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Produits NXP

Dossiers 26 590
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MRF6S19140HR5
NXP

FET RF 68V 1.99GHZ NI-880

  • Transistor Type: LDMOS
  • Frequency: 1.93GHz ~ 1.99GHz
  • Gain: 16dB
  • Voltage - Test: 28V
  • Current Rating: -
  • Noise Figure: -
  • Current - Test: 1.15A
  • Power - Output: 29W
  • Voltage - Rated: 68V
  • Package / Case: NI-880
  • Supplier Device Package: NI-880
paquet: NI-880
Stock4 608
BT1306-400D,412
NXP

TRIAC SENS GATE 400V 0.6A TO92-3

  • Triac Type: Logic - Sensitive Gate
  • Voltage - Off State: 400V
  • Current - On State (It (RMS)) (Max): 600mA
  • Voltage - Gate Trigger (Vgt) (Max): 2V
  • Current - Non Rep. Surge 50, 60Hz (Itsm): 8A, 8.8A
  • Current - Gate Trigger (Igt) (Max): 5mA
  • Current - Hold (Ih) (Max): 10mA
  • Configuration: Single
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Mounting Type: Through Hole
  • Package / Case: TO-226-3, TO-92-3 (TO-226AA)
  • Supplier Device Package: TO-92-3
paquet: TO-226-3, TO-92-3 (TO-226AA)
Stock4 832
BUK139-50DL,118
NXP

MOSFET N-CH 50V 16A DPAK

  • Switch Type: General Purpose
  • Number of Outputs: 1
  • Ratio - Input:Output: 1:1
  • Output Configuration: Low Side
  • Output Type: N-Channel
  • Interface: On/Off
  • Voltage - Load: 50V (Max)
  • Voltage - Supply (Vcc/Vdd): Not Required
  • Current - Output (Max): 16A
  • Rds On (Typ): 36 mOhm
  • Input Type: Non-Inverting
  • Features: -
  • Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
  • Operating Temperature: 150°C (TJ)
  • Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
  • Supplier Device Package: DPAK
paquet: TO-252-3, DPak (2 Leads + Tab), SC-63
Stock6 432
TEA1752T/N1,518
NXP

IC CTLR SMPS SW MODE 16SOIC

  • Output Isolation: Isolated
  • Internal Switch(s): No
  • Voltage - Breakdown: 650V
  • Topology: Flyback
  • Voltage - Start Up: 22V
  • Voltage - Supply (Vcc/Vdd): 15 V ~ 38 V
  • Duty Cycle: -
  • Frequency - Switching: 250kHz
  • Power (Watts): 250W
  • Fault Protection: Current Limiting, Over Power, Over Temperature, Over Voltage
  • Control Features: -
  • Operating Temperature: -40°C ~ 150°C (TJ)
  • Package / Case: 16-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 16-SO
  • Mounting Type: Surface Mount
paquet: 16-SOIC (0.154", 3.90mm Width)
Stock6 672
TDA19989AETC189,55
NXP

IC HDMI INTERFACE 1.4A 64TFBGA

  • Type: HDMI 1.3 Transmitter
  • Applications: Video Camera
  • Mounting Type: Surface Mount
  • Package / Case: 64-TFBGA
  • Supplier Device Package: 64-TFBGA (4.5x4.5)
paquet: 64-TFBGA
Stock5 360
TDA9981BHL/8/C1;55
NXP

IC HDMI TX 81MHZ 80-LQFP

  • Type: Transmitter
  • Applications: Recorders, Set-Top Boxes
  • Mounting Type: Surface Mount
  • Package / Case: 80-LQFP
  • Supplier Device Package: 80-LQFP (12x12)
paquet: 80-LQFP
Stock3 408
hot MCIMX31LCVKN5D
NXP

IC MPU I.MX31 532MHZ 457MAPBGA

  • Core Processor: ARM1136JF-S
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 532MHz
  • Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
  • RAM Controllers: DDR
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: Keyboard, Keypad, LCD
  • Ethernet: -
  • SATA: -
  • USB: USB 2.0 (3)
  • Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
  • Package / Case: 457-LFBGA
  • Supplier Device Package: -
paquet: 457-LFBGA
Stock10 836
S912ZVMC12F2WKH
NXP

IC MCU 16BIT 128KB FLASH 64LQFP

  • Core Processor: S12Z
  • Core Size: 16-Bit
  • Speed: 50MHz
  • Connectivity: CAN, LIN, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 42
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 512 x 8
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: A/D 9x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 150°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP Exposed Pad
  • Supplier Device Package: 64-LQFP EP (10x10)
paquet: 64-LQFP Exposed Pad
Stock3 728
MC9S12GC64VFUE
NXP

IC MCU 16BIT 64KB FLASH 80QFP

  • Core Processor: HCS12
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: EBI/EMI, SCI, SPI
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 60
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 80-QFP
  • Supplier Device Package: 80-QFP (14x14)
paquet: 80-QFP
Stock3 360
MC9S12E64MFU
NXP

IC MCU 16BIT 64KB FLASH 80QFP

  • Core Processor: HCS12
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: EBI/EMI, I2C, SCI, SPI
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 60
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 2.35 V ~ 2.75 V
  • Data Converters: A/D 16x10b; D/A 2x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 80-QFP
  • Supplier Device Package: 80-QFP (14x14)
paquet: 80-QFP
Stock2 048
MC908GZ60VFUE
NXP

IC MCU 8BIT 60KB FLASH 64QFP

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: CAN, SCI, SPI
  • Peripherals: LVD, POR, PWM
  • Number of I/O: 53
  • Program Memory Size: 60KB (60K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 24x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 64-QFP
  • Supplier Device Package: 64-QFP (14x14)
paquet: 64-QFP
Stock5 136
MK52DN512ZCMD10
NXP

IC MCU 32BIT 512KB FLASH 144BGA

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 100MHz
  • Connectivity: EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
  • Peripherals: DMA, I2S, LVD, POR, PWM, WDT
  • Number of I/O: 96
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 41x16b, D/A 2x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LBGA
  • Supplier Device Package: 144-MAPBGA (13x13)
paquet: 144-LBGA
Stock3 392
MK22FN512CAP12R
NXP

IC MCU 32BIT 512KB FLASH 80WLCSP

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
  • Peripherals: DMA, I2S, LVD, POR, PWM, WDT
  • Number of I/O: 52
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 2x16b, D/A 2x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 80-UFBGA, WLCSP
  • Supplier Device Package: 80-WLCSP (4.13x3.56)
paquet: 80-UFBGA, WLCSP
Stock5 888
MKM33Z128CLL5
NXP

IC MCU 32BIT 128KB FLASH 100LQFP

  • Core Processor: ARM? Cortex?-M0+
  • Core Size: 32-Bit
  • Speed: 50MHz
  • Connectivity: I2C, SPI, UART/USART
  • Peripherals: DMA, LCD, WDT
  • Number of I/O: 68
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 16K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 12x16b, 4x24b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
paquet: 100-LQFP
Stock5 424
hot S912XHY128F0CLL
NXP

IC MCU 16BIT 128KB FLASH 100LQFP

  • Core Processor: HCS12X
  • Core Size: 16-Bit
  • Speed: 40MHz
  • Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
  • Peripherals: LCD, Motor control PWM, POR, PWM, WDT
  • Number of I/O: 76
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 8K x 8
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
paquet: 100-LQFP
Stock13 080
hot S9S08AW32E5VPUE
NXP

IC MCU 8BIT 32KB FLASH 64LQFP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: I2C, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 54
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 16x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
paquet: 64-LQFP
Stock43 644
LPC11U24FHI33/301Y
NXP

IC MCU 32BIT 32KB FLASH 33HVQFN

  • Core Processor: ARM? Cortex?-M0
  • Core Size: 32-Bit
  • Speed: 50MHz
  • Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
  • Peripherals: Brown-out Detect/Reset, POR, WDT
  • Number of I/O: 26
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 2K x 8
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 32-VFQFN Exposed Pad
  • Supplier Device Package: 33-HVQFN (5x5)
paquet: 32-VFQFN Exposed Pad
Stock3 104
MK64FN1M0VLQ12
NXP

IC MCU 32BIT 1MB FLASH 144LQFP

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
  • Peripherals: DMA, I2S, LVD, POR, PWM, WDT
  • Number of I/O: 100
  • Program Memory Size: 1MB (1M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 256K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 41x16b, D/A 2x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
paquet: 144-LQFP
Stock19 524
hot MMA8453QT
NXP

ACCELEROMETER 2-8G I2C 16QFN

  • Type: Digital
  • Axis: X, Y, Z
  • Acceleration Range: ±2g, 4g, 8g
  • Sensitivity (LSB/g): 256 (±2g) ~ 64 (±8g)
  • Sensitivity (mV/g): -
  • Bandwidth: 0.78Hz ~ 400Hz
  • Output Type: I2C
  • Voltage - Supply: 1.95 V ~ 3.6 V
  • Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 16-VFQFN
  • Supplier Device Package: 16-QFN (3x3)
paquet: 16-VFQFN
Stock4 536
MF1SPLUS6031DA8/03
NXP

IC SMART CARD MIFARE 2K PLLMC

  • Type: RFID Transponder
  • Frequency: 13.56MHz
  • Standards: ISO 14443, MIFARE
  • Interface: UART
  • Voltage - Supply: -
  • Operating Temperature: -25°C ~ 70°C
  • Package / Case: MOA8, Smart Card Module
  • Supplier Device Package: -
paquet: MOA8, Smart Card Module
Stock3 600
TDA18256HN/C1E
NXP

CABLE FST DEMOD 4TS DAC

  • Function: -
  • Interface: -
  • Number of Circuits: -
  • Voltage - Supply: -
  • Current - Supply: -
  • Power (Watts): -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock4 048
T1013NXE7PQA
NXP

QORIQ 1XCPU 64-BIT PWR ARCH 1.

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock4 496
MCIMX6D7CZK08AD
NXP

I.MX 6 SERIES 32-BIT MPU QUAD A

  • Core Processor: ARM® Cortex®-A9
  • Number of Cores/Bus Width: 2 Core, 32-Bit
  • Speed: 800MHz
  • Co-Processors/DSP: Multimedia; NEON™ SIMD
  • RAM Controllers: LPDDR2, LVDDR3, DDR3
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: Keypad, LCD
  • Ethernet: 10/100/1000 Mbps (1)
  • SATA: SATA 3Gbps (1)
  • USB: USB 2.0 + PHY (4)
  • Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
  • Package / Case: 569-LFBGA
  • Supplier Device Package: 569-MAPBGA (12x12)
paquet: 569-LFBGA
Stock2 160
K32L2B21VLH0AR
NXP

K32 L2B, 64LQFP

  • Core Processor: ARM® Cortex®-M0+
  • Core Size: 32-Bit
  • Speed: 48MHz
  • Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
  • Peripherals: DMA, LCD, PWM, WDT
  • Number of I/O: 50
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
  • Data Converters: A/D 16x16b; D/A 1x12b
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
paquet: -
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LPC1102LVUK
NXP

RISC MICROCONTROLLER, 32-BIT, 50

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
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MIMX8QM6AVUFFABR
NXP

I.MX 8QUADMAX

  • Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
  • Number of Cores/Bus Width: 8 Core, 64-Bit
  • Speed: 1.6GHz, 1.2GHz, 264MHz
  • Co-Processors/DSP: Multimedia; NEON
  • RAM Controllers: LPDDR4
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI
  • Ethernet: 1Gbps (2)
  • SATA: -
  • USB: USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
  • Package / Case: 1313-BFBGA
  • Supplier Device Package: 1313-BGA (29x29)
paquet: -
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MFS2622AMBA0AD
NXP

AUTO SBC

  • Applications: -
  • Current - Supply: 30µA
  • Voltage - Supply: 3.2V ~ 40V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP-EP (7x7)
paquet: -
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MC9S08PA32AVLDR
NXP

IC MCU 8BIT 32KB FLASH 44LQFP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 20MHz
  • Connectivity: I2C, LINbus, SPI, UART/USART
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 37
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 256 x 8
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
  • Data Converters: A/D 12x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 44-LQFP
  • Supplier Device Package: 44-LQFP (10x10)
paquet: -
Request a Quote