Page 31 - Produits NXP - PMIC - Gestion d'alimentation - Spécialisé | Heisener Electronics
Contactez nous
SalesDept@heisener.com +86-755-83210559 ext. 809
Connexion/S'inscrire
Language Translation

* Please refer to the English Version as our Official Version.

BOM
Chariot 0

Produits NXP - PMIC - Gestion d'alimentation - Spécialisé

Dossiers 1 370
Page  31/49
Image
Référence
Fabricant
Description
paquet
Stock
Quantité
Current - Supply
Voltage - Supply
Operating Temperature
Mounting Type
Package / Case
Supplier Device Package
MC34VR500V8ES
NXP

REGULATOR BUCK QUAD WITH UP TO

  • Applications: QorlQ LS1/T1 Communications Processors
  • Current - Supply: 250µA
  • Voltage - Supply: 2.8 V ~ 4.5 V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN-EP (8x8)
paquet: 56-VFQFN Exposed Pad
Stock7 032
250µA
2.8 V ~ 4.5 V
-40°C ~ 105°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-QFN-EP (8x8)
MC34VR500V5ES
NXP

REGULATOR BUCK QUAD WITH UP TO

  • Applications: QorlQ LS1/T1 Communications Processors
  • Current - Supply: 250µA
  • Voltage - Supply: 2.8 V ~ 4.5 V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN-EP (8x8)
paquet: 56-VFQFN Exposed Pad
Stock7 952
250µA
2.8 V ~ 4.5 V
-40°C ~ 105°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-QFN-EP (8x8)
MC34VR500V7ES
NXP

REGULATOR BUCK QUAD WITH UP TO

  • Applications: QorlQ LS1/T1 Communications Processors
  • Current - Supply: 250µA
  • Voltage - Supply: 2.8 V ~ 4.5 V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN-EP (8x8)
paquet: 56-VFQFN Exposed Pad
Stock6 144
250µA
2.8 V ~ 4.5 V
-40°C ~ 105°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-QFN-EP (8x8)
MC33FS6521NAE
NXP

SYSTEM BASIS CHIP DCDC 2.2A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
paquet: 48-LQFP Exposed Pad
Stock8 760
-
-1.0 V ~ 40 V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC35FS6500NAE
NXP

FS6500

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 150°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
paquet: 48-LQFP Exposed Pad
Stock7 680
-
-1.0 V ~ 40 V
-40°C ~ 150°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC33FS6520CAE
NXP

SYSTEM BASIS CHIP DCDC 2.2A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
paquet: 48-LQFP Exposed Pad
Stock7 952
-
-1.0 V ~ 40 V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC33FS6510CAE
NXP

SYSTEM BASIS CHIP DCDC 1.5A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
paquet: 48-LQFP Exposed Pad
Stock7 152
-
-1.0 V ~ 40 V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC33FS6500LAE
NXP

SYSTEM BASIS CHIP DCDC 0.8A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
paquet: 48-LQFP Exposed Pad
Stock7 860
-
-1.0 V ~ 40 V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC33FS6500CAE
NXP

SYSTEM BASIS CHIP DCDC 0.8A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
paquet: 48-LQFP Exposed Pad
Stock7 176
-
-1.0 V ~ 40 V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC33FS4500CAE
NXP

SYSTEM BASIS CHIP LINEAR 0.5A V

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
paquet: 48-LQFP Exposed Pad
Stock7 440
-
-1.0 V ~ 40 V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC33FS6520NAE
NXP

SYSTEM BASIS CHIP DCDC 2.2A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
paquet: 48-LQFP Exposed Pad
Stock8 064
-
-1.0 V ~ 40 V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC34PF4210A1ESR2
NXP

PF4210

  • Applications: Audio, Video
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 4.5 V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN-EP (8x8)
paquet: 56-VFQFN Exposed Pad
Stock2 896
-
2.8 V ~ 4.5 V
-40°C ~ 105°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-QFN-EP (8x8)
hot MC33664ATL1EG
NXP

TRANSFORMER PHYSICAL LAYER

  • Applications: Isolated Communications Interface
  • Current - Supply: 40mA
  • Voltage - Supply: 4.5 V ~ 7 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 16-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 16-SOIC
paquet: 16-SOIC (0.154", 3.90mm Width)
Stock9 012
40mA
4.5 V ~ 7 V
-40°C ~ 125°C (TA)
Surface Mount
16-SOIC (0.154", 3.90mm Width)
16-SOIC
MC33FS6510NAE
NXP

SYSTEM BASIS CHIP DCDC 1.5A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
paquet: 48-LQFP Exposed Pad
Stock8 568
-
-1.0 V ~ 40 V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC34PF4210A1ES
NXP

PF4210

  • Applications: Audio, Video
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 4.5 V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN-EP (8x8)
paquet: 56-VFQFN Exposed Pad
Stock5 424
-
2.8 V ~ 4.5 V
-40°C ~ 105°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-QFN-EP (8x8)
MC34PF4210A0ES
NXP

PF4210

  • Applications: Audio, Video
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 4.5 V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN-EP (8x8)
paquet: 56-VFQFN Exposed Pad
Stock7 440
-
2.8 V ~ 4.5 V
-40°C ~ 105°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-QFN-EP (8x8)
MC32PF4210A1ESR2
NXP

PF4210

  • Applications: Audio, Video
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 4.5 V
  • Operating Temperature: 0°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN-EP (8x8)
paquet: 56-VFQFN Exposed Pad
Stock2 272
-
2.8 V ~ 4.5 V
0°C ~ 85°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-QFN-EP (8x8)
MC32PF4210A1ES
NXP

PF4210

  • Applications: Audio, Video
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 4.5 V
  • Operating Temperature: 0°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN-EP (8x8)
paquet: 56-VFQFN Exposed Pad
Stock6 372
-
2.8 V ~ 4.5 V
0°C ~ 85°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-QFN-EP (8x8)
MC32PF4210A0ES
NXP

PF4210

  • Applications: Audio, Video
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 4.5 V
  • Operating Temperature: 0°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN-EP (8x8)
paquet: 56-VFQFN Exposed Pad
Stock7 392
-
2.8 V ~ 4.5 V
0°C ~ 85°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-QFN-EP (8x8)
MC33PF3000A7ES
NXP

POWER MANAGEMENT IC I.MX7 PRE-

  • Applications: i.MX Processors
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 105°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
paquet: 48-VFQFN Exposed Pad
Stock8 928
-
2.8 V ~ 5.5 V
-40°C ~ 105°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
MC32PF3000A5EP
NXP

POWER MANAGEMENT IC I.MX7 PRE-

  • Applications: i.MX Processors
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
paquet: 48-VFQFN Exposed Pad
Stock7 728
-
2.8 V ~ 5.5 V
-40°C ~ 85°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
MC32PF3000A4EP
NXP

POWER MANAGEMENT IC I.MX7 PRE-

  • Applications: i.MX Processors
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
paquet: 48-VFQFN Exposed Pad
Stock6 684
-
2.8 V ~ 5.5 V
-40°C ~ 85°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
MC32PF3000A3EP
NXP

POWER MANAGEMENT IC I.MX7 PRE-

  • Applications: i.MX Processors
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
paquet: 48-VFQFN Exposed Pad
Stock8 172
-
2.8 V ~ 5.5 V
-40°C ~ 85°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
MC32PF3000A2EP
NXP

POWER MANAGEMENT IC I.MX7 PRE-

  • Applications: i.MX Processors
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
paquet: 48-VFQFN Exposed Pad
Stock6 108
-
2.8 V ~ 5.5 V
-40°C ~ 85°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
MC32PF3000A7EP
NXP

POWER MANAGEMENT IC I.MX7 PRE-

  • Applications: i.MX Processors
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
paquet: 48-VFQFN Exposed Pad
Stock12 240
-
2.8 V ~ 5.5 V
-40°C ~ 85°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
MC32PF3001A1EP
NXP

POWER MANAGEMENT IC I.MX7 PRE-

  • Applications: Processor
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
paquet: 48-VFQFN Exposed Pad
Stock8 076
-
2.8 V ~ 5.5 V
-40°C ~ 85°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
MC32PF3001A3EP
NXP

POWER MANAGEMENT IC I.MX7 PRE-

  • Applications: Processor
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
paquet: 48-VFQFN Exposed Pad
Stock8 352
-
2.8 V ~ 5.5 V
-40°C ~ 85°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
MC34PF4210A0ESR2
NXP

PF4210

  • Applications: Audio, Video
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 4.5 V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN-EP (8x8)
paquet: 56-VFQFN Exposed Pad
Stock35 370
-
2.8 V ~ 4.5 V
-40°C ~ 105°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-QFN-EP (8x8)