquet: 48-LQFP Exposed Pad

S9S08RN32W1VLC

NXP

8-BIT MCU S08 CORE 32KB FLASH

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, LINbus, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 26
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

paquet: 32-LQFP

PTN36043ABXY

NXP

IC SWITCH SPDT X 2 18X2QFN

• Switch Circuit: SPDT
• Multiplexer/Demultiplexer Circuit: 2:1
• Number of Circuits: 2
• On-State Resistance (Max): -
• Channel-to-Channel Matching (ΔRon): -
• Voltage - Supply, Single (V+): 1.7V ~ 1.9V
• Voltage - Supply, Dual (V±): -
• Switch Time (Ton, Toff) (Max): -
• -3db Bandwidth: -
• Charge Injection: -
• Channel Capacitance (CS(off), CD(off)): -
• Current - Leakage (IS(off)) (Max): 6µA
• Crosstalk: -50dB @ 2.5GHz
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 18-XFQFN Exposed Pad
• Supplier Device Package: 18-X2QFN (2.4x2)

paquet: -