Produits NXP

BSH205,215

NXP

MOSFET P-CH 12V 0.75A SOT-23

• FET Type: P-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 12V
• Current - Continuous Drain (Id) @ 25°C: 750mA (Ta)
• Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
• Vgs(th) (Max) @ Id: 680mV @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: 3.8nC @ 4.5V
• Input Capacitance (Ciss) (Max) @ Vds: 200pF @ 9.6V
• Vgs (Max): ±8V
• FET Feature: -
• Power Dissipation (Max): 417mW (Ta)
• Rds On (Max) @ Id, Vgs: 400 mOhm @ 430mA, 4.5V
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: TO-236AB (SOT23)
• Package / Case: TO-236-3, SC-59, SOT-23-3

paquet: TO-236-3, SC-59, SOT-23-3

BF904AR,215

NXP

MOSFET N-CH 7V 30MA SOT143

• Transistor Type: N-Channel Dual Gate
• Frequency: 200MHz
• Gain: -
• Voltage - Test: 4V
• Current Rating: 30mA
• Noise Figure: 1dB
• Current - Test: 10mA
• Power - Output: -
• Voltage - Rated: 7V
• Package / Case: SOT-143R
• Supplier Device Package: SOT-143R

paquet: SOT-143R

BFG480W,115

NXP

TRANS NPN 4.5V 21GHZ SOT343R

• Transistor Type: NPN
• Voltage - Collector Emitter Breakdown (Max): 4.5V
• Frequency - Transition: 21GHz
• Noise Figure (dB Typ @ f): 1.2dB ~ 1.8dB @ 900MHz ~ 2GHz
• Gain: 16dB
• Power - Max: 360mW
• DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 80mA, 2V
• Current - Collector (Ic) (Max): 250mA
• Operating Temperature: 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: SC-82A, SOT-343
• Supplier Device Package: CMPAK-4

paquet: SC-82A, SOT-343

MC33908AER2

NXP

IC SBC CAN/LIN 48LQFP

• Applications: Power Supply, Automotive Applications
• Voltage - Input: -1 V ~ 40 V
• Number of Outputs: 6
• Voltage - Output: Multiple
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP-EP (7x7)

paquet: 48-LQFP Exposed Pad

CBTS3257DS,112

NXP

IC 4BIT 1OF2 MUX/DEMUX 16QSOP

• Type: Multiplexer/Demultiplexer
• Circuit: 4 x 2:1
• Independent Circuits: 1
• Current - Output High, Low: -
• Voltage Supply Source: Single Supply
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-SSOP (0.154", 3.90mm Width)
• Supplier Device Package: 16-SSOP

paquet: 16-SSOP (0.154", 3.90mm Width)

HEF4025BP,652

NXP

IC GATE NOR 3CH 3-INP 14-DIP

• Logic Type: NOR Gate
• Number of Circuits: 3
• Number of Inputs: 3
• Features: -
• Voltage - Supply: 3 V ~ 15 V
• Current - Quiescent (Max): 4µA
• Current - Output High, Low: 3mA, 3mA
• Logic Level - Low: 1.5 V ~ 4 V
• Logic Level - High: 3.5 V ~ 11 V
• Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Supplier Device Package: 14-DIP
• Package / Case: 14-DIP (0.300", 7.62mm)

paquet: 14-DIP (0.300", 7.62mm)

MB2244BB,518

NXP

IC 16BIT BUFF/LINE DRIVER 52QFP

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 4
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 52-QFP
• Supplier Device Package: 52-QFP (10x10)

paquet: 52-QFP

BGD702/09,112

NXP

IC AMP MODULE 750MHZ SOT115J

• Applications: CATV
• Output Type: -
• Number of Circuits: 1
• -3db Bandwidth: -
• Slew Rate: -
• Current - Supply: 425mA
• Current - Output / Channel: -
• Voltage - Supply, Single/Dual (±): -
• Mounting Type: -
• Package / Case: SOT-115J
• Supplier Device Package: SOT115J

paquet: SOT-115J

TDA1308T/N1,112

NXP

IC AMP AUDIO .08W STER AB 8SOIC

• Type: Class AB
• Output Type: Headphones, 2-Channel (Stereo)
• Max Output Power x Channels @ Load: 80mW x 2 @ 32 Ohm
• Voltage - Supply: 3 V ~ 7 V, ±1.5 V ~ 3.5 V
• Features: Depop, Short-Circuit Protection
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 8-SO
• Package / Case: 8-SOIC (0.154", 3.90mm Width)

paquet: 8-SOIC (0.154", 3.90mm Width)

PCA9522DP,118

NXP

IC REDRIVER I2C 1CH 8TSSOP

• Type: Buffer, ReDriver
• Applications: I2C
• Input: 2-Wire Bus
• Output: 2-Wire Bus
• Data Rate (Max): 400kHz
• Number of Channels: 1
• Delay Time: -
• Signal Conditioning: -
• Capacitance - Input: -
• Voltage - Supply: 2.5 V ~ 5.5 V
• Current - Supply: 9mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: -
• Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
• Supplier Device Package: 8-TSSOP

paquet: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

PCA9500PW,118

NXP

IC I/O EXPANDER I2C 8B 16TSSOP

• Number of I/O: 8
• Interface: I2C, SMBus
• Interrupt Output: No
• Features: EEPROM, POR
• Output Type: Push-Pull
• Current - Output Source/Sink: 100µA, 25mA
• Clock Frequency: 400kHz
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

paquet: 16-TSSOP (0.173", 4.40mm Width)

KMPC860ENCZQ66D4

NXP

IC MPU MPC8XX 66MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 66MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

paquet: 357-BBGA

MPC8347ECZUAGDB

NXP

IC MPU MPC83XX 400MHZ 672TBGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 672-LBGA
• Supplier Device Package: 672-TBGA (35x35)

paquet: 672-LBGA

BSC9131NXN1KHKB

NXP

IC MPU Q OR IQ 800MHZ 520FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Signal Processing; SC3850
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 520-FBGA, FCBGA
• Supplier Device Package: 520-FCBGA (21x21)

paquet: 520-FBGA, FCBGA

MPXD2020VVU125

NXP

IC MCU 32BIT 2MB FLASH 416BGA

• Core Processor: e200z4d
• Core Size: 32-Bit
• Speed: 125MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI, UART/USART
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 177
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 20x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 416-BBGA
• Supplier Device Package: 416-PBGA (27x27)

paquet: 416-BBGA

MC908JK3CDWE

NXP

IC MCU 8BIT 4KB FLASH 20SOIC

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: -
• Peripherals: LED, LVD, POR, PWM
• Number of I/O: 15
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.3 V
• Data Converters: A/D 12x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

paquet: 20-SOIC (0.295", 7.50mm Width)

MC9S08RG32CFJE

NXP

IC MCU 8BIT 32KB FLASH 32LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 25
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

paquet: 32-LQFP

LPC4317JET100E

NXP

IC MCU 32BIT 1MB FLASH 100TFBGA

• Core Processor: ARM? Cortex?-M4/M0
• Core Size: 32-Bit Dual-Core
• Speed: 204MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
• Number of I/O: 49
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 16K x 8
• RAM Size: 136K x 8
• Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 4x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-TFBGA
• Supplier Device Package: 100-TFBGA (9x9)

paquet: 100-TFBGA

MKL15Z128CAD4R

NXP

IC MCU 32BIT 128KB FLASH 35WLCSP

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
• Number of I/O: 31
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 9x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 35-UFBGA, WLCSP
• Supplier Device Package: 35-WLCSP (2.53x2.98)

paquet: 35-UFBGA, WLCSP

MC9S08SH8CWJ

NXP

IC MCU 8BIT 8KB FLASH 20SOIC

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 17
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

paquet: 20-SOIC (0.295", 7.50mm Width)

MMA2712WR2

NXP

ACCELEROMETER 125G PCM/SPI 16QFN

• Type: Digital
• Axis: X
• Acceleration Range: ±125g
• Sensitivity (LSB/g): 4.096
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: PCM, SPI
• Voltage - Supply: 4 V ~ 20 V
• Features: Selectable Low Pass Filter
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-QFN
• Supplier Device Package: 16-QFN (6x6)

paquet: 16-QFN

PTN5110NHQZ

NXP

TYPE-C USB-PD PHY WITH TCPC FOR

• Applications: USB
• Interface: I²C
• Voltage - Supply: 2.7 V ~ 5.5 V
• Package / Case: 16-XFQFN Exposed Pad
• Supplier Device Package: 16-HX2QFN (2.6x2.6)
• Mounting Type: Surface Mount

paquet: 16-XFQFN Exposed Pad

MCIMX6L2DVN10AC

NXP

I.MX 6SL ROM PERF ENHAN

• Core Processor: ARM® Cortex®-A9
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Multimedia; NEON™ SIMD
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (3)
• Voltage - I/O: 1.2V, 1.8V, 3.0V
• Operating Temperature: 0°C ~ 95°C (TJ)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 432-TFBGA
• Supplier Device Package: 432-MAPBGA (13x13)

paquet: 432-TFBGA

SPC5604CK0VLL6R

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 79
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 48K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 28x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

paquet: 100-LQFP

MKE02Z32VFM4R

NXP

KINETIS KE02: 40MHZ CORTEX-M0+ 5

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: LVD, PWM, WDT
• Number of I/O: 28
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b, D/A 2x6b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-QFN (5x5)

paquet: 32-VFQFN Exposed Pad

S912ZVCA19A1WKHR

NXP

S12Z, 64LQFP-EP, 192K FLASH

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

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SPC5607BK0CLL6

NXP

IC MCU 32BIT 1.5MB FLASH 100LQFP

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CANbus, I2C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 149
• Program Memory Size: 1.5MB (1.5M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 96K x 8
• Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
• Data Converters: A/D 50x10/12b SAR
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

paquet: -

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FH32K116LFT0VFMR

NXP

IC

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

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