Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Frequency - Output 1 | Frequency - Output 2 | Function | Output | Voltage - Supply | Frequency Stability | Operating Temperature | Current - Supply (Max) | Size / Dimension | Height | Package / Case |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock2 628 |
|
- | - | Enable/Disable | HCSL, LVPECL | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 76mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock4 086 |
|
- | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 42mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock4 068 |
|
- | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 42mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock7 632 |
|
- | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | 38mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock8 946 |
|
74.25MHz, 100MHz, 125MHz, 148.25MHz, 150MHz, 156.25MHz | 25MHz, 50MHz, 74.25MHz, 75MHz, 125MHz | Enable/Disable | CMOS, LVDS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | 49mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock5 022 |
|
- | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 32mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock4 986 |
|
- | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 32mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock4 464 |
|
- | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 32mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock6 660 |
|
- | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 32mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock8 892 |
|
100MHz, 106.25MHz, 125MHz, 156.25MHz | 25MHz, 50MHz, 100MHz, 125MHz, 156.25MHz | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -55°C ~ 125°C | 32mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock2 934 |
|
24MHz, 25MHz, 27MHz, 48MHz, 50MHz, 54MHz | 24MHz, 27MHz, 50MHz, 54MHz, 125MHz | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -55°C ~ 125°C | 32mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock5 022 |
|
100MHz, 106.25MHz, 125MHz, 156.25MHz | 25MHz, 50MHz, 100MHz, 125MHz, 156.25MHz | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±50ppm | -55°C ~ 125°C | 32mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock2 160 |
|
24MHz, 25MHz, 48MHz, 50MHz, 74.25MHz, 75MHz, 125MHz, 148.5MHz | 24MHz, 25MHz, 48MHz, 50MHz, 74.25MHz, 75MHz, 125MHz, 148.5MHz | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | 32mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock4 626 |
|
25MHz | 25MHz | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | 32mA (Typ) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 14-SMD, No Lead |
Stock3 490 |
|
- | - | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 35mA | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) | 14-SMD, No Lead |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock4 176 |
|
- | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock8 964 |
|
- | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock2 718 |
|
- | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock2 304 |
|
- | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock7 200 |
|
- | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock3 186 |
|
- | - | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock7 794 |
|
25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock8 226 |
|
25MHz, 50MHz, 125MHz, 150MHz | 100MHz, 156.25MHz | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock4 644 |
|
- | - | Enable/Disable | HCSL, LVCMOS, LVDS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock5 364 |
|
- | - | Enable/Disable | HCSL, LVCMOS, LVDS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock4 464 |
|
- | - | Enable/Disable | HCSL, LVDS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock2 142 |
|
- | - | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
paquet: 20-VFQFN Exposed Pad |
Stock2 934 |
|
- | - | Enable/Disable | LVPECL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | - | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) | 20-VFQFN Exposed Pad |