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Produits NXP

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HEF4044BP,652
NXP

IC R/S LATCH 3-STATE QUAD 16DIP

  • Logic Type: S-R Latch
  • Circuit: 4:4
  • Output Type: Tri-State
  • Voltage - Supply: 3 V ~ 15 V
  • Independent Circuits: 4
  • Delay Time - Propagation: 30ns
  • Current - Output High, Low: 3mA, 3mA
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Through Hole
  • Package / Case: 16-DIP (0.300", 7.62mm)
  • Supplier Device Package: 16-DIP
paquet: 16-DIP (0.300", 7.62mm)
Stock2 608
74AHC241D,118
NXP

IC BUFFER/LINEDVR 3ST SO20

  • Logic Type: Buffer, Non-Inverting
  • Number of Elements: 2
  • Number of Bits per Element: 4
  • Input Type: -
  • Output Type: Push-Pull
  • Current - Output High, Low: 8mA, 8mA
  • Voltage - Supply: 2 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 20-SO
paquet: 20-SOIC (0.295", 7.50mm Width)
Stock4 864
SCC2691AE1A28,512
NXP

IC UART CMOS LSI 28PLCC

  • Features: Configurable GPIO, Internal Oscillator, Timer/Counter
  • Number of Channels: 1, UART
  • FIFO's: -
  • Protocol: -
  • Data Rate (Max): -
  • Voltage - Supply: 5V
  • With Auto Flow Control: Yes
  • With IrDA Encoder/Decoder: -
  • With False Start Bit Detection: Yes
  • With Modem Control: -
  • Mounting Type: Surface Mount
  • Package / Case: 28-LCC (J-Lead)
  • Supplier Device Package: 28-PLCC (11.51x11.51)
paquet: 28-LCC (J-Lead)
Stock6 704
M82108G13
NXP

IC VOIP PROCESSOR 8CH 672BGA

  • Function: -
  • Interface: -
  • Number of Circuits: -
  • Voltage - Supply: -
  • Current - Supply: -
  • Power (Watts): -
  • Operating Temperature: -
  • Mounting Type: Surface Mount
  • Package / Case: 672-BGA
  • Supplier Device Package: 672-TEPBGA (27x27)
paquet: 672-BGA
Stock3 360
hot MCZ33993EW
NXP

IC MULTIPLE SWITCH DETECT 32SOIC

  • Applications: -
  • Interface: SPI
  • Voltage - Supply: 5.5 V ~ 26 V
  • Package / Case: 32-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 32-SOIC
  • Mounting Type: Surface Mount
paquet: 32-SOIC (0.295", 7.50mm Width)
Stock5 664
PTN3342D,118
NXP

IC HS DIFF LINE RECEIVER 16SOIC

  • Type: Receiver
  • Protocol: LVDS
  • Number of Drivers/Receivers: 0/4
  • Duplex: -
  • Receiver Hysteresis: -
  • Data Rate: -
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 16-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 16-SO
paquet: 16-SOIC (0.154", 3.90mm Width)
Stock4 480
MPC8313EZQADD
NXP

IC MPU MPC83XX 267MHZ 516BGA

  • Core Processor: PowerPC e300c3
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 267MHz
  • Co-Processors/DSP: Security; SEC 2.2
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: USB 2.0 + PHY (1)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Cryptography
  • Package / Case: 516-BBGA Exposed Pad
  • Supplier Device Package: 516-TEPBGA (27x27)
paquet: 516-BBGA Exposed Pad
Stock5 840
MPC8349EVVAJDB
NXP

IC MPU MPC83XX 533MHZ 672TBGA

  • Core Processor: PowerPC e300
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 533MHz
  • Co-Processors/DSP: Security; SEC
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 672-LBGA
  • Supplier Device Package: 672-TBGA (35x35)
paquet: 672-LBGA
Stock2 720
hot MPC850DECVR66BU
NXP

IC MPU MPC8XX 66MHZ 256BGA

  • Core Processor: MPC8xx
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 66MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (1)
  • SATA: -
  • USB: USB 1.x (1)
  • Voltage - I/O: 3.3V
  • Operating Temperature: -40°C ~ 95°C (TA)
  • Security Features: -
  • Package / Case: 256-BBGA
  • Supplier Device Package: 256-PBGA (23x23)
paquet: 256-BBGA
Stock26 100
S908QY4H0CDWER
NXP

IC MCU 8BIT 4KB FLASH 16SOIC

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: -
  • Peripherals: LVD, POR, PWM
  • Number of I/O: 13
  • Program Memory Size: 4KB (4K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 4x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 16-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 16-SOIC
paquet: 16-SOIC (0.295", 7.50mm Width)
Stock2 080
PK30N512VMD100
NXP

IC MCU 32BIT 512KB FLASH 144BGA

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 100MHz
  • Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
  • Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
  • Number of I/O: 102
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 31x16b, D/A 2x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LBGA
  • Supplier Device Package: 144-MAPBGA (13x13)
paquet: 144-LBGA
Stock7 008
MC9S08RC8CFJE
NXP

IC MCU 8BIT 8KB FLASH 32LQFP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: SCI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 25
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 1K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 32-LQFP
  • Supplier Device Package: 32-LQFP (7x7)
paquet: 32-LQFP
Stock2 176
S912XHZ512F1VAG
NXP

IC MCU 16BIT 512KB FLASH 144LQFP

  • Core Processor: HCS12X
  • Core Size: 16-Bit
  • Speed: 80MHz
  • Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
  • Peripherals: LCD, Motor control PWM, POR, PWM, WDT
  • Number of I/O: 117
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
  • Data Converters: A/D 16x8/10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
paquet: 144-LQFP
Stock7 312
LPC1817JBD144E
NXP

IC MCU 32BIT 1MB FLASH 144LQFP

  • Core Processor: ARM? Cortex?-M3
  • Core Size: 32-Bit
  • Speed: 180MHz
  • Connectivity: CAN, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
  • Number of I/O: 83
  • Program Memory Size: 1MB (1M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 16K x 8
  • RAM Size: 136K x 8
  • Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
  • Data Converters: A/D 8x10b; D/A 1x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: -
paquet: 144-LQFP
Stock6 128
MC9S08DN32ACLF
NXP

IC MCU 8BIT 32KB FLASH 48LQFP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: I2C, LIN, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 39
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 1K x 8
  • RAM Size: 1.5K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 16x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
paquet: 48-LQFP
Stock5 392
S912ZVH64F2VLQ
NXP

IC MCU 16BIT 64KB FLASH 144LQFP

  • Core Processor: S12Z
  • Core Size: 16-Bit
  • Speed: 32MHz
  • Connectivity: CAN, I2C, LIN, SCI, SPI
  • Peripherals: DMA, LCD, POR, PWM, WDT
  • Number of I/O: 100
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
paquet: 144-LQFP
Stock4 112
hot MC9RS08KA2CSC
NXP

IC MCU 8BIT 2KB FLASH 8SOIC

  • Core Processor: RS08
  • Core Size: 8-Bit
  • Speed: 10MHz
  • Connectivity: -
  • Peripherals: LVD, POR, WDT
  • Number of I/O: 4
  • Program Memory Size: 2KB (2K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 63 x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SOIC
paquet: 8-SOIC (0.154", 3.90mm Width)
Stock5 680
KMSC8122TVT6400V
NXP

DSP 16BIT QUAD CORE 431FCBGA

  • Type: SC140 Core
  • Interface: DSI, Ethernet, RS-232
  • Clock Rate: 400MHz
  • Non-Volatile Memory: External
  • On-Chip RAM: 1.436MB
  • Voltage - I/O: 3.30V
  • Voltage - Core: 1.10V
  • Operating Temperature: -40°C ~ 105°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 431-BFBGA, FCBGA
  • Supplier Device Package: 431-FCPBGA (20x20)
paquet: 431-BFBGA, FCBGA
Stock7 296
ICM7555CD,602
NXP

IC OSC SGL TIMER 500KHZ 8-SOIC

  • Type: 555 Type, Timer/Oscillator (Single)
  • Count: -
  • Frequency: 500kHz
  • Voltage - Supply: 3 V ~ 16 V
  • Current - Supply: 180µA
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SO
  • Mounting Type: Surface Mount
paquet: 8-SOIC (0.154", 3.90mm Width)
Stock3 760
HTSFCH5601EV/DH,11
NXP

IC HITAG-S 256BIT FCP

  • Type: RFID Transponder
  • Frequency: 100kHz ~ 150kHz
  • Standards: ISO 14223, ISO 11784, ISO 11785, ISO 18000-2
  • Interface: -
  • Voltage - Supply: -
  • Operating Temperature: -25°C ~ 85°C
  • Package / Case: 2-FlipChip
  • Supplier Device Package: FCP2
paquet: 2-FlipChip
Stock2 160
SA605D/01,118
NXP

IC MIXER FM IF SYSTEM LP 20-SOIC

  • Frequency: 0Hz ~ 500MHz
  • Sensitivity: -
  • Data Rate (Max): -
  • Modulation or Protocol: ASK, FSK
  • Applications: FM Remote Receiver
  • Current - Receiving: 5.7mA
  • Data Interface: PCB, Surface Mount
  • Memory Size: -
  • Antenna Connector: PCB, Surface Mount
  • Features: RSSI Equipped
  • Voltage - Supply: 4.5 V ~ 8 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 20-SO
paquet: 20-SOIC (0.295", 7.50mm Width)
Stock7 038
hot MW7IC2040NR1
NXP

IC PWR AMP RF 1990MHZ TO-270-16

  • Frequency: 100MHz ~ 1GHz
  • P1dB: 40.4dBm (11W)
  • Gain: 23.5dB
  • Noise Figure: -
  • RF Type: General Purpose
  • Voltage - Supply: 32V
  • Current - Supply: 75mA
  • Test Frequency: 100MHz
  • Package / Case: TO-270-16 Variant, Flat Leads
  • Supplier Device Package: TO-270 WBL-16
paquet: TO-270-16 Variant, Flat Leads
Stock18 264
LS1012ASE7KKB
NXP

LS1012A ST WE 1GHZ RV2

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock7 568
FS32K148HRT0VLUT
NXP

S32K148 32-BIT MCU ARM

  • Core Processor: ARM® Cortex®-M4F
  • Core Size: 32-Bit
  • Speed: 80MHz
  • Connectivity: CANbus, Ethernet, FlexIO, I²C, LINbus, SPI, UART/USART
  • Peripherals: I²S, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 256K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 32x12b, D/A 1x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP
Stock4 192
MC9S08AC48CFGER
NXP

S08AC 8-BIT MCU S08 CORE 48KB

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: I²C, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 34
  • Program Memory Size: 48KB (48K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 44-LQFP
  • Supplier Device Package: 44-LQFP (10x10)
paquet: 44-LQFP
Stock5 488
A2T08VD021NT1
NXP

RF MOSFET PQFN8X8

  • Transistor Type: -
  • Frequency: -
  • Gain: -
  • Voltage - Test: -
  • Current Rating: -
  • Noise Figure: -
  • Current - Test: -
  • Power - Output: -
  • Voltage - Rated: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Request a Quote
TCP1212T-1-118
NXP

IC REG BUCK CONVERTER SO8

  • Function: -
  • Output Configuration: -
  • Topology: -
  • Output Type: -
  • Number of Outputs: -
  • Voltage - Input (Min): -
  • Voltage - Input (Max): -
  • Voltage - Output (Min/Fixed): -
  • Voltage - Output (Max): -
  • Current - Output: -
  • Frequency - Switching: -
  • Synchronous Rectifier: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Request a Quote
S32G233AABK0VUCR
NXP

S32G233A ARM CORTEX-M7 AND -A53

  • Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
  • Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit
  • Speed: 400MHz, 1GHz
  • Co-Processors/DSP: Multimedia; NEON
  • RAM Controllers: DDR3L, LPDDR4
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: GbE (4)
  • SATA: -
  • USB: USB 2.0 OTG (1)
  • Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
  • Package / Case: 525-FBGA, FCBGA
  • Supplier Device Package: 525-FCPBGA (19x19)
paquet: -
Request a Quote