Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Current - Supply | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC POWER MANAGEMENT I.MX8QM
|
paquet: 56-VFQFN Exposed Pad |
Stock4 992 |
|
- | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
paquet: 56-VFQFN Exposed Pad |
Stock3 504 |
|
- | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QXP
|
paquet: 56-VFQFN Exposed Pad |
Stock2 128 |
|
- | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
paquet: 56-VFQFN Exposed Pad |
Stock3 088 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QXP
|
paquet: 56-VFQFN Exposed Pad |
Stock4 064 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT
|
paquet: 56-VFQFN Exposed Pad |
Stock4 480 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8M MINI
|
paquet: 56-VFQFN Exposed Pad |
Stock2 416 |
|
- | 2.7V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8M MINI
|
paquet: 56-VFQFN Exposed Pad |
Stock4 544 |
|
- | 2.7V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8M MINI
|
paquet: 56-VFQFN Exposed Pad |
Stock5 472 |
|
- | 2.7V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT
|
paquet: - |
Stock2 928 |
|
- | - | - | - | - | - |
||
NXP |
POWER MANAGEMENT IC FOR LOW-POWE
|
paquet: 25-UFBGA, WLCSP |
Stock2 704 |
|
- | 3.3V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 25-UFBGA, WLCSP | 25-WLCSP (2.09x2.09) |
||
NXP |
IC POWER MANAGEMENT
|
paquet: 56-VFQFN Exposed Pad |
Stock6 300 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QXP
|
paquet: 56-VFQFN Exposed Pad |
Stock7 620 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT
|
paquet: 56-VFQFN Exposed Pad |
Stock8 328 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT
|
paquet: - |
Stock6 372 |
|
- | - | - | - | - | - |
||
NXP |
IC POWER MANAGEMENT
|
paquet: 56-VFQFN Exposed Pad |
Stock6 348 |
|
- | - | - | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT
|
paquet: 56-VFQFN Exposed Pad |
Stock8 088 |
|
- | - | - | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC WIRELESS PWR TX 96KB LQFP48
|
paquet: 48-LQFP |
Stock12 612 |
|
1.7mA | 3V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
paquet: 56-VFQFN Exposed Pad |
Stock5 760 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
paquet: 56-VFQFN Exposed Pad |
Stock2 432 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT
|
paquet: 56-VFQFN Exposed Pad |
Stock4 096 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
paquet: 56-VFQFN Exposed Pad |
Stock2 496 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QXP
|
paquet: 56-VFQFN Exposed Pad |
Stock6 256 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
paquet: 56-VFQFN Exposed Pad |
Stock7 888 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
paquet: 56-VFQFN Exposed Pad |
Stock7 344 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
paquet: 56-VFQFN Exposed Pad |
Stock6 496 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC SBCS CAN HIGH SPEED 48HTQFP
|
paquet: - |
Stock4 784 |
|
- | - | - | - | - | - |
||
NXP |
IC SBCS CAN HIGH SPEED 48HTQFP
|
paquet: - |
Stock7 936 |
|
- | - | - | - | - | - |