Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Voltage - Collector Emitter Breakdown (Max) | Current - Collector (Ic) (Max) | Current - Collector Pulsed (Icm) | Vce(on) (Max) @ Vge, Ic | Power - Max | Switching Energy | Input Type | Gate Charge | Td (on/off) @ 25°C | Test Condition | Reverse Recovery Time (trr) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
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Infineon Technologies |
IGBT TRENCH FS 600V 10A DIE
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600 V | 10 A | 30 A | 1.9V @ 15V, 10A | - | - | Standard | - | - | - | - | -40°C ~ 175°C (TJ) | Surface Mount | Die | Die |
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Infineon Technologies |
IGBT TRENCH FS 650V 30A DIE
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650 V | 30 A | 90 A | 2.32V @ 15V, 30A | - | - | Standard | - | - | - | - | -40°C ~ 175°C (TJ) | Surface Mount | Die | Die |
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Infineon Technologies |
IGBT 3 CHIP 600V WAFER
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paquet: - |
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600 V | 6 A | 18 A | 2.5V @ 15V, 6A | - | - | Standard | - | 21ns/110ns | 300V, 6A, 54Ohm, 15V | - | -55°C ~ 150°C (TJ) | Surface Mount | Die | Die |
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Infineon Technologies |
IGBT 3 CHIP 600V WAFER
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600 V | 6 A | 18 A | 2.5V @ 15V, 6A | - | - | Standard | - | 21ns/110ns | 300V, 6A, 54Ohm, 15V | - | -55°C ~ 150°C (TJ) | Surface Mount | Die | Die |
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Infineon Technologies |
IGBT CHIP
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paquet: - |
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600 V | 75 A | - | 2.1V @ 15V, 75A | - | - | Standard | 150 nC | 50ns/200ns | 400V, 75A, 10Ohm, 15V | - | -55°C ~ 175°C (TJ) | Surface Mount | Die | Die |
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Infineon Technologies |
IGBT 1200V 25A DIE
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1200 V | - | 75 A | 2.07V @ 15V, 25A | - | - | Standard | - | - | - | - | -40°C ~ 175°C (TJ) | Surface Mount | Die | Die |
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Infineon Technologies |
IGBT TRENCH FS 1200V 30A TO247-3
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paquet: - |
Stock909 |
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1200 V | 30 A | 60 A | 2.4V @ 15V, 15A | 217 W | 1.55mJ | Standard | 75 nC | 21ns/260ns | 600V, 15A, 35Ohm, 15V | - | -40°C ~ 175°C (TJ) | Through Hole | TO-247-3 | PG-TO247-3-1 |
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Infineon Technologies |
DISCRETE SWITCHES
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650 V | 50 A | - | - | - | - | Standard | - | - | - | - | - | Surface Mount | TO-263-3, D2PAK (2 Leads + Tab), TO-263AB | PG-TO263-3-2 |
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Infineon Technologies |
IGBT 3 CHIP 600V WAFER
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paquet: - |
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600 V | 50 A | 150 A | 3.15V @ 15V, 50A | - | - | Standard | - | 48ns/350ns | 400V, 50A, 6.8Ohm, 15V | - | -55°C ~ 150°C (TJ) | Surface Mount | Die | Die |
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Infineon Technologies |
IGBT 3 CHIP 600V WAFER
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paquet: - |
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600 V | 50 A | 150 A | 3.15V @ 15V, 50A | - | - | Standard | - | 48ns/350ns | 400V, 50A, 6.8Ohm, 15V | - | -55°C ~ 150°C (TJ) | Surface Mount | Die | Die |
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Infineon Technologies |
IGBT 3 CHIP 600V WAFER
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paquet: - |
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600 V | 100 A | 300 A | 2.5V @ 15V, 100A | - | - | Standard | - | 65ns/450ns | 400V, 100A, 3.3Ohm, 15V | - | -55°C ~ 150°C (TJ) | Surface Mount | Die | Die |
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Infineon Technologies |
IGBT 1200V TO247-3
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1200 V | 141 A | 99 A | 1.7V @ 15V, 33A | 543 W | 16mJ (off) | Standard | 227 nC | -/616ns | 600V, 33A, 5Ohm, 15V | - | -55°C ~ 150°C (TJ) | Through Hole | TO-247-3 | TO-247AC |
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Infineon Technologies |
IGBT NPT 600V 31A TO263-3
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600 V | 31 A | 62 A | 2.4V @ 15V, 15A | 139 W | 570µJ | Standard | 76 nC | 32ns/234ns | 400V, 15A, 21Ohm, 15V | - | -55°C ~ 150°C (TJ) | Surface Mount | TO-263-3, D2PAK (2 Leads + Tab), TO-263AB | PG-TO263-3-2 |
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Infineon Technologies |
IGBT 750V 200A TO247-3
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paquet: - |
Stock648 |
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750 V | 200 A | 480 A | 1.65V @ 15V, 160A | 750 W | 9.7mJ (on), 5.2mJ (off) | Standard | 610 nC | 72ns/324ns | 450V, 160A, 4.8Ohm, 15V | - | -40°C ~ 175°C (TJ) | Through Hole | TO-247-3 | PG-TO247-3-51 |
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Infineon Technologies |
IGBT 3 CHIP 600V WAFER
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paquet: - |
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600 V | 15 A | 45 A | 2.5V @ 15V, 15A | - | - | Standard | - | 31ns/261ns | 400V, 15A, 21Ohm, 15V | - | -55°C ~ 150°C (TJ) | Surface Mount | Die | Die |
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Infineon Technologies |
IGBT 3 CHIP 600V WAFER
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600 V | 15 A | 45 A | 2.5V @ 15V, 15A | - | - | Standard | - | 31ns/261ns | 400V, 15A, 21Ohm, 15V | - | -55°C ~ 150°C (TJ) | Surface Mount | Die | Die |
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Infineon Technologies |
IGBT TRENCH FS 650V 9A TO252-3
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paquet: - |
Stock23 274 |
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650 V | 9 A | 18 A | 1.9V @ 15V, 3A | 31 W | 60µJ (on), 30µJ (off) | Standard | 13.7 nC | 15ns/35ns | 400V, 3A, 47Ohm, 15V | 30 ns | -40°C ~ 175°C (TJ) | Surface Mount | TO-252-3, DPAK (2 Leads + Tab), SC-63 | PG-TO252-3 |
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Infineon Technologies |
IGBT CHIP
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paquet: - |
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650 V | - | - | 1.9V @ 15V, 200A | - | - | Standard | 380 nC | 130ns/280ns | 400V, 200A, 5Ohm, 15V | - | -40°C ~ 175°C (TJ) | Surface Mount | Die | Die |
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Infineon Technologies |
IGBT CHIP
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paquet: - |
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650 V | - | - | 1.9V @ 15V, 150A | - | - | Standard | 310 nC | 95ns/220ns | 400V, 150A, 5Ohm, 15V | - | -40°C ~ 175°C (TJ) | Surface Mount | Die | Die |
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Infineon Technologies |
IGBT TRENCH 600V 30A TO252-3
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600 V | 30 A | 45 A | 2.1V @ 15V, 15A | 250 W | 900µJ | Standard | 90 nC | 16ns/183ns | 400V, 15A, 15Ohm, 15V | 110 ns | -40°C ~ 175°C (TJ) | Surface Mount | TO-252-3, DPAK (2 Leads + Tab), SC-63 | PG-TO252-3-11 |
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Infineon Technologies |
HOME APPLIANCES 14
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1400 V | 40 A | 60 A | 1.9V @ 15V, 20A | 211 W | -, 70µJ (off) | Standard | 125 nC | -/150ns | 25V, 20A, 2.2Ohm, 15V | - | -40°C ~ 175°C (TJ) | Through Hole | TO-247-3 | PG-TO247-44 |
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Infineon Technologies |
IGBT NPT 650V 50A TO263-3
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paquet: - |
Stock8 511 |
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650 V | 50 A | - | - | - | - | Standard | - | - | - | - | - | Surface Mount | TO-263-3, D2PAK (2 Leads + Tab), TO-263AB | PG-TO263-3-2 |
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Infineon Technologies |
F5L200R12 = IGBT MODULE
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- | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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Infineon Technologies |
IGBT TRENCH FS 650V 9A TO252-3
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paquet: - |
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650 V | 9 A | 18 A | 1.9V @ 15V, 3A | 31 W | 60µJ (on), 30µJ (off) | Standard | 13.7 nC | 15ns/35ns | 400V, 3A, 47Ohm, 15V | - | -40°C ~ 175°C (TJ) | Surface Mount | TO-252-3, DPAK (2 Leads + Tab), SC-63 | PG-TO252-3 |
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Infineon Technologies |
IGBT TRENCH 650V 75A TO247-3
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paquet: - |
Stock738 |
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650 V | 75 A | 120 A | 1.85V @ 15V, 40A | 175 W | 1.09mJ (on), 570µJ (off) | Standard | 117 nC | 37ns/353ns | 400V, 40A, 27Ohm, 15V | 79 ns | -40°C ~ 175°C (TJ) | Through Hole | TO-247-3 | PG-TO247-3-32 |
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Infineon Technologies |
IGBT 600V 50A TO247-3
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600 V | 53 A | 150 A | 2.7V @ 15V, 50A | 141 W | 1.57mJ (on), 720µJ (off) | Standard | 210 nC | 23ns/170ns | 400V, 50A, 7Ohm, 15V | 68 ns | -40°C ~ 175°C (TJ) | Through Hole | TO-247-3 | PG-TO247-3-AI |
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Infineon Technologies |
IGBT CHIP
|
paquet: - |
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600 V | 30 A | - | 1.35V @ 15V, 6A | - | - | Standard | - | - | - | - | - | Surface Mount | Die | Die |
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Infineon Technologies |
IGBT TRENCH FS 600V 30A TO252-3
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paquet: - |
Stock16 824 |
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600 V | 30 A | 45 A | 2.5V @ 15V, 15A | 250 W | 270µJ (on), 250µJ (off) | Standard | 90 nC | 13ns/160ns | 400V, 15A, 15Ohm, 15V | 74 ns | -40°C ~ 175°C (TJ) | Surface Mount | TO-252-3, DPAK (2 Leads + Tab), SC-63 | PG-TO252-3 |