Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 16KBIT 5MHZ M2J
|
paquet: M2 J, Smart Card Module (TWI) |
Stock7 392 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I2C | 5MHz | 5ms | 35µs | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | M2 J, Smart Card Module (TWI) | M2 - J Module (TWI) |
||
Microchip Technology |
IC EEPROM 8KBIT 5MHZ M2P
|
paquet: M2 P, Smart Card Module (TWI) |
Stock2 768 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I2C | 5MHz | 5ms | 35µs | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | M2 P, Smart Card Module (TWI) | M2 - P Module (TWI) |
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Microchip Technology |
IC EEPROM 8KBIT 4MHZ M2J
|
paquet: M2 J, Smart Card Module (ISO) |
Stock4 400 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I2C | 4MHz | 5ms | 250ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | M2 J, Smart Card Module (ISO) | M2 - J Module (ISO) |
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Microchip Technology |
IC EEPROM 4KBIT 4MHZ M2P
|
paquet: M2 P, Smart Card Module (ISO) |
Stock7 152 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I2C | 4MHz | 5ms | 250ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | M2 P, Smart Card Module (ISO) | M2 - P Module (ISO) |
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Microchip Technology |
IC EEPROM 256KBIT 400KHZ 8TDFN
|
paquet: 8-WFDFN Exposed Pad |
Stock5 904 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
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Microchip Technology |
IC EEPROM 256KBIT 400KHZ 8TDFN
|
paquet: 8-WFDFN Exposed Pad |
Stock7 200 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-WFDFN Exposed Pad | 8-TDFN (2x3) |
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Microchip Technology |
IC EEPROM 256KBIT 400KHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock4 224 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 400kHz | 5ms | 900ns | 2.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EEPROM 256KBIT 1MHZ 8MSOP
|
paquet: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock6 672 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 1MHz | 5ms | 400ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
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Microchip Technology |
IC EEPROM 256KBIT 400KHZ 8MSOP
|
paquet: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock7 296 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 400kHz | 5ms | 900ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
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Microchip Technology |
IC EEPROM 256KBIT 1MHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock5 184 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | I2C | 1MHz | 5ms | 400ns | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
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Microchip Technology |
IC EEPROM 16KBIT 3MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock36 000 |
|
EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 3MHz | 5ms | - | 2.5 V ~ 6.0 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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Microchip Technology |
IC EEPROM 8KBIT 3MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock4 320 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 5ms | - | 2.5 V ~ 6.0 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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Microchip Technology |
IC EEPROM 8KBIT 3MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock25 968 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 5ms | - | 2.5 V ~ 6.0 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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Microchip Technology |
IC EEPROM 8KBIT 3MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock28 368 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 5ms | - | 2.5 V ~ 6.0 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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Microchip Technology |
IC EEPROM 16KBIT 3MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock3 392 |
|
EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 3MHz | 5ms | - | 1.8 V ~ 6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 3MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock6 448 |
|
EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 3MHz | 5ms | - | 1.8 V ~ 6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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Microchip Technology |
IC EEPROM 8KBIT 3MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock24 528 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 5ms | - | 1.8 V ~ 6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 8KBIT 3MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock7 488 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 5ms | - | 1.8 V ~ 6 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 16KBIT 3MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock10 368 |
|
EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 3MHz | 5ms | - | 2.5 V ~ 6.0 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 8KBIT 3MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock21 588 |
|
EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 5ms | - | 2.5 V ~ 6.0 V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC EEPROM 32KBIT 2MHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock6 264 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | SPI | 2MHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM 8KBIT 5MHZ M2J
|
paquet: M2 J, Smart Card Module (TWI) |
Stock6 384 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I2C | 5MHz | 5ms | 35µs | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | M2 J, Smart Card Module (TWI) | M2 - J Module (TWI) |
||
Microchip Technology |
IC EEPROM 4KBIT 5MHZ M2P
|
paquet: M2 P, Smart Card Module (TWI) |
Stock4 848 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I2C | 5MHz | 5ms | 35µs | 2.7 V ~ 5.5 V | 0°C ~ 70°C (TC) | Surface Mount | M2 P, Smart Card Module (TWI) | M2 - P Module (TWI) |
||
Microchip Technology |
IC EEPROM 4KBIT 4MHZ M2J
|
paquet: M2 J, Smart Card Module (ISO) |
Stock2 448 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | I2C | 4MHz | 5ms | 250ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | M2 J, Smart Card Module (ISO) | M2 - J Module (ISO) |
||
Microchip Technology |
IC EEPROM 2KBIT 4MHZ M2P
|
paquet: M2 P, Smart Card Module (ISO) |
Stock4 192 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | I2C | 4MHz | 5ms | 250ns | 2.7 V ~ 3.6 V | 0°C ~ 70°C (TC) | Surface Mount | M2 P, Smart Card Module (ISO) | M2 - P Module (ISO) |
||
Microchip Technology |
IC SRAM 64KBIT 20MHZ 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock5 728 |
|
SRAM | SRAM | 64Kb (8K x 8) | SPI | 20MHz | - | - | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
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Microchip Technology |
IC EERAM 4KBIT 1MHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock6 784 |
|
EERAM | EEPROM, SRAM | 4Kb (512 x 8) | I2C | 1MHz | 1ms | 400ns | 2.7 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC EERAM 4KBIT 1MHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock7 904 |
|
EERAM | EEPROM, SRAM | 4Kb (512 x 8) | I2C | 1MHz | 1ms | 400ns | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |