Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CESOP PROCESSOR 64CH 324BGA
|
paquet: 324-BGA |
Stock5 856 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC CESOP PROCESSOR 32CH 324BGA
|
paquet: 324-BGA |
Stock7 280 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC CESOP PROCESSOR 64CH 324BGA
|
paquet: 324-BGA |
Stock7 360 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC CESOP PROCESSOR 32CH 324BGA
|
paquet: 324-BGA |
Stock6 528 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC CESOP PROCESSOR 32CH 324BGA
|
paquet: 324-BGA |
Stock2 864 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC TDM SWITCH 1K-CH ENH 256BGA
|
paquet: 256-BGA |
Stock5 792 |
|
- | 1 | 1.71V ~ 1.89V | 150mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-PBGA (17x17) |
||
Microchip Technology |
IC TDM SWITCH 512CH 144LBGA
|
paquet: 144-LBGA |
Stock7 680 |
|
- | 1 | 3V ~ 3.6V | 250mA | - | -40°C ~ 85°C | Surface Mount | 144-LBGA | 144-LBGA (13x13) |
||
Microchip Technology |
IC TDM SWITCH 512CH FLEX 144LBGA
|
paquet: 144-LBGA |
Stock5 120 |
|
- | 1 | 3V ~ 3.6V | 250mA | - | -40°C ~ 85°C | Surface Mount | 144-LBGA | 144-LBGA (13x13) |
||
Microchip Technology |
IC RECEIVER DTMF 16PAIR 20SSOP
|
paquet: 20-SSOP (0.209", 5.30mm Width) |
Stock2 016 |
|
- | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microchip Technology |
IC RECEIVER DTMF 16PAIR 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock2 320 |
|
- | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC RECEIVER DTMF 16PAIR 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock5 392 |
|
- | 1 | 4.75V ~ 5.25V | 3mA | 500mW | -40°C ~ 85°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP |
||
Microchip Technology |
IC RECEIVER DTMF 16PAIR 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock4 064 |
|
- | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC VOICE ECHO CANCEL 535MCMBGA
|
paquet: 535-BGA |
Stock4 816 |
|
- | 1 | 1.6V ~ 2V | 10mA | - | -40°C ~ 85°C | Surface Mount | 535-BGA | 535-PBGA (31x31) |
||
Microchip Technology |
IC VOICE ECHO CANCEL 535MCMBGA
|
paquet: 535-BGA |
Stock3 344 |
|
- | 1 | 1.6V ~ 2V | 10mA | - | -40°C ~ 85°C | Surface Mount | 535-BGA | 535-PBGA (31x31) |
||
Microchip Technology |
IC VOICE ECHO CANCEL 208LBGA
|
paquet: 208-LBGA |
Stock7 104 |
|
- | 1 | 1.6V ~ 2V | 10mA | - | -40°C ~ 85°C | Surface Mount | 208-LBGA | 208-LBGA (17x17) |
||
Microchip Technology |
IC ECHO CANCELLER AEC 36SSOP
|
paquet: 36-BSOP (0.295", 7.50mm Width) |
Stock2 224 |
|
Serial | 1 | 2.7V ~ 3.6V | 20mA | 90mW | -40°C ~ 85°C | Surface Mount | 36-BSOP (0.295", 7.50mm Width) | 36-QSOP |
||
Microchip Technology |
IC ECHO CANCELLER AEC 36SSOP
|
paquet: 36-BSSOP (0.295", 7.50mm Width) |
Stock4 832 |
|
Serial | 1 | 2.7V ~ 3.6V | 20mA | - | -40°C ~ 85°C | Surface Mount | 36-BSSOP (0.295", 7.50mm Width) | 36-SSOP |
||
Microchip Technology |
IC ECHO CANCELLER AEC 36SSOP
|
paquet: 36-BSOP (0.295", 7.50mm Width) |
Stock4 960 |
|
Serial | 1 | 2.7V ~ 3.6V | 20mA | - | -40°C ~ 85°C | Surface Mount | 36-BSOP (0.295", 7.50mm Width) | 36-SSOP |
||
Microchip Technology |
IC TXRX DTMF 3V 24SSOP
|
paquet: 24-SSOP (0.209", 5.30mm Width) |
Stock4 016 |
|
- | 1 | 2.7V ~ 3.6V | 3.1mA | - | -40°C ~ 85°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
Microchip Technology |
IC TXRX DTMF 3V 24SSOP
|
paquet: 24-SSOP (0.209", 5.30mm Width) |
Stock6 400 |
|
- | 1 | 2.7V ~ 3.6V | 3.1mA | - | -40°C ~ 85°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
Microchip Technology |
IC TXRX DTMF 3V 24DIP
|
paquet: 24-DIP (0.300", 7.62mm) |
Stock4 880 |
|
- | 1 | 2.7V ~ 3.6V | 3.1mA | - | -40°C ~ 85°C | Through Hole | 24-DIP (0.300", 7.62mm) | 24-PDIP |
||
Microchip Technology |
IC TDM/TSI SWITCH 256X256 48SSOP
|
paquet: 48-BSSOP (0.295", 7.50mm Width) |
Stock4 192 |
|
- | 1 | 3V ~ 3.6V | 4mA | - | -40°C ~ 85°C | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
Microchip Technology |
IC TDM/TSI SWITCH 256X256 48SSOP
|
paquet: 48-BSSOP (0.295", 7.50mm Width) |
Stock2 944 |
|
- | 1 | 3V ~ 3.6V | 4mA | - | -40°C ~ 85°C | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
Microchip Technology |
IC FRAMER/INTERFACE CEPT 44PLCC
|
paquet: 44-LCC (J-Lead) |
Stock3 728 |
|
PCM | 1 | 4.5V ~ 5.5V | 8mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC |
||
Microchip Technology |
IC FRAMER/INTERFACE CEPT 28DIP
|
paquet: 28-DIP (0.600", 15.24mm) |
Stock5 792 |
|
PCM | 1 | 4.5V ~ 5.5V | 8mA | - | -40°C ~ 85°C | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Microchip Technology |
IC CODEC A-LAW CCITT PCM 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock2 112 |
|
PCM | 1 | 4.75V ~ 5.25V | 3mA | - | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC CODEC A-LAW CCITT PCM 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock2 096 |
|
PCM | 1 | 4.75V ~ 5.25V | 3mA | - | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC CODEC U-LAW CCITT PCM 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock4 528 |
|
PCM | 1 | 4.75V ~ 5.25V | 3mA | - | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |