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Produits NXP

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PDTC124XK,115
NXP

TRANS PREBIAS NPN 250MW SMT3

  • Transistor Type: NPN - Pre-Biased
  • Current - Collector (Ic) (Max): 100mA
  • Voltage - Collector Emitter Breakdown (Max): 50V
  • Resistor - Base (R1) (Ohms): 22k
  • Resistor - Emitter Base (R2) (Ohms): 47k
  • DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
  • Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
  • Current - Collector Cutoff (Max): 1µA
  • Frequency - Transition: -
  • Power - Max: 250mW
  • Mounting Type: Surface Mount
  • Package / Case: TO-236-3, SC-59, SOT-23-3
  • Supplier Device Package: SMT3; MPAK
paquet: TO-236-3, SC-59, SOT-23-3
Stock4 880
BZX84-B6V8/LF1R
NXP

DIODE ZENER TO-236AB SOT23

  • Voltage - Zener (Nom) (Vz): 6.8V
  • Tolerance: ±2%
  • Power - Max: 250mW
  • Impedance (Max) (Zzt): 15 Ohms
  • Current - Reverse Leakage @ Vr: 2µA @ 4V
  • Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
  • Operating Temperature: -65°C ~ 150°C
  • Mounting Type: Surface Mount
  • Package / Case: TO-236-3, SC-59, SOT-23-3
  • Supplier Device Package: TO-236AB (SOT23)
paquet: TO-236-3, SC-59, SOT-23-3
Stock2 912
ASL4500SHNY
NXP

IC LED BOOST DVR 4PH 32HVQFN

  • Type: -
  • Topology: -
  • Internal Switch(s): -
  • Number of Outputs: -
  • Voltage - Supply (Min): -
  • Voltage - Supply (Max): -
  • Voltage - Output: -
  • Current - Output / Channel: -
  • Frequency: -
  • Dimming: -
  • Applications: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock2 448
hot PCA9634D,118
NXP

IC LED DRIVER LIN DIM 25MA 20SO

  • Type: Power Switch
  • Topology: -
  • Internal Switch(s): Yes
  • Number of Outputs: 8
  • Voltage - Supply (Min): 2.3V
  • Voltage - Supply (Max): 5.5V
  • Voltage - Output: 5.5V
  • Current - Output / Channel: 25mA
  • Frequency: 25MHz
  • Dimming: I2C
  • Applications: Backlight
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 20-SO
paquet: 20-SOIC (0.295", 7.50mm Width)
Stock28 800
TEA1530AT/N2/DG,11
NXP

IC CTRLR SMPS GREEN OVP 8SOIC

  • Output Isolation: Isolated
  • Internal Switch(s): No
  • Voltage - Breakdown: 650V
  • Topology: Flyback
  • Voltage - Start Up: 11V
  • Voltage - Supply (Vcc/Vdd): 8.7 V ~ 20 V
  • Duty Cycle: 70%
  • Frequency - Switching: 63kHz
  • Power (Watts): 65W
  • Fault Protection: Current Limiting, Over Temperature, Over Voltage, Short Circuit
  • Control Features: -
  • Operating Temperature: -20°C ~ 145°C (TJ)
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SO
  • Mounting Type: Surface Mount
paquet: 8-SOIC (0.154", 3.90mm Width)
Stock3 120
SSTVN16859BS,118
NXP

IC REG BUFF 13BIT SSTL 56HVQFN

  • Logic Type: Registered Buffer with SSTL_2 Compatible I/O for DDR
  • Supply Voltage: 2.3 V ~ 2.7 V
  • Number of Bits: 13, 26
  • Operating Temperature: 0°C ~ 70°C
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN
paquet: 56-VFQFN Exposed Pad
Stock3 360
HEF4070BP-Q100U
NXP

IC GATE XOR 4CH 2-INP 14-DIP

  • Logic Type: XOR (Exclusive OR)
  • Number of Circuits: 4
  • Number of Inputs: 2
  • Features: -
  • Voltage - Supply: 3 V ~ 15 V
  • Current - Quiescent (Max): -
  • Current - Output High, Low: 3mA, 3mA
  • Logic Level - Low: 1.5 V ~ 4 V
  • Logic Level - High: 3.5 V ~ 11 V
  • Max Propagation Delay @ V, Max CL: 55ns @ 15V, 50pF
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Through Hole
  • Supplier Device Package: 14-DIP
  • Package / Case: 14-DIP (0.300", 7.62mm)
paquet: 14-DIP (0.300", 7.62mm)
Stock2 240
74HC4520N,652
NXP

IC DUAL 4BIT SYNC BINARY 16-DIP

  • Logic Type: Binary Counter
  • Direction: Up
  • Number of Elements: 2
  • Number of Bits per Element: 4
  • Reset: Asynchronous
  • Timing: Synchronous
  • Count Rate: 69MHz
  • Trigger Type: Positive, Negative
  • Voltage - Supply: 2 V ~ 6 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Through Hole
  • Package / Case: 16-DIP (0.300", 7.62mm)
  • Supplier Device Package: 16-DIP
paquet: 16-DIP (0.300", 7.62mm)
Stock7 392
PCA9674APW,118
NXP

IC I/O EXPANDER I2C 8B 16TSSOP

  • Number of I/O: 8
  • Interface: I2C
  • Interrupt Output: Yes
  • Features: POR
  • Output Type: Push-Pull
  • Current - Output Source/Sink: 100µA, 25mA
  • Clock Frequency: 1MHz
  • Voltage - Supply: 2.3 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 16-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 16-TSSOP
paquet: 16-TSSOP (0.173", 4.40mm Width)
Stock22 872
TJA1054T/N1,518
NXP

IC CAN TXRX FAULT-TOL 14-SOIC

  • Type: Transceiver
  • Protocol: CAN
  • Number of Drivers/Receivers: 1/1
  • Duplex: Half
  • Receiver Hysteresis: -
  • Data Rate: -
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Operating Temperature: -40°C ~ 150°C
  • Mounting Type: Surface Mount
  • Package / Case: 14-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 14-SO
paquet: 14-SOIC (0.154", 3.90mm Width)
Stock2 176
P1010NSE5KHA
NXP

IC MPU Q OR IQ 1.0GHZ 425TEBGA

  • Core Processor: PowerPC e500v2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: Security; SEC 4.4
  • RAM Controllers: DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (3)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (1)
  • Voltage - I/O: -
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
  • Package / Case: 425-FBGA
  • Supplier Device Package: 425-TEPBGA I (19x19)
paquet: 425-FBGA
Stock3 392
hot MPC862PZQ100B
NXP

IC MPU MPC8XX 100MHZ 357BGA

  • Core Processor: MPC8xx
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 100MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (4), 10/100 Mbps (1)
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 357-BBGA
  • Supplier Device Package: 357-PBGA (25x25)
paquet: 357-BBGA
Stock15 612
SVF531R3K1CMK4
NXP

IC MCU 32BIT ROMLESS 364MAPBGA

  • Core Processor: ARM? Cortex?-A5 + Cortex?-M4
  • Core Size: 32-Bit Dual-Core
  • Speed: 400MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG
  • Peripherals: LCD, SAI
  • Number of I/O: 136
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 1.5MB
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
  • Data Converters: A/D 10x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 364-LFBGA
  • Supplier Device Package: 364-MAPBGA (17x17)
paquet: 364-LFBGA
Stock5 648
MPXN2120VMG116
NXP

IC MCU 32BIT 2MB FLASH 208MAPBGA

  • Core Processor: e200z650
  • Core Size: 32-Bit
  • Speed: 116MHz
  • Connectivity: CAN, I2C, LIN, SCI, SPI, UART/USART
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 155
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 64x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 208-BGA
  • Supplier Device Package: 208-MAPBGA (17x17)
paquet: 208-BGA
Stock4 208
MC9S08AC32CPUER
NXP

IC MCU 8BIT 32KB FLASH 64LQFP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: I2C, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 54
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 16x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
paquet: 64-LQFP
Stock6 976
MK20DX256VLQ10R
NXP

IC MCU 32BIT 256KB FLASH 144LQFP

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 100MHz
  • Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
  • Peripherals: DMA, I2S, LVD, POR, PWM, WDT
  • Number of I/O: 100
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 42x16b, D/A 2x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
paquet: 144-LQFP
Stock5 376
LPC43S30FET100E
NXP

IC MCU 32BIT ROMLESS 100TFBGA

  • Core Processor: ARM? Cortex?-M4/M0
  • Core Size: 32-Bit Dual-Core
  • Speed: 204MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
  • Number of I/O: 49
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 264K x 8
  • Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
  • Data Converters: A/D 4x10b; D/A 1x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 100-TFBGA
  • Supplier Device Package: 100-TFBGA (9x9)
paquet: 100-TFBGA
Stock5 424
MKL46Z128VLL4
NXP

IC MCU 32BIT 128KB FLASH 100LQFP

  • Core Processor: ARM? Cortex?-M0+
  • Core Size: 32-Bit
  • Speed: 48MHz
  • Connectivity: I2C, LIN, SPI, UART/USART, USB, USB OTG
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
  • Number of I/O: 84
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 16K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D - 16bit, D/A - 12bit
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
paquet: 100-LQFP
Stock6 512
MKL17Z256VFM4
NXP

IC MCU 32BIT 256KB FLASH 32QFN

  • Core Processor: ARM? Cortex?-M0+
  • Core Size: 32-Bit
  • Speed: 48MHz
  • Connectivity: I2C, LIN, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
  • Number of I/O: 28
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 11x16b, D/A 1x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 32-UFQFN Exposed Pad
  • Supplier Device Package: 32-QFN (5x5)
paquet: 32-UFQFN Exposed Pad
Stock4 384
MMA2260DR2
NXP

ACCELEROMETER 1.5G ANALOG 16SOIC

  • Type: Analog
  • Axis: X
  • Acceleration Range: ±1.5g
  • Sensitivity (LSB/g): -
  • Sensitivity (mV/g): 1200
  • Bandwidth: 50Hz
  • Output Type: Analog Voltage
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Features: -
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 16-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 16-SOIC
paquet: 16-SOIC (0.295", 7.50mm Width)
Stock5 814
MC34PF1510A7EP
NXP

PF1510

  • Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
  • Current - Supply: -
  • Voltage - Supply: 3.8 V ~ 7 V
  • Operating Temperature: -40°C ~ 105°C
  • Mounting Type: Surface Mount
  • Package / Case: 40-VFQFN Exposed Pad
  • Supplier Device Package: 40-QFN (5x5)
paquet: 40-VFQFN Exposed Pad
Stock2 640
MCZ33905DD3EK
NXP

SYSTEM BASIS CHIP 2 LIN 2X 3.3

  • Applications: System Basis Chip
  • Interface: CAN, LIN
  • Voltage - Supply: 5.5 V ~ 28 V
  • Package / Case: -
  • Supplier Device Package: -
  • Mounting Type: -
paquet: -
Stock3 952
T1013NSE7MQA
NXP

QORIQ 1XCPU 64-BIT PWR ARCH 1.

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock2 400
MKE18F256VLH16
NXP

KINETIS KE18F: 160MHZ CORTEX-M4F

  • Core Processor: ARM® Cortex®-M4F
  • Core Size: 32-Bit
  • Speed: 168MHz
  • Connectivity: CANbus, FlexIO, I²C, SPI, UART/USART
  • Peripherals: DMA, LVD, PWM, WDT
  • Number of I/O: 58
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 68K x 8
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 16x12b, D/A 1x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
paquet: 64-LQFP
Stock7 776
SP5748CBK0AVMJ6R
NXP

DUAL CORE 6M FLASH 768K RAM F

  • Core Processor: e200z2, e200z4
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 178
  • Program Memory Size: 6MB (6M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 768K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-MAPPBGA (17x17)
paquet: 256-LBGA
Stock5 280
SPC5744BSK1AMMH6
NXP

SINGLE CORE 1.5M FLASH

  • Core Processor: e200z4
  • Core Size: 32-Bit
  • Speed: 160MHz
  • Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
  • Peripherals: DMA, I²S, POR, WDT
  • Number of I/O: -
  • Program Memory Size: 1.5MB (1.5M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 192K x 8
  • Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
  • Data Converters: A/D 36x10b, 16x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LBGA
  • Supplier Device Package: 100-MAPBGA (11x11)
paquet: 100-LBGA
Stock3 584
S9S12GA192F0CLH
NXP

16-BIT MCU S12 CORE 192KB FLAS

  • Core Processor: 12V1
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: CANbus, IrDA, LINbus, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 54
  • Program Memory Size: 192KB (192K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 11K x 8
  • Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
  • Data Converters: A/D 16x12b, D/A 2x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
paquet: 64-LQFP
Stock7 152
S912ZVCA64F0CLF
NXP

MAGNIV 16-BIT MCU S12Z CORE 64

  • Core Processor: S12Z
  • Core Size: 16-Bit
  • Speed: 32MHz
  • Connectivity: CANbus, I²C, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 28
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 1K x 8
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
  • Data Converters: A/D 10x12b, D/A 1x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
paquet: 48-LQFP
Stock2 288