Produits NXP

PHD36N03LT,118

NXP

MOSFET N-CH 30V 43.4A DPAK

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 30V
• Current - Continuous Drain (Id) @ 25°C: 43.4A (Tc)
• Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
• Vgs(th) (Max) @ Id: 2V @ 250µA
• Gate Charge (Qg) (Max) @ Vgs: 18.5nC @ 10V
• Input Capacitance (Ciss) (Max) @ Vds: 690pF @ 25V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 57.6W (Tc)
• Rds On (Max) @ Id, Vgs: 17 mOhm @ 25A, 10V
• Operating Temperature: -55°C ~ 175°C (TJ)
• Mounting Type: Surface Mount
• Supplier Device Package: DPAK
• Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63

paquet: TO-252-3, DPak (2 Leads + Tab), SC-63

PDTD123TK,115

NXP

TRANS PREBIAS NPN 250MW SMT3

• Transistor Type: NPN - Pre-Biased
• Current - Collector (Ic) (Max): 500mA
• Voltage - Collector Emitter Breakdown (Max): 50V
• Resistor - Base (R1) (Ohms): 2.2k
• Resistor - Emitter Base (R2) (Ohms): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 50mA, 5V
• Vce Saturation (Max) @ Ib, Ic: 300mV @ 2.5mA, 50mA
• Current - Collector Cutoff (Max): 500nA
• Frequency - Transition: -
• Power - Max: 250mW
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

paquet: TO-236-3, SC-59, SOT-23-3

PZM7.5NB1,115

NXP

DIODE ZENER 7.5V 300MW SMT3

• Voltage - Zener (Nom) (Vz): 7.5V
• Tolerance: ±2%
• Power - Max: 300mW
• Impedance (Max) (Zzt): 10 Ohms
• Current - Reverse Leakage @ Vr: 1µA @ 4V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SMT3; MPAK

paquet: TO-236-3, SC-59, SOT-23-3

MCZ33880EGR2

NXP

IC SWITCH OCTAL SER I/O 28-SOIC

• Switch Type: General Purpose
• Number of Outputs: 8
• Ratio - Input:Output: 1:8
• Output Configuration: High Side or Low Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 5.5 V ~ 24.5 V
• Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V
• Current - Output (Max): 800mA
• Rds On (Typ): 550 mOhm
• Input Type: -
• Features: -
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

paquet: 28-SOIC (0.295", 7.50mm Width)

74ALVT16260DL,512

NXP

IC 12-24BIT MUX D LATCH 56-SSOP

• Logic Type: D-Type Transparent Latch
• Circuit: 12:24
• Output Type: Tri-State
• Voltage - Supply: 2.3 V ~ 2.7 V
• Independent Circuits: 1
• Delay Time - Propagation: 2.8ns
• Current - Output High, Low: 8mA, 24mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 56-BSSOP (0.295", 7.50mm Width)
• Supplier Device Package: 56-SSOP

paquet: 56-BSSOP (0.295", 7.50mm Width)

74LV174N,112

NXP

IC D-TYPE POS TRG SNGL 16DIP

• Function: Master Reset
• Type: D-Type
• Output Type: Non-Inverted
• Number of Elements: 1
• Number of Bits per Element: 6
• Clock Frequency: 100MHz
• Max Propagation Delay @ V, Max CL: 21ns @ 5V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 12mA, 12mA
• Voltage - Supply: 1 V ~ 5.5 V
• Current - Quiescent (Iq): 160µA
• Input Capacitance: 3.5pF
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)

paquet: 16-DIP (0.300", 7.62mm)

74LVT273PW,112

NXP

IC D-TYPE POS TRG SNGL 20TSSOP

• Function: Master Reset
• Type: D-Type
• Output Type: Non-Inverted
• Number of Elements: 1
• Number of Bits per Element: 8
• Clock Frequency: 150MHz
• Max Propagation Delay @ V, Max CL: 5.5ns @ 3.3V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 2.7 V ~ 3.6 V
• Current - Quiescent (Iq): 190µA
• Input Capacitance: 4pF
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)

paquet: 20-TSSOP (0.173", 4.40mm Width)

74HC243N,652

NXP

IC BUS TXRX TRI-ST 4BIT 14DIP

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 1
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 7.8mA, 7.8mA
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Through Hole
• Package / Case: 14-DIP (0.300", 7.62mm)
• Supplier Device Package: 14-DIP

paquet: 14-DIP (0.300", 7.62mm)

UJA1078TW/5V0,118

NXP

IC SBC CAN/DUAL LIN 5V 32HTSSOP

• Applications: Automotive
• Interface: CAN, LIN
• Voltage - Supply: 4.5 V ~ 28 V
• Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
• Supplier Device Package: 32-HTSSOP
• Mounting Type: Surface Mount

paquet: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

MC33742SDWR2

NXP

IC SYSTEM BASE W/LIN 28-SOIC

• Applications: Automotive
• Interface: SPI Serial
• Voltage - Supply: 5.5 V ~ 18 V
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC
• Mounting Type: Surface Mount

paquet: 28-SOIC (0.295", 7.50mm Width)

P1010NXN5DFA

NXP

IC MPU Q OR IQ 1.0GHZ 425TEBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (1)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 425-FBGA
• Supplier Device Package: 425-TEPBGA I (19x19)

paquet: 425-FBGA

MC7447AHX733NB

NXP

IC MPU MPC74XX 733MHZ 360FCCBGA

• Core Processor: PowerPC G4
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 733MHz
• Co-Processors/DSP: Multimedia; SIMD
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 360-BCBGA, FCCBGA
• Supplier Device Package: 360-FCCBGA (25x25)

paquet: 360-BCBGA, FCCBGA

MCIMX6QP6AVT8AA

NXP

IC MPU I.MX6QP 852MHZ 624FCBGA

• Core Processor: ARM? Cortex?-A9
• Number of Cores/Bus Width: 4 Core, 32-Bit
• Speed: 852MHZ
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR2, DDR3L, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
• Ethernet: 10/100/1000 Mbps (1)
• SATA: SATA 3Gbps (1)
• USB: USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -40°C ~ 125°C (TJ)
• Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
• Package / Case: 624-FBGA, FCBGA
• Supplier Device Package: 624-FCBGA (21x21)

paquet: 624-FBGA, FCBGA

MPC5200VR400

NXP

IC MPU MPC52XX 400MHZ 272BGA

• Core Processor: PowerPC G2_LE
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 1.1 (2)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 272-BBGA
• Supplier Device Package: 272-PBGA (27x27)

paquet: 272-BBGA

MPC564CZP40

NXP

IC MCU 32BIT 512KB FLASH 388BGA

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 40MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 56
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 388-BBGA
• Supplier Device Package: 388-PBGA (27x27)

paquet: 388-BBGA

MCF51AG128CLH

NXP

IC MCU 32BIT 128KB FLASH 64LQFP

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: DMA, LVD, PWM, WDT
• Number of I/O: 53
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 19x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

paquet: 64-LQFP

LPC11E68JBD100E

NXP

IC MCU 32BIT 256KB FLASH 100LQFP

• Core Processor: ARM? Cortex?-M0+
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 80
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 36K x 8
• Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 12x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

paquet: 100-LQFP

S9S08LG16J0CLH

NXP

IC MCU 8BIT 18KB FLASH 64LQFP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LCD, LVD, POR, PWM, WDT
• Number of I/O: 53
• Program Memory Size: 18KB (18K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1.9K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

paquet: 64-LQFP

P87C51MC2BA/02,529

NXP

IC MCU 8BIT 96KB OTP 44PLCC

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 24MHz
• Connectivity: EBI/EMI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 34
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 3K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

paquet: 44-LCC (J-Lead)

MK20DN512VLL10

NXP

IC MCU 32BIT 512KB FLASH 100LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 66
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 33x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

paquet: 100-LQFP

XC56L307VL150

NXP

IC DSP 24BIT 150MHZ 196-MABGA

• Type: Fixed Point
• Interface: Host Interface, SSI, SCI
• Clock Rate: 150MHz
• Non-Volatile Memory: ROM (576 B)
• On-Chip RAM: 576kB
• Voltage - I/O: 3.30V
• Voltage - Core: 1.80V
• Operating Temperature: -40°C ~ 100°C
• Mounting Type: Surface Mount
• Package / Case: 196-LBGA
• Supplier Device Package: 196-MAPBGA (15x15)

paquet: 196-LBGA

MPXH6115A6U

NXP

SENSOR ABS PRESS 16.7PSI MAX

• Pressure Type: Absolute
• Operating Pressure: 2.18 PSI ~ 16.68 PSI (15 kPa ~ 115 kPa)
• Output Type: Analog Voltage
• Output: 0.2 V ~ 4.7 V
• Accuracy: ±1.5%
• Voltage - Supply: 4.75 V ~ 5.25 V
• Port Size: -
• Port Style: No Port
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 58.02 PSI (400 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 8-SSOP

paquet: 8-SOIC (0.295", 7.50mm Width)

SPC5603EEF2MLHR

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, WDT
• Number of I/O: 39
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 96K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

paquet: 64-LQFP

S9S12GN32ACLF

NXP

16-BIT32K FLASH2K RAM

• Core Processor: 12V1
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1K x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

paquet: 48-LQFP

LPC55S69JBD100E

NXP

IC MCU 32BIT 640KB FLASH 100LQFP

• Core Processor: ARM® Cortex®-M33
• Core Size: 32-Bit Single-Core
• Speed: 150MHz
• Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
• Number of I/O: 64
• Program Memory Size: 640KB (640K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 320K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 10x16b SAR
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP Exposed Pad
• Supplier Device Package: 100-HLQFP (14x14)

paquet: -

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S912ZVL12AMLF

NXP

S12Z CPU, 128K FLASH

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 34
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
• Data Converters: A/D 10x10b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

paquet: -

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S32G399AACK1VUCR

NXP

8XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2

• Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
• Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit
• Speed: 400MHz, 1.3GHz
• Co-Processors/DSP: Multimedia; NEON
• RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 2.5Gbps (3)
• SATA: -
• USB: USB 2.0 OTG (1)
• Voltage - I/O: 1.8V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
• Package / Case: 525-FBGA, FCBGA
• Supplier Device Package: 525-FCPBGA (19x19)

paquet: -

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FB32K148HFT0VLQR

NXP

S32K148 144 LQFP

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

paquet: -

Request a Quote