Produits NXP

PHB110NQ06LT,118

NXP

MOSFET N-CH 55V 75A D2PAK

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 55V
• Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
• Vgs(th) (Max) @ Id: 2V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 45nC @ 5V
• Input Capacitance (Ciss) (Max) @ Vds: 3960pF @ 25V
• Vgs (Max): ±15V
• FET Feature: -
• Power Dissipation (Max): 200W (Tc)
• Rds On (Max) @ Id, Vgs: 7 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: D2PAK
• Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

paquet: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

BC327-16,112

NXP

TRANS PNP 45V 0.5A TO-92

• Transistor Type: PNP
• Current - Collector (Ic) (Max): 500mA
• Voltage - Collector Emitter Breakdown (Max): 45V
• Vce Saturation (Max) @ Ib, Ic: 700mV @ 50mA, 500mA
• Current - Collector Cutoff (Max): 100nA (ICBO)
• DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 100mA, 1V
• Power - Max: 625mW
• Frequency - Transition: 80MHz
• Operating Temperature: 150°C (TJ)
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA)
• Supplier Device Package: TO-92-3

paquet: TO-226-3, TO-92-3 (TO-226AA)

PDTC143TK,115

NXP

TRANS PREBIAS NPN 250MW SMT3

• Transistor Type: NPN - Pre-Biased
• Current - Collector (Ic) (Max): 100mA
• Voltage - Collector Emitter Breakdown (Max): 50V
• Resistor - Base (R1) (Ohms): 4.7k
• Resistor - Emitter Base (R2) (Ohms): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 1mA, 5V
• Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
• Current - Collector Cutoff (Max): 1µA
• Frequency - Transition: -
• Power - Max: 250mW
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

paquet: TO-236-3, SC-59, SOT-23-3

MC33932VW

NXP

IC MOTOR DRIVER PAR 44HSOP

• Motor Type - Stepper: -
• Motor Type - AC, DC: Brushed DC
• Function: Driver - Fully Integrated, Control and Power Stage
• Output Configuration: Half Bridge (4)
• Interface: Parallel
• Technology: CMOS
• Step Resolution: -
• Applications: Automotive
• Current - Output: 5A
• Voltage - Supply: 5 V ~ 28 V
• Voltage - Load: 5 V ~ 28 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
• Supplier Device Package: 44-HSOP

paquet: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad

PCA9532PW,112

NXP

IC LED DRIVER LIN 25MA 24TSSOP

• Type: Power Switch
• Topology: -
• Internal Switch(s): Yes
• Number of Outputs: 16
• Voltage - Supply (Min): 2.3V
• Voltage - Supply (Max): 5.5V
• Voltage - Output: -
• Current - Output / Channel: 25mA
• Frequency: -
• Dimming: I2C
• Applications: Backlight
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 24-TSSOP

paquet: 24-TSSOP (0.173", 4.40mm Width)

NVT2002GD,125

NXP

IC TRANSLATOR BIDIR VOLT XSON8U

• Translator Type: Voltage Level
• Channel Type: Bidirectional
• Number of Circuits: 1
• Channels per Circuit: 2
• Voltage - VCCA: 1V ~ 3.6V
• Voltage - VCCB: 1.8V ~ 5.5V
• Input Signal: -
• Output Signal: -
• Output Type: Open Drain, Push-Pull
• Data Rate: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Features: Auto-Direction Sensing
• Mounting Type: Surface Mount
• Package / Case: 8-XFDFN
• Supplier Device Package: 8-XSON, SOT996-2 (2x3)

paquet: 8-XFDFN

GTL2014PW,118

NXP

IC TXRX 4BIT LVTTL/GTL 14TSSOP

• Translator Type: Mixed Signal
• Channel Type: Bidirectional
• Number of Circuits: 1
• Channels per Circuit: 4
• Voltage - VCCA: -
• Voltage - VCCB: -
• Input Signal: LVTTL
• Output Signal: GTL
• Output Type: Open Drain
• Data Rate: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Features: -
• Mounting Type: Surface Mount
• Package / Case: 14-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 14-TSSOP

paquet: 14-TSSOP (0.173", 4.40mm Width)

74CBTLVD3384DK,118

NXP

IC BUS SWITCH 10BIT 24SSOP

• Type: Bus Switch
• Circuit: 5 x 1:1
• Independent Circuits: 2
• Current - Output High, Low: -
• Voltage Supply Source: Single Supply
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 24-SSOP (0.154", 3.90mm Width)
• Supplier Device Package: 24-SSOP

paquet: 24-SSOP (0.154", 3.90mm Width)

74HCT670DB,112

NXP

IC 4X4 REGISTER FILE 3ST 16-SSOP

• Logic Type: Register File
• Output Type: Tri-State
• Number of Elements: 1
• Number of Bits per Element: 4
• Function: Universal
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 16-SSOP

paquet: 16-SSOP (0.209", 5.30mm Width)

74LV367D,118

NXP

IC BUFF DVR TRI-ST HEX 16SOIC

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 2
• Number of Bits per Element: 2, 4 (Hex)
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 8mA, 8mA
• Voltage - Supply: 1 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

paquet: 16-SOIC (0.154", 3.90mm Width)

TDA1308T/N2,115

NXP

IC AMP AUDIO 3W STER AB 8SOIC

• Type: Class AB
• Output Type: Headphones, 2-Channel (Stereo)
• Max Output Power x Channels @ Load: 80mW x 2 @ 32 Ohm
• Voltage - Supply: 3 V ~ 7 V, ±1.5 V ~ 3.5 V
• Features: Depop, Short-Circuit Protection
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 8-SO
• Package / Case: 8-SOIC (0.154", 3.90mm Width)

paquet: 8-SOIC (0.154", 3.90mm Width)

UJA1076ATW/3V3/WD,

NXP

IC SBC CAN/LIN 3.3V HS 32HTSSOP

• Applications: Automotive
• Interface: SPI Serial
• Voltage - Supply: 4.5 V ~ 28 V
• Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
• Supplier Device Package: 32-HTSSOP
• Mounting Type: Surface Mount

paquet: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

MC8640TVU1067NE

NXP

IC MPU MPC86XX 1.067GHZ 994BGA

• Core Processor: PowerPC e600
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.067GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 994-BCBGA, FCCBGA
• Supplier Device Package: 994-FCCBGA (33x33)

paquet: 994-BCBGA, FCCBGA

T1022NSE7MQB

NXP

IC SOC 2CORE 1200MHZ 780FCBGA

• Core Processor: PowerPC e5500
• Number of Cores/Bus Width: 2 Core, 64-Bit
• Speed: 1.4GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3L/4
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 1 Gbps (5)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
• Package / Case: 780-FBGA, FCBGA
• Supplier Device Package: 780-FCPBGA (23x23)

paquet: 780-FBGA, FCBGA

MK10DN512ZVMC10R

NXP

IC MCU 32BIT 512KB FLASH 121BGA

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 90
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 42x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 121-LFBGA
• Supplier Device Package: 121-MAPBGA (8x8)

paquet: 121-LFBGA

MC9S08AC16CFJER

NXP

IC MCU 8BIT 16KB FLASH 32LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 22
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

paquet: 32-LQFP

MK10DN64VFM5

NXP

IC MCU 32BIT 64KB FLASH 32QFN

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, IrDA, SPI, UART/USART
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 24
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 10x16b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-QFN (5x5)

paquet: 32-VFQFN Exposed Pad

FXLN8362QR1

NXP

ACCELEROMETER 4-16G ANALOG 12QFN

• Type: Analog
• Axis: X, Y, Z
• Acceleration Range: ±4g, 16g
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): 114.5 (±4g) ~ 28.62 (±16g)
• Bandwidth: 1.1kHz (X,Y), 600Hz (Z)
• Output Type: Analog Voltage
• Voltage - Supply: 1.71 V ~ 3.6 V
• Features: Selectable Scale
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 12-VQFN Exposed Pad
• Supplier Device Package: 12-QFN (3x3)

paquet: 12-VQFN Exposed Pad

NCF29A1MHN/0504GJ

NXP

IC REMOTE KEYLESS ENTRY 32HVQFN

• Type: -
• Frequency: -
• Standards: -
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

M5282ZIGBEE

NXP

BOARD EVAL ZIGBEE FOR MCF5282

• Type: 802.15.4/Zigbee
• Frequency: -
• For Use With/Related Products: MCF5282
• Supplied Contents: -

paquet: -

A2I20D040NR1

NXP

RF PWR AMP 2GHZ 40W TO270

• Frequency: 1.4GHz ~ 2.2GHz
• P1dB: -
• Gain: 35dB
• Noise Figure: -
• RF Type: W-CDMA
• Voltage - Supply: 28V
• Current - Supply: -
• Test Frequency: 2.2GHz
• Package / Case: -
• Supplier Device Package: -

paquet: -

SPC5746BFK1AVKU2

NXP

SINGLE CORE 3M FLASH 384K RAM

• Core Processor: e200z4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
• Peripherals: DMA, I²S, POR, WDT
• Number of I/O: 129
• Program Memory Size: 3MB (3M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 384K x 8
• Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
• Data Converters: A/D 36x10b, 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 176-LQFP Exposed Pad
• Supplier Device Package: 176-LQFP (24x24)

paquet: 176-LQFP Exposed Pad

S9S08DN48F2VLFR

NXP

M74K MASK ONLY - AUTO

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 39
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1.5K x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

paquet: 48-LQFP

S9S12G64F1VLC

NXP

16-BIT MCU S12 CORE 64KB FLASH

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CANbus, IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 26
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

paquet: 32-LQFP

S9S12G96F0VLHR

NXP

16-BIT MCU S12 CORE 96KB FLASH

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CANbus, IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 3K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

paquet: 64-LQFP

MC35FS6506NAE

NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: 1V ~ 5V
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-HLQFP (7x7)

paquet: -

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SAF4000EL-101S23AY

NXP

SOFTWARE DEFINED RADIO

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

Request a Quote

MIMXRT117HCVM8A

NXP

IC MCU 32BIT EXT MEM 289LFBGA

• Core Processor: ARM® Cortex®-M4, Cortex®-M7
• Core Size: 32-Bit Dual-Core
• Speed: 400MHz, 800MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
• Number of I/O: 13
• Program Memory Size: -
• Program Memory Type: External Program Memory
• EEPROM Size: -
• RAM Size: 2M x 8
• Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
• Data Converters: A/D 20x12b SAR; D/A 1x12b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 289-LFBGA
• Supplier Device Package: 289-LFBGA (14x14)

paquet: -