Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC CLK BUFFER 1:5 3GHZ 32LQFP
|
paquet: 32-LQFP |
Stock3 056 |
|
2 | 1:5 | Yes/Yes | ECL, PECL | ECL, PECL | 3GHz | 2.375 V ~ 3.465 V | 0°C ~ 110°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
NXP |
IC CLK BUFFER 2:4 2.5GHZ 16TSSOP
|
paquet: 16-TSSOP (0.173", 4.40mm Width) |
Stock7 856 |
|
1 | 2:4 | Yes/Yes | HSTL, LVPECL | LVPECL | 2.5GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
NXP |
IC CLK BUFFER 2:10 2.7GHZ 32LQFP
|
paquet: 32-LQFP |
Stock36 288 |
|
1 | 2:10 | Yes/Yes | ECL, HSTL, PECL | ECL, PECL | 2.7GHz | 2.375 V ~ 3.465 V | -40°C ~ 110°C | Surface Mount | 32-LQFP | 32-LQFP (9x9) |
||
NXP |
IC CLK BUFFER 2:1 3GHZ 20TSSOP
|
paquet: 20-TSSOP (0.173", 4.40mm Width) |
Stock7 280 |
|
2 | 2:1 | Yes/Yes | ECL, PECL, LVDS | ECL, PECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
NXP |
IC CLK BUFFER 2:5 2GHZ 20TSSOP
|
paquet: 20-TSSOP (0.173", 4.40mm Width) |
Stock7 232 |
|
1 | 2:5 | Yes/Yes | ECL, HSTL, PECL | ECL, PECL | 2GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
NXP |
IC CLK BUFFER 1:2 3GHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 584 |
|
1 | 1:2 | Yes/Yes | ECL | ECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
NXP |
IC CLK BUFFER 3:15 200MHZ 52LQFP
|
paquet: 52-LQFP |
Stock6 368 |
|
1 | 3:15 | Yes/No | LVCMOS, LVPECL | LVCMOS | 200MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 52-LQFP | 52-LQFP (10x10) |
||
NXP |
IC CLK BUFFER 2:12 350MHZ 32LQFP
|
paquet: 32-LQFP |
Stock2 320 |
|
1 | 2:12 | Yes/No | LVCMOS, LVPECL | LVCMOS | 350MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
NXP |
IC CLK BUFFER 2:10 250MHZ 32LQFP
|
paquet: 32-LQFP |
Stock16 740 |
|
1 | 2:10 | No/No | LVCMOS | LVCMOS | 250MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (9x9) |
||
NXP |
IC CLK BUFFER 1:6 100MHZ 16SOIC
|
paquet: 16-SOIC (0.154", 3.90mm Width) |
Stock54 408 |
|
1 | 1:6 | Yes/No | TTL, Crystal | LVCMOS | 100MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
NXP |
IC CLK BUFFER 2:10 2.7GHZ 32LQFP
|
paquet: 32-LQFP |
Stock191 100 |
|
1 | 2:10 | Yes/Yes | ECL, HSTL, PECL | ECL, PECL | 2.7GHz | 2.375 V ~ 3.465 V | -40°C ~ 110°C | Surface Mount | 32-LQFP | 32-LQFP (9x9) |
||
NXP |
IC CLK BUFFER 1:10 250MHZ 32LQFP
|
paquet: 32-LQFP |
Stock5 376 |
|
1 | 1:10 | Yes/No | LVPECL | LVCMOS | 250MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
NXP |
IC CLK BUFFER 3:15 200MHZ 52LQFP
|
paquet: 52-LQFP |
Stock4 992 |
|
1 | 3:15 | Yes/No | LVCMOS, LVPECL | LVCMOS | 200MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 52-LQFP | 52-LQFP (10x10) |
||
NXP |
IC CLK BUFFER 2:12 350MHZ 32LQFP
|
paquet: 32-LQFP |
Stock11 412 |
|
1 | 2:12 | Yes/No | LVCMOS, LVPECL | LVCMOS | 350MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
NXP |
IC CLK BUFFER 2:9 350MHZ 32LQFP
|
paquet: 32-LQFP |
Stock5 648 |
|
1 | 2:9 | No/No | LVCMOS | LVCMOS | 350MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
NXP |
IC CLK BUFFER 2:10 250MHZ 32LQFP
|
paquet: 32-LQFP |
Stock12 624 |
|
1 | 2:10 | No/No | LVCMOS | LVCMOS | 250MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (9x9) |
||
NXP |
IC CLK BUFFER 2:16 350MHZ 48LQFP
|
paquet: 48-LQFP |
Stock8 916 |
|
1 | 2:16 | Yes/No | LVCMOS, LVPECL | LVCMOS | 350MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
NXP |
IC CLK BUFFER 2:27 250MHZ 48LQFP
|
paquet: 48-LQFP |
Stock3 568 |
|
1 | 2:27 | Yes/No | LVCMOS, LVPECL | LVCMOS | 250MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
NXP |
IC CLK BUFFER 2:3 3GHZ 32LQFP
|
paquet: 32-LQFP |
Stock6 352 |
|
2 | 2:3 | Yes/Yes | LVCMOS, LVPECL | LVPECL | 3GHz | 2.375 V ~ 3.465 V | -40°C ~ 110°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
NXP |
IC CLK BUFFER 1:9 3GHZ 32LQFP
|
paquet: 32-LQFP |
Stock2 496 |
|
1 | 1:9 | Yes/Yes | LVPECL | LVCMOS, LVPECL | 3GHz | 2.375 V ~ 3.465 V | 0°C ~ 110°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
NXP |
IC CLK BUFFER 2:15 3GHZ 52LQFP
|
paquet: 52-LQFP Exposed Pad |
Stock7 120 |
|
1 | 2:15 | Yes/Yes | ECL, PECL | ECL, PECL | 3GHz | 2.375 V ~ 3.465 V | -40°C ~ 110°C | Surface Mount | 52-LQFP Exposed Pad | 52-LQFP (10x10) |
||
NXP |
IC CLK BUFFER 2:20 2GHZ 52LQFP
|
paquet: 52-LQFP Exposed Pad |
Stock3 952 |
|
1 | 2:20 | Yes/Yes | ECL, HSTL, PECL | ECL, PECL | 2GHz | 2.375 V ~ 3.465 V | -40°C ~ 110°C | Surface Mount | 52-LQFP Exposed Pad | 52-LQFP (10x10) |
||
NXP |
IC CLK BUFFER 1:10 1GHZ 52LQFP
|
paquet: 52-LQFP Exposed Pad |
Stock5 520 |
|
2 | 1:10 | Yes/Yes | ECL, PECL | ECL, PECL | 1GHz | 2.375 V ~ 3.465 V | -40°C ~ 110°C | Surface Mount | 52-LQFP Exposed Pad | 52-LQFP (10x10) |
||
NXP |
IC CLK BUFFER 1:5 3GHZ 32LQFP
|
paquet: 32-LQFP |
Stock4 400 |
|
2 | 1:5 | Yes/Yes | ECL, PECL | ECL, PECL | 3GHz | 2.375 V ~ 3.465 V | 0°C ~ 110°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
NXP |
IC CLK BUFFER 2:10 2.7GHZ 32LQFP
|
paquet: 32-LQFP |
Stock23 100 |
|
1 | 2:10 | Yes/Yes | ECL, HSTL, PECL | ECL, PECL | 2.7GHz | 2.375 V ~ 3.465 V | -40°C ~ 110°C | Surface Mount | 32-LQFP | 32-LQFP (9x9) |
||
NXP |
PROCESSOR
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |
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NXP |
INTEGRATED CIRCUIT
|
paquet: - |
Request a Quote |
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- | - | - | - | - | - | - | - | - | - | - |
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NXP |
INTEGRATED CIRCUIT
|
paquet: - |
Request a Quote |
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- | - | - | - | - | - | - | - | - | - | - |