Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
paquet: 12-WFDFN Exposed Pad |
Stock6 160 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
paquet: 12-WFDFN Exposed Pad |
Stock3 232 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
paquet: 12-WFDFN Exposed Pad |
Stock6 704 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVPECL | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
paquet: 12-WFDFN Exposed Pad |
Stock3 248 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVDS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER 1:3 1.8GHZ
|
paquet: 36-WFQFN Exposed Pad |
Stock7 536 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVPECL | 1.8GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
Linear Technology |
IC CLK BUFFER 1:3 1.4GHZ
|
paquet: 36-WFQFN Exposed Pad |
Stock7 760 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS, LVPECL | 1.4GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
Linear Technology |
IC CLK BUFFER 1:3 1.4GHZ
|
paquet: 36-WFQFN Exposed Pad |
Stock6 800 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS, LVPECL | 1.4GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
Linear Technology |
IC CLK BUFFER 1:3 1.4GHZ
|
paquet: 36-WFQFN Exposed Pad |
Stock6 816 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS | 1.4GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
paquet: 12-TSSOP (0.118", 3.00mm Width) |
Stock6 736 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 125°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
paquet: 12-TSSOP (0.118", 3.00mm Width) |
Stock2 000 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVDS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 125°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
paquet: 12-TSSOP (0.118", 3.00mm Width) |
Stock25 200 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVPECL | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 125°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
paquet: 12-TSSOP (0.118", 3.00mm Width) |
Stock7 296 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
paquet: 12-WFDFN Exposed Pad |
Stock60 000 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVPECL | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
paquet: 12-TSSOP (0.118", 3.00mm Width) |
Stock44 400 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVPECL | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
paquet: 12-TSSOP (0.118", 3.00mm Width) |
Stock18 000 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 125°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
paquet: 12-WFDFN Exposed Pad |
Stock63 600 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
paquet: 12-WFDFN Exposed Pad |
Stock108 000 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVDS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
paquet: 12-WFDFN Exposed Pad |
Stock84 000 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
paquet: 12-TSSOP (0.118", 3.00mm Width) |
Stock19 644 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVDS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12MSOP
|
paquet: 12-TSSOP (0.118", 3.00mm Width) |
Stock15 552 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-TSSOP (0.118", 3.00mm Width) | 12-MSOP |
||
Linear Technology |
IC POWER MANAGEMENT
|
paquet: 12-WFDFN Exposed Pad |
Stock4 976 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC POWER MANAGEMENT
|
paquet: 12-WFDFN Exposed Pad |
Stock7 792 |
|
1 | 1:2 | Yes/No | CML, CMOS, LVDS, LVPECL | CMOS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC POWER MANAGEMENT
|
paquet: 12-WFDFN Exposed Pad |
Stock5 264 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVDS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC POWER MANAGEMENT
|
paquet: 12-WFDFN Exposed Pad |
Stock5 248 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVPECL | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Linear Technology |
IC POWER MANAGEMENT
|
paquet: 36-WFQFN Exposed Pad |
Stock7 280 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS | 1.4GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
Linear Technology |
IC POWER MANAGEMENT
|
paquet: 36-WFQFN Exposed Pad |
Stock4 320 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS, LVPECL | 1.4GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
Linear Technology |
IC POWER MANAGEMENT
|
paquet: 36-WFQFN Exposed Pad |
Stock7 088 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVCMOS, LVDS, LVPECL | 1.4GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |
||
Linear Technology |
IC POWER MANAGEMENT
|
paquet: 36-WFQFN Exposed Pad |
Stock5 952 |
|
1 | 1:3 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVPECL | 1.8GHz | 3.15 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 36-WFQFN Exposed Pad | 36-QFN (4x7) |