Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
96-PORT (240G) STS-1 CROSS-CONNE
|
paquet: - |
Stock7 152 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
96-PORT (240G) STS-1 CROSS-CONNE
|
paquet: - |
Stock6 784 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
PM5376 TSE-NX160
|
paquet: - |
Stock4 464 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
40G VT/TU SWITCHING ELEMENT
|
paquet: - |
Stock6 640 |
|
Serial | - | 1.2V | - | - | - | Surface Mount | - | 672-FCBGA (27x27) |
||
Microchip Technology |
40G VT/TU SWITCHING ELEMENT
|
paquet: - |
Stock6 288 |
|
Serial | - | 1.2V | - | - | - | Surface Mount | - | 672-FCBGA (27x27) |
||
Microchip Technology |
HIGH CAPACITY SINGLE-CHIP ADD/DR
|
paquet: - |
Stock3 472 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
SINGLE-CHIP SONET/SDH TRANSPORT
|
paquet: - |
Stock4 720 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
SONET/SDH TRANSPORT FRAMER/AGGRE
|
paquet: - |
Stock2 960 |
|
SFI-4 | - | 1.2V | - | - | - | Surface Mount | - | 1292-FCBGA |
||
Microchip Technology |
SONET/SDH TRANSPORT FRAMER/AGGRE
|
paquet: - |
Stock6 048 |
|
SFI-4 | - | 1.2V | - | - | - | Surface Mount | - | 1292-FCBGA |
||
Microchip Technology |
SONET/SDH TRANSPORT FRAMER/AGGRE
|
paquet: - |
Stock4 352 |
|
SFI-4 | - | 1.2V | - | - | - | Surface Mount | - | 1292-FCBGA |
||
Microchip Technology |
SONET/SDH INTERFACE FOR 622 & 15
|
paquet: 196-LBGA |
Stock5 664 |
|
Serial | - | - | - | - | - | Surface Mount | 196-LBGA | 196-CABGA (15x15) |
||
Microchip Technology |
SONET/SDH INTERFACE FOR 622 & 15
|
paquet: 196-LBGA |
Stock3 744 |
|
Serial | - | - | - | - | - | Surface Mount | 196-LBGA | 196-CABGA (15x15) |
||
Microchip Technology |
74-PORT (185G) STS-1 CROSS-CONNE
|
paquet: - |
Stock4 304 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
FOUR CHANNEL COMBINED T1/E1/J1 T
|
paquet: - |
Stock2 304 |
|
E1, J1, SPI, T1 | 4 | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | - | 256-CABGA (17x17) |
||
Microchip Technology |
EIGHT CHANNEL COMBINED T1/E1/J1
|
paquet: - |
Stock5 936 |
|
E1, J1, SPI, T1 | 8 | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | - | 256-CABGA (17x17) |
||
Microchip Technology |
32 CHANNEL SHORT HAUL T1/E1 LIU
|
paquet: - |
Stock7 184 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
32 CHANNEL SHORT HAUL T1/E1 LIU
|
paquet: - |
Stock3 344 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC RECEIVER
|
paquet: - |
Stock5 440 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC DGTL SWITCH QDX QUAD 144LBGA
|
paquet: 144-LBGA |
Stock5 088 |
|
- | 4 | 3V ~ 3.6V | 64mA | - | -40°C ~ 85°C | Surface Mount | 144-LBGA | 144-LBGA (13x13) |
||
Microchip Technology |
IC ENHANCED DIGITAL SWITCH
|
paquet: - |
Stock3 712 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC SLIC 2CH UNIV 150V 48QFN
|
paquet: 56-VFQFN Exposed Pad |
Stock4 320 |
|
4-Wire | 2 | 3.135V ~ 3.465V | 25mA | - | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
Microchip Technology |
IC SLIC 2CH UNIV 150V 48QFN
|
paquet: 56-VFQFN Exposed Pad |
Stock5 920 |
|
4-Wire | 2 | 3.135V ~ 3.465V | 25mA | - | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
Microchip Technology |
IC DGTL TELEPHONE CIRCUIT 28PLCC
|
paquet: 28-LCC (J-Lead) |
Stock4 144 |
|
- | 1 | 4.75V ~ 5.25V | 400µA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Microchip Technology |
IC DGTL TELEPHONE CIRCUIT 28SOIC
|
paquet: 28-SOIC (0.295", 7.50mm Width) |
Stock2 528 |
|
- | 1 | 4.75V ~ 5.25V | 400µA | - | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microchip Technology |
IC TIMING-OVER-PACKET 324BGA
|
paquet: 324-BGA |
Stock4 192 |
|
- | 1 | 3V ~ 3.6V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC TIMING-OVER-PACKET 324BGA
|
paquet: 324-BGA |
Stock4 576 |
|
- | 1 | 3V ~ 3.6V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC TIMING-OVER-PACKET 324BGA
|
paquet: 324-BGA |
Stock3 536 |
|
- | 1 | 3V ~ 3.6V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC ECHO CANCEL ACOUSTIC 36SSOP
|
paquet: 36-BSOP (0.295", 7.50mm Width) |
Stock5 760 |
|
Serial | 1 | 2.7V ~ 3.6V | 3µA | - | -40°C ~ 85°C | Surface Mount | 36-BSOP (0.295", 7.50mm Width) | 36-QSOP |
||
Microchip Technology |
IC VOICE ECHO CANCEL 365MCMBGA
|
paquet: 365-BBGA |
Stock6 208 |
|
- | 1 | 3V ~ 3.6V | 65µA | - | -40°C ~ 85°C | Surface Mount | 365-BBGA | 365-BGA (27x27) |
||
Microchip Technology |
IC VOICE ECHO CANCEL 365MCMBGA
|
paquet: 365-BBGA |
Stock2 368 |
|
- | 1 | 3V ~ 3.6V | 65µA | - | -40°C ~ 85°C | Surface Mount | 365-BBGA | 365-BGA (27x27) |