Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Frequency - Output 1 | Frequency - Output 2 | Function | Output | Voltage - Supply | Frequency Stability | Operating Temperature | Current - Supply (Max) | Size / Dimension | Height | Package / Case |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock8 226 |
|
25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock6 678 |
|
- | - | Enable/Disable | HCSL, LVCMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock7 344 |
|
- | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock5 580 |
|
- | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock4 446 |
|
- | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock3 978 |
|
- | - | Enable/Disable | LVCMOS, LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock3 672 |
|
- | - | Enable/Disable | LVCMOS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 6-SMD, No Lead |
Stock4 248 |
|
- | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 105°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 6-SMD, No Lead |
Stock3 996 |
|
- | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 105°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 6-SMD, No Lead |
Stock5 220 |
|
- | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 105°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 6-SMD, No Lead |
Stock8 604 |
|
- | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 6-SMD, No Lead |
Stock7 020 |
|
- | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 6-SMD, No Lead |
Stock4 698 |
|
- | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 6-SMD, No Lead |
Stock5 526 |
|
- | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 6-SMD, No Lead |
Stock3 654 |
|
- | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 6-SMD, No Lead |
Stock3 384 |
|
- | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 6-SMD, No Lead |
Stock7 812 |
|
25MHz | 125MHz | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) | 6-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock5 130 |
|
- | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 32mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock5 112 |
|
- | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 32mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock4 590 |
|
148.35MHz, 148.5MHz | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 32mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock5 868 |
|
- | - | Enable/Disable | LVPECL | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | 89mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock5 490 |
|
125MHz, 156.25MHz | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 42mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock8 640 |
|
148.5MHz, 156.25MHz | 74.25MHz, 125MHz | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 38mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock4 608 |
|
- | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | 32mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock2 772 |
|
- | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | 32mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock8 244 |
|
100MHz, 150MHz | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | 32mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock7 830 |
|
75MHz, 100MHz, 125MHz, 150MHz | 75MHz, 100MHz, 125MHz, 150MHz | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 60mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock7 416 |
|
- | - | Enable/Disable | HCSL, LVPECL | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 76mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |