Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 16KBIT 2MHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock4 528 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 2MHz | 5ms | - | 2.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
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Microchip Technology |
IC EEPROM 16KBIT 3MHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock2 064 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
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Microchip Technology |
IC EEPROM 16KBIT 3MHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock4 848 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
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Microchip Technology |
IC EEPROM 16KBIT 1MHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock4 944 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | SPI | 1MHz | 5ms | - | 1.8 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
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Microchip Technology |
IC FLASH 4MBIT 70NS 48TSOP
|
paquet: 48-TFSOP (0.724", 18.40mm Width) |
Stock7 456 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
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Microchip Technology |
IC FLASH 4MBIT 70NS 48TSOP
|
paquet: 48-TFSOP (0.724", 18.40mm Width) |
Stock3 856 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC FLASH 4MBIT 70NS 48TSOP
|
paquet: 48-TFSOP (0.724", 18.40mm Width) |
Stock2 496 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC FLASH 4MBIT 70NS 48TSOP
|
paquet: 48-TFSOP (0.724", 18.40mm Width) |
Stock7 376 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
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Microchip Technology |
IC FLASH 4MBIT 70NS 48TSOP
|
paquet: 48-TFSOP (0.724", 18.40mm Width) |
Stock3 680 |
|
FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 10µs | 70ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 48-TFSOP (0.724", 18.40mm Width) | 48-TSOP |
||
Microchip Technology |
IC FLASH 1MBIT 33MHZ 8WSON
|
paquet: 8-WDFN Exposed Pad |
Stock5 040 |
|
FLASH | FLASH | 1Mb (128K x 8) | SPI | 33MHz | 20µs | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON |
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Microchip Technology |
IC FLASH 1MBIT 33MHZ 8WSON
|
paquet: 8-WDFN Exposed Pad |
Stock23 280 |
|
FLASH | FLASH | 1Mb (128K x 8) | SPI | 33MHz | 20µs | - | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON |
||
Microchip Technology |
IC EERAM 16KBIT 1MHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock3 840 |
|
EERAM | EEPROM, SRAM | 16Kb (2K x 8) | I2C | 1MHz | 1ms | 400ns | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EERAM 16KBIT 1MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock6 768 |
|
EERAM | EEPROM, SRAM | 16Kb (2K x 8) | I2C | 1MHz | 1ms | 400ns | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EERAM 16KBIT 1MHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock6 224 |
|
EERAM | EEPROM, SRAM | 16Kb (2K x 8) | I2C | 1MHz | 1ms | 400ns | 2.7 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EERAM 16KBIT 1MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock4 656 |
|
EERAM | EEPROM, SRAM | 16Kb (2K x 8) | I2C | 1MHz | 1ms | 400ns | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 4MBIT 40MHZ 8SOIC
|
paquet: - |
Stock2 544 |
|
FLASH | FLASH | 4Mb (512K x 8) | SPI | 40MHz | 5ms | - | 2.3 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
Microchip Technology |
IC FLASH 2MBIT 33MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock54 228 |
|
FLASH | FLASH | 2Mb (256K x 8) | SPI | 33MHz | 20µs | - | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC FLASH 2MBIT 33MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock3 568 |
|
FLASH | FLASH | 2Mb (256K x 8) | SPI | 33MHz | 20µs | - | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 5MHZ M2P
|
paquet: M2 P, Smart Card Module (TWI) |
Stock7 968 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I2C | 5MHz | 5ms | 35µs | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | M2 P, Smart Card Module (TWI) | M2 - P Module (TWI) |
||
Microchip Technology |
IC EEPROM 8KBIT 4MHZ M2P
|
paquet: M2 P, Smart Card Module (ISO) |
Stock5 312 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I2C | 4MHz | 5ms | 250ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | M2 P, Smart Card Module (ISO) | M2 - P Module (ISO) |
||
Microchip Technology |
IC EEPROM 256KBIT 400KHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock7 040 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 256KBIT 400KHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock2 176 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 256KBIT 400KHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock4 576 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 8KBIT 3MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock29 304 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 8KBIT 3MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock2 928 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 8KBIT 2MHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock4 624 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 2MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 8KBIT 3MHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock5 616 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 3MHz | 5ms | - | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FLASH 512KBIT 33MHZ 8WSON
|
paquet: 8-WDFN Exposed Pad |
Stock3 936 |
|
FLASH | FLASH | 512Kb (64K x 8) | SPI | 33MHz | 20µs | - | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON |