Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Current - Supply | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
REGULATOR BUCK QUAD WITH UP TO
|
paquet: 56-VFQFN Exposed Pad |
Stock7 032 |
|
250µA | 2.8 V ~ 4.5 V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
||
NXP |
REGULATOR BUCK QUAD WITH UP TO
|
paquet: 56-VFQFN Exposed Pad |
Stock7 952 |
|
250µA | 2.8 V ~ 4.5 V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
||
NXP |
REGULATOR BUCK QUAD WITH UP TO
|
paquet: 56-VFQFN Exposed Pad |
Stock6 144 |
|
250µA | 2.8 V ~ 4.5 V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
||
NXP |
SYSTEM BASIS CHIP DCDC 2.2A VCO
|
paquet: 48-LQFP Exposed Pad |
Stock8 760 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
FS6500
|
paquet: 48-LQFP Exposed Pad |
Stock7 680 |
|
- | -1.0 V ~ 40 V | -40°C ~ 150°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP DCDC 2.2A VCO
|
paquet: 48-LQFP Exposed Pad |
Stock7 952 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP DCDC 1.5A VCO
|
paquet: 48-LQFP Exposed Pad |
Stock7 152 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
paquet: 48-LQFP Exposed Pad |
Stock7 860 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
paquet: 48-LQFP Exposed Pad |
Stock7 176 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP LINEAR 0.5A V
|
paquet: 48-LQFP Exposed Pad |
Stock7 440 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
SYSTEM BASIS CHIP DCDC 2.2A VCO
|
paquet: 48-LQFP Exposed Pad |
Stock8 064 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
PF4210
|
paquet: 56-VFQFN Exposed Pad |
Stock2 896 |
|
- | 2.8 V ~ 4.5 V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
||
NXP |
TRANSFORMER PHYSICAL LAYER
|
paquet: 16-SOIC (0.154", 3.90mm Width) |
Stock9 012 |
|
40mA | 4.5 V ~ 7 V | -40°C ~ 125°C (TA) | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
NXP |
SYSTEM BASIS CHIP DCDC 1.5A VCO
|
paquet: 48-LQFP Exposed Pad |
Stock8 568 |
|
- | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP (7x7) |
||
NXP |
PF4210
|
paquet: 56-VFQFN Exposed Pad |
Stock5 424 |
|
- | 2.8 V ~ 4.5 V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
||
NXP |
PF4210
|
paquet: 56-VFQFN Exposed Pad |
Stock7 440 |
|
- | 2.8 V ~ 4.5 V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
||
NXP |
PF4210
|
paquet: 56-VFQFN Exposed Pad |
Stock2 272 |
|
- | 2.8 V ~ 4.5 V | 0°C ~ 85°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
||
NXP |
PF4210
|
paquet: 56-VFQFN Exposed Pad |
Stock6 372 |
|
- | 2.8 V ~ 4.5 V | 0°C ~ 85°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
||
NXP |
PF4210
|
paquet: 56-VFQFN Exposed Pad |
Stock7 392 |
|
- | 2.8 V ~ 4.5 V | 0°C ~ 85°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
paquet: 48-VFQFN Exposed Pad |
Stock8 928 |
|
- | 2.8 V ~ 5.5 V | -40°C ~ 105°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
paquet: 48-VFQFN Exposed Pad |
Stock7 728 |
|
- | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
paquet: 48-VFQFN Exposed Pad |
Stock6 684 |
|
- | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
paquet: 48-VFQFN Exposed Pad |
Stock8 172 |
|
- | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
paquet: 48-VFQFN Exposed Pad |
Stock6 108 |
|
- | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
paquet: 48-VFQFN Exposed Pad |
Stock12 240 |
|
- | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
paquet: 48-VFQFN Exposed Pad |
Stock8 076 |
|
- | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
NXP |
POWER MANAGEMENT IC I.MX7 PRE-
|
paquet: 48-VFQFN Exposed Pad |
Stock8 352 |
|
- | 2.8 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
NXP |
PF4210
|
paquet: 56-VFQFN Exposed Pad |
Stock35 370 |
|
- | 2.8 V ~ 4.5 V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN-EP (8x8) |