Produits NXP

PMD9010D,115

NXP

IC MOSFET DRIVER 6TSOP

• Transistor Type: 2 NPN (Totem Pole)
• Applications: MOSFET Driver
• Voltage - Rated: 45V NPN, 45V NPN
• Current Rating: 100mA NPN, 100mA NPN
• Mounting Type: Surface Mount
• Package / Case: SC-74, SOT-457
• Supplier Device Package: 6-TSOP

paquet: SC-74, SOT-457

MRF5S21090HR5

NXP

FET RF 65V 2.11GHZ NI-780

• Transistor Type: LDMOS
• Frequency: 2.11GHz
• Gain: 14.5dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 850mA
• Power - Output: 19W
• Voltage - Rated: 65V
• Package / Case: NI-780
• Supplier Device Package: NI-780

paquet: NI-780

BZX84-C12/LF1VL

NXP

DIODE ZENER TO-236AB SOT23

• Voltage - Zener (Nom) (Vz): 12V
• Tolerance: ±5%
• Power - Max: 250mW
• Impedance (Max) (Zzt): 25 Ohms
• Current - Reverse Leakage @ Vr: 100nA @ 8V
• Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

paquet: TO-236-3, SC-59, SOT-23-3

LD6816CX4/13P,315

NXP

IC REG LINEAR 1.3V 150MA 4WLCSP

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 1.3V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.075V @ 150mA
• Current - Output: 150mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 100µA ~ 250µA
• PSRR: 55dB (1kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature, Transient Voltage
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 4-XFBGA, WLCSP
• Supplier Device Package: 4-WLCSP (0.76x0.76)

paquet: 4-XFBGA, WLCSP

MCZ33879EKR2

NXP

IC SWITCH HI/LO SIDE 16B 32-SOIC

• Switch Type: General Purpose
• Number of Outputs: 8
• Ratio - Input:Output: 1:8
• Output Configuration: High Side or Low Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 5.5 V ~ 26.5 V
• Voltage - Supply (Vcc/Vdd): 3.1 V ~ 5.5 V
• Current - Output (Max): 600mA
• Rds On (Typ): 750 mOhm
• Input Type: -
• Features: -
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP

paquet: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

TEA1833TS/1H

NXP

IC FLYBACK SMPS CTLR 6TSOP

• Output Isolation: Isolated
• Internal Switch(s): No
• Voltage - Breakdown: -
• Topology: Flyback
• Voltage - Start Up: 22V
• Voltage - Supply (Vcc/Vdd): 10.5 V ~ 36 V
• Duty Cycle: 90%
• Frequency - Switching: 65kHz
• Power (Watts): -
• Fault Protection: Over Power, Over Temperature, Over Voltage, Short Circuit
• Control Features: -
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: SC-74, SOT-457
• Supplier Device Package: 6-TSOP
• Mounting Type: Surface Mount

paquet: SC-74, SOT-457

74HCT14N,652

NXP

IC TRIGGER SCHM HEX INVERT 14DIP

• Logic Type: Inverter
• Number of Circuits: 6
• Number of Inputs: 6
• Features: Schmitt Trigger
• Voltage - Supply: 4.5 V ~ 5.5 V
• Current - Quiescent (Max): 2µA
• Current - Output High, Low: 4mA, 4mA
• Logic Level - Low: 0.5 V ~ 0.6 V
• Logic Level - High: 1.9 V ~ 2.1 V
• Max Propagation Delay @ V, Max CL: 34ns @ 4.5V, 50pF
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Through Hole
• Supplier Device Package: 14-DIP
• Package / Case: 14-DIP (0.300", 7.62mm)

paquet: 14-DIP (0.300", 7.62mm)

74ABT543ADB,118

NXP

IC TRANSCVR TRI-ST 8BIT 24SSOP

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 24-SSOP

paquet: 24-SSOP (0.209", 5.30mm Width)

TDA1566TH/N1C,118

NXP

IC AMP AUDIO PWR 150W AB 24HSOP

• Type: Class AB
• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Max Output Power x Channels @ Load: 150W x 1 @ 1 Ohm; 75W x 2 @ 2 Ohm
• Voltage - Supply: 6.5 V ~ 18 V
• Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 24-HSOP
• Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad

paquet: 24-BSOP (0.433", 11.00mm Width) Exposed Pad

TDA8551T/N1,118

NXP

IC AMP AUDIO PWR 1.4W MONO 8SOIC

• Type: Class AB
• Output Type: 1-Channel (Mono)
• Max Output Power x Channels @ Load: 1.4W x 1 @ 8 Ohm
• Voltage - Supply: 2.7 V ~ 5.5 V
• Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby, Volume Control
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 8-SO
• Package / Case: 8-SOIC (0.154", 3.90mm Width)

paquet: 8-SOIC (0.154", 3.90mm Width)

PTN36241BBS,118

NXP

IC REDRIVER USB 3.0 1CH 24HVQFN

• Type: Buffer, ReDriver
• Applications: USB 3.0
• Input: -
• Output: -
• Data Rate (Max): 5Gbps
• Number of Channels: 2
• Delay Time: 1.0ns
• Signal Conditioning: Input Equalization, Output De-Emphasis
• Capacitance - Input: -
• Voltage - Supply: 3 V ~ 3.6 V
• Current - Supply: 100mA
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: -
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-HVQFN (4x4)

paquet: 24-VFQFN Exposed Pad

KMPC870CZT66

NXP

IC MPU MPC8XX 66MHZ 256BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 66MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (2)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 100°C (TA)
• Security Features: -
• Package / Case: 256-BBGA
• Supplier Device Package: 256-PBGA (23x23)

paquet: 256-BBGA

M68LC302CPU16VCT

NXP

IC MPU M683XX 166MHZ 100LQFP

• Core Processor: M68000
• Number of Cores/Bus Width: 1 Core, 8/16-Bit
• Speed: 166MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

paquet: 100-LQFP

MCF51AC256BCLKER

NXP

IC MCU 32BIT 256KB FLASH 80LQFP

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, PWM, WDT
• Number of I/O: 69
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 80-LQFP
• Supplier Device Package: 80-LQFP (14x14)

paquet: 80-LQFP

MC9S08QG44CPBE

NXP

IC MCU 8BIT 4KB FLASH 16DIP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 12
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 16-DIP (0.300", 7.62mm)
• Supplier Device Package: 16-DIP

paquet: 16-DIP (0.300", 7.62mm)

MC9S08RD16PE

NXP

IC MCU 8BIT 16KB FLASH 28DIP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 23
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 28-DIP (0.600", 15.24mm)
• Supplier Device Package: 28-PDIP

paquet: 28-DIP (0.600", 15.24mm)

MC908GR48AVFUE

NXP

IC MCU 8BIT 48KB FLASH 64QFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 53
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1.5K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 24x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-QFP
• Supplier Device Package: 64-QFP (14x14)

paquet: 64-QFP

MPC561MVR56

NXP

IC MCU 32BIT ROMLESS 388PBGA

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 56MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 64
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 388-BBGA
• Supplier Device Package: 388-PBGA (27x27)

paquet: 388-BBGA

MC56F8255VLD

NXP

IC MCU 16BIT 64KB FLASH 44LQFP

• Core Processor: 56800E
• Core Size: 16-Bit
• Speed: 60MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 35
• Program Memory Size: 64KB (32K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 16
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x12b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 44-LQFP
• Supplier Device Package: 44-LQFP (10x10)

paquet: 44-LQFP

MC9S12XDT256MAL

NXP

IC MCU 16BIT 256KB FLASH 112LQFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

paquet: 112-LQFP

MC9RS08KA1CPC

NXP

IC MCU 8BIT 1KB FLASH 8DIP

• Core Processor: RS08
• Core Size: 8-Bit
• Speed: 10MHz
• Connectivity: -
• Peripherals: LVD, POR, WDT
• Number of I/O: 4
• Program Memory Size: 1KB (1K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 63 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-PDIP

paquet: 8-DIP (0.300", 7.62mm)

KTY84/130,153

NXP

IC TEMPERATURE SENSOR DO-34

• Resistance in Ohms @ 25°C: 603
• Resistance Tolerance: -
• Operating Temperature: -40°C ~ 300°C
• Power - Max: -
• Mounting Type: Through Hole
• Package / Case: DO-204AG, DO-34, Axial
• Supplier Device Package: DO-34

paquet: DO-204AG, DO-34, Axial

SA604AHRZ

NXP

IC FM IF SYSTEM LOW PWR 16UHXQFN

• Function: IF Receiver
• Frequency: 25MHz
• RF Type: FM
• Secondary Attributes: -
• Package / Case: 16-XFQFN Exposed Pad
• Supplier Device Package: 16-HXQFN (3x3)

paquet: 16-XFQFN Exposed Pad

MC13770FCR2

NXP

IC RF LN AMP W-CDMA QFN-12

• Frequency: 2.1GHz ~ 2.4GHz
• P1dB: -
• Gain: 15dB
• Noise Figure: 1.5dB
• RF Type: W-CDMA
• Voltage - Supply: 2.7 V ~ 3 V
• Current - Supply: 8mA
• Test Frequency: 2.14GHz
• Package / Case: 12-VFQFN Exposed Pad
• Supplier Device Package: 12-QFN (3x3)

paquet: 12-VFQFN Exposed Pad

MC35FS6500CAER2

NXP

SYSTEM BASIS CHIP DCDC 0.8A VCO

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: -1.0 V ~ 40 V
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP (7x7)

paquet: 48-LQFP Exposed Pad

S9S08DZ32F2CLC

NXP

8-BIT MCU S08 CORE 32KB FLASH

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 10x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

paquet: 32-LQFP

S32K324NHT1MMMSR

NXP

IC MCU

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

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TDA8295HN-C2-557

NXP

AUDIO/VIDEO DEMODULATOR, AM/FM

• Type: -
• Applications: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

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