Produits Maxim Integrated - Embarqués - Microcontrôleurs | Heisener Electronics
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Produits Maxim Integrated - Embarqués - Microcontrôleurs

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Image
Référence
Fabricant
Description
paquet
Stock
Quantité
Core Size
Speed
Connectivity
Peripherals
Number of I/O
Program Memory Size
Program Memory Type
EEPROM Size
RAM Size
Voltage - Supply (Vcc/Vdd)
Data Converters
Oscillator Type
Operating Temperature
Mounting Type
Package / Case
Supplier Device Package
MAX32632IWQ+T
Maxim Integrated

CORTEX-M4F MICROCONTRLR FOR WEAR

  • Core Processor: ARM® Cortex®-M4F
  • Core Size: 32-Bit
  • Speed: 96MHz
  • Connectivity: 1-Wire, I²C, SPI, UART/USART, USB
  • Peripherals: Brown-out Detect/Reset, POR, PWM, TPU, WDT
  • Number of I/O: 66
  • Program Memory Size: 2MB (2M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 1.14V ~ 3.6V
  • Data Converters: A/D 4x10b
  • Oscillator Type: Internal
  • Operating Temperature: -20°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-WFBGA, WLBGA
  • Supplier Device Package: 100-WLP (4.4x4.4)
paquet: 100-WFBGA, WLBGA
Stock4 144
32-Bit
96MHz
1-Wire, I²C, SPI, UART/USART, USB
Brown-out Detect/Reset, POR, PWM, TPU, WDT
66
2MB (2M x 8)
FLASH
-
512K x 8
1.14V ~ 3.6V
A/D 4x10b
Internal
-20°C ~ 85°C (TA)
Surface Mount
100-WFBGA, WLBGA
100-WLP (4.4x4.4)
MAX28200EWC+U
Maxim Integrated

IC MCU 16BIT RISC 16KB 12WLP

  • Core Processor: MAXQ
  • Core Size: 16-Bit
  • Speed: -
  • Connectivity: I²C
  • Peripherals: PWM, WDT
  • Number of I/O: 4
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
  • Data Converters: A/D 2x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 12-XFBGA, WLBGA
  • Supplier Device Package: 12-WLP (1.67x1.77)
paquet: 12-XFBGA, WLBGA
Stock6 132
16-Bit
-
I²C
PWM, WDT
4
16KB (16K x 8)
FLASH
-
2K x 8
1.71V ~ 3.63V
A/D 2x10b
Internal
-40°C ~ 85°C (TA)
Surface Mount
12-XFBGA, WLBGA
12-WLP (1.67x1.77)
MAX32660GTP+T
Maxim Integrated

CORTEX M4F 96MHZ ME11

  • Core Processor: ARM® Cortex®-M4F
  • Core Size: 32-Bit
  • Speed: 96MHz
  • Connectivity: I²C, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
  • Number of I/O: 14
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 96K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 20-WFQFN Exposed Pad
  • Supplier Device Package: 20-TQFN (4x4)
paquet: 20-WFQFN Exposed Pad
Stock3 008
32-Bit
96MHz
I²C, SPI, UART/USART
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
14
256KB (256K x 8)
FLASH
-
96K x 8
1.71V ~ 3.63V
-
Internal
-40°C ~ 105°C (TA)
Surface Mount
20-WFQFN Exposed Pad
20-TQFN (4x4)
MAX32660GTG+T
Maxim Integrated

CORTEX M4F 96MHZ ME11 TQFN 3X3

  • Core Processor: ARM® Cortex®-M4F
  • Core Size: 32-Bit
  • Speed: 96MHz
  • Connectivity: I²C, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
  • Number of I/O: 14
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 96K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 24-WFQFN Exposed Pad
  • Supplier Device Package: 24-TQFN (3x3)
paquet: 24-WFQFN Exposed Pad
Stock3 136
32-Bit
96MHz
I²C, SPI, UART/USART
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
14
256KB (256K x 8)
FLASH
-
96K x 8
1.71V ~ 3.63V
-
Internal
-40°C ~ 105°C (TA)
Surface Mount
24-WFQFN Exposed Pad
24-TQFN (3x3)
MAX32651GWQ+
Maxim Integrated

CORTEX M4F SECURE/JTAG WLP

  • Core Processor: ARM® Cortex®-M4F
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: 1-Wire, EBI/EMI, I²C, QSPI, SPI, UART/USART, USB
  • Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
  • Number of I/O: 67
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 1M x 8
  • Voltage - Supply (Vcc/Vdd): 0.99V ~ 3.6V
  • Data Converters: A/D 4x10b Sigma-Delta
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 96-WFBGA, WLBGA
  • Supplier Device Package: 96-WLP (4.47x4.44)
paquet: 96-WFBGA, WLBGA
Stock6 636
32-Bit
120MHz
1-Wire, EBI/EMI, I²C, QSPI, SPI, UART/USART, USB
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
67
3MB (3M x 8)
FLASH
-
1M x 8
0.99V ~ 3.6V
A/D 4x10b Sigma-Delta
Internal
-40°C ~ 105°C (TA)
Surface Mount
96-WFBGA, WLBGA
96-WLP (4.47x4.44)
MAX32666GWP+
Maxim Integrated

IC MCU 32/64BIT BLE5 109WLP

  • Core Processor: ARM® Cortex®-M4F
  • Core Size: 32-Bit Dual-Core
  • Speed: 96MHz
  • Connectivity: I²C, SPI, UART/USART, USB
  • Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
  • Number of I/O: 48
  • Program Memory Size: 1MB (1M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 560K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 109-WFBGA, WLPBGA
  • Supplier Device Package: 109-WLP (3.78x4.18)
paquet: 109-WFBGA, WLPBGA
Stock6 240
32-Bit Dual-Core
96MHz
I²C, SPI, UART/USART, USB
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
48
1MB (1M x 8)
FLASH
-
560K x 8
1.71V ~ 3.6V
A/D 8x10b
Internal
-40°C ~ 105°C (TA)
Surface Mount
109-WFBGA, WLPBGA
109-WLP (3.78x4.18)
MAX32660GTP+
Maxim Integrated

CORTEX M4F 96MHZ ME11

  • Core Processor: ARM® Cortex®-M4F
  • Core Size: 32-Bit
  • Speed: 96MHz
  • Connectivity: I²C, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
  • Number of I/O: 14
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 96K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 20-WFQFN Exposed Pad
  • Supplier Device Package: 20-TQFN (4x4)
paquet: 20-WFQFN Exposed Pad
Stock7 792
32-Bit
96MHz
I²C, SPI, UART/USART
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
14
256KB (256K x 8)
FLASH
-
96K x 8
1.71V ~ 3.63V
-
Internal
-40°C ~ 105°C (TA)
Surface Mount
20-WFQFN Exposed Pad
20-TQFN (4x4)
MAX32660GTG+
Maxim Integrated

CORTEX M4F 96MHZ ME11 TQFN

  • Core Processor: ARM® Cortex®-M4F
  • Core Size: 32-Bit
  • Speed: 96MHz
  • Connectivity: I²C, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
  • Number of I/O: 14
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 96K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 24-WFQFN Exposed Pad
  • Supplier Device Package: 24-TQFN (3x3)
paquet: 24-WFQFN Exposed Pad
Stock7 716
32-Bit
96MHz
I²C, SPI, UART/USART
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
14
256KB (256K x 8)
FLASH
-
96K x 8
1.71V ~ 3.63V
-
Internal
-40°C ~ 105°C (TA)
Surface Mount
24-WFQFN Exposed Pad
24-TQFN (3x3)
IC0400C782SF+LTB
Maxim Integrated

INTEGRATED CIRCUIT

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock6 352
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
MAXQ614V-UEI+T
Maxim Integrated

IC INTEGRATED CIRCUIT

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock5 792
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
MAXQ614V-L000+T
Maxim Integrated

IC INTEGRATED CIRCUIT

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock4 768
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
MAXQ614V-2566+T
Maxim Integrated

IC INTEGRATED CIRCUIT

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock3 552
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
MAXQ614V-2554+T
Maxim Integrated

IC INTEGRATED CIRCUIT

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock6 160
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
MAXQ618J-UEI+
Maxim Integrated

IC INTEGRATED CIRCUIT

  • Core Processor: MAXQ20S
  • Core Size: 16-Bit
  • Speed: 12MHz
  • Connectivity: SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
  • Number of I/O: 32
  • Program Memory Size: 80KB (80K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 44-WFQFN Exposed Pad
  • Supplier Device Package: 44-TQFN-EP (7x7)
paquet: 44-WFQFN Exposed Pad
Stock2 112
16-Bit
12MHz
SPI, UART/USART
Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
32
80KB (80K x 8)
FLASH
-
2K x 8
1.7V ~ 3.6V
-
Internal
0°C ~ 70°C (TA)
Surface Mount
44-WFQFN Exposed Pad
44-TQFN-EP (7x7)
MAXQ618J-2571+
Maxim Integrated

IC INTEGRATED CIRCUIT

  • Core Processor: MAXQ20S
  • Core Size: 16-Bit
  • Speed: 12MHz
  • Connectivity: SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
  • Number of I/O: 32
  • Program Memory Size: 80KB (80K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 44-WFQFN Exposed Pad
  • Supplier Device Package: 44-TQFN-EP (7x7)
paquet: 44-WFQFN Exposed Pad
Stock7 776
16-Bit
12MHz
SPI, UART/USART
Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
32
80KB (80K x 8)
FLASH
-
2K x 8
1.7V ~ 3.6V
-
Internal
0°C ~ 70°C (TA)
Surface Mount
44-WFQFN Exposed Pad
44-TQFN-EP (7x7)
MAXQ613A-UEI+
Maxim Integrated

IC INTEGRATED CIRCUIT

  • Core Processor: MAXQ20S
  • Core Size: 16-Bit
  • Speed: 12MHz
  • Connectivity: SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
  • Number of I/O: 20
  • Program Memory Size: 48KB (48K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 1.5K x 8
  • Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 32-WFQFN Exposed Pad
  • Supplier Device Package: 32-TQFN-EP (5x5)
paquet: 32-WFQFN Exposed Pad
Stock4 960
16-Bit
12MHz
SPI, UART/USART
Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
20
48KB (48K x 8)
FLASH
-
1.5K x 8
1.7V ~ 3.6V
-
Internal
0°C ~ 70°C (TA)
Surface Mount
32-WFQFN Exposed Pad
32-TQFN-EP (5x5)
MAXQ612J-UEI+
Maxim Integrated

IC INTEGRATED CIRCUIT

  • Core Processor: MAXQ20S
  • Core Size: 16-Bit
  • Speed: 12MHz
  • Connectivity: I²C, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
  • Number of I/O: 32
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 6K x 8
  • Voltage - Supply (Vcc/Vdd): 1.75V ~ 3.6V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 44-WFQFN Exposed Pad
  • Supplier Device Package: 44-TQFN-EP (7x7)
paquet: 44-WFQFN Exposed Pad
Stock7 088
16-Bit
12MHz
I²C, SPI, UART/USART
Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
32
128KB (128K x 8)
FLASH
-
6K x 8
1.75V ~ 3.6V
-
Internal
0°C ~ 70°C (TA)
Surface Mount
44-WFQFN Exposed Pad
44-TQFN-EP (7x7)
MAXQ610K-UEI+
Maxim Integrated

IC INTEGRATED CIRCUIT

  • Core Processor: MAXQ20S
  • Core Size: 16-Bit
  • Speed: 12MHz
  • Connectivity: SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
  • Number of I/O: 32
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 44-WFQFN Exposed Pad
  • Supplier Device Package: 44-TQFN-EP (7x7)
paquet: 44-WFQFN Exposed Pad
Stock7 472
16-Bit
12MHz
SPI, UART/USART
Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
32
64KB (64K x 8)
FLASH
-
2K x 8
1.7V ~ 3.6V
-
Internal
0°C ~ 70°C (TA)
Surface Mount
44-WFQFN Exposed Pad
44-TQFN-EP (7x7)
MAXQ610E-UEI+
Maxim Integrated

IC INTEGRATED CIRCUIT

  • Core Processor: MAXQ20S
  • Core Size: 16-Bit
  • Speed: 12MHz
  • Connectivity: SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
  • Number of I/O: 20
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 32-LQFP
  • Supplier Device Package: 32-LQFP/32-TQFP (7x7)
paquet: 32-LQFP
Stock5 664
16-Bit
12MHz
SPI, UART/USART
Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
20
64KB (64K x 8)
FLASH
-
2K x 8
1.7V ~ 3.6V
-
Internal
0°C ~ 70°C (TA)
Surface Mount
32-LQFP
32-LQFP/32-TQFP (7x7)
MAXQ610X-2016+
Maxim Integrated

IC MCU 16BIT FLASH TQFN

  • Core Processor: MAXQ20S
  • Core Size: 16-Bit
  • Speed: 12MHz
  • Connectivity: SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
  • Number of I/O: 32
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: Die
  • Supplier Device Package: Diesale
paquet: Die
Stock4 992
16-Bit
12MHz
SPI, UART/USART
Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
32
64KB (64K x 8)
FLASH
-
2K x 8
1.7V ~ 3.6V
-
Internal
0°C ~ 70°C (TA)
Surface Mount
Die
Diesale
MAXQ610B-UEI+
Maxim Integrated

IC MCU 16BIT 64KB FLASH TQFN

  • Core Processor: MAXQ20S
  • Core Size: 16-Bit
  • Speed: 12MHz
  • Connectivity: SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
  • Number of I/O: 32
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 40-WFQFN Exposed Pad
  • Supplier Device Package: 40-TQFN (6x6)
paquet: 40-WFQFN Exposed Pad
Stock6 784
16-Bit
12MHz
SPI, UART/USART
Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
32
64KB (64K x 8)
FLASH
-
2K x 8
1.7V ~ 3.6V
-
Internal
0°C ~ 70°C (TA)
Surface Mount
40-WFQFN Exposed Pad
40-TQFN (6x6)
MAXQ618J-2571+T
Maxim Integrated

IC POWER MANAGEMENT

  • Core Processor: MAXQ20S
  • Core Size: 16-Bit
  • Speed: 12MHz
  • Connectivity: SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
  • Number of I/O: 32
  • Program Memory Size: 80KB (80K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 44-WFQFN Exposed Pad
  • Supplier Device Package: 44-TQFN-EP (7x7)
paquet: 44-WFQFN Exposed Pad
Stock5 424
16-Bit
12MHz
SPI, UART/USART
Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
32
80KB (80K x 8)
FLASH
-
2K x 8
1.7V ~ 3.6V
-
Internal
0°C ~ 70°C (TA)
Surface Mount
44-WFQFN Exposed Pad
44-TQFN-EP (7x7)
MAXQ612G-UEI+
Maxim Integrated

IC POWER MANAGEMENT

  • Core Processor: MAXQ20S
  • Core Size: 16-Bit
  • Speed: 12MHz
  • Connectivity: I²C, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
  • Number of I/O: 44
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 6K x 8
  • Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
paquet: 64-LQFP
Stock2 528
16-Bit
12MHz
I²C, SPI, UART/USART
Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
44
128KB (128K x 8)
FLASH
-
6K x 8
1.7V ~ 3.6V
-
Internal
0°C ~ 70°C (TA)
Surface Mount
64-LQFP
64-LQFP (10x10)
MAXQ61HX-2621+
Maxim Integrated

MODULE MCU 16BIT

  • Core Processor: MAXQ
  • Core Size: 16-Bit
  • Speed: 12MHz
  • Connectivity: -
  • Peripherals: Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
  • Number of I/O: 24
  • Program Memory Size: 36KB (36K x 8)
  • Program Memory Type: ROM
  • EEPROM Size: -
  • RAM Size: 1.28K x 8
  • Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: 0°C ~ 70°C
  • Mounting Type: Surface Mount
  • Package / Case: Die
  • Supplier Device Package: Die
paquet: Die
Stock3 232
16-Bit
12MHz
-
Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
24
36KB (36K x 8)
ROM
-
1.28K x 8
1.7V ~ 3.6V
-
-
0°C ~ 70°C
Surface Mount
Die
Die
MAXQ61HX-2620+
Maxim Integrated

MODULE MCU 16BIT

  • Core Processor: MAXQ
  • Core Size: 16-Bit
  • Speed: 12MHz
  • Connectivity: -
  • Peripherals: Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
  • Number of I/O: 24
  • Program Memory Size: 36KB (36K x 8)
  • Program Memory Type: ROM
  • EEPROM Size: -
  • RAM Size: 1.28K x 8
  • Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: 0°C ~ 70°C
  • Mounting Type: Surface Mount
  • Package / Case: Die
  • Supplier Device Package: Die
paquet: Die
Stock2 752
16-Bit
12MHz
-
Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
24
36KB (36K x 8)
ROM
-
1.28K x 8
1.7V ~ 3.6V
-
-
0°C ~ 70°C
Surface Mount
Die
Die
MAXQ61HX-2597+
Maxim Integrated

MODULE MCU 16BIT

  • Core Processor: MAXQ
  • Core Size: 16-Bit
  • Speed: 12MHz
  • Connectivity: -
  • Peripherals: Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
  • Number of I/O: 24
  • Program Memory Size: 36KB (36K x 8)
  • Program Memory Type: ROM
  • EEPROM Size: -
  • RAM Size: 1.28K x 8
  • Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: 0°C ~ 70°C
  • Mounting Type: Surface Mount
  • Package / Case: Die
  • Supplier Device Package: Die
paquet: Die
Stock3 264
16-Bit
12MHz
-
Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
24
36KB (36K x 8)
ROM
-
1.28K x 8
1.7V ~ 3.6V
-
-
0°C ~ 70°C
Surface Mount
Die
Die
MAXQ61HX-2594+
Maxim Integrated

MODULE MCU 16BIT

  • Core Processor: MAXQ
  • Core Size: 16-Bit
  • Speed: 12MHz
  • Connectivity: -
  • Peripherals: Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
  • Number of I/O: 24
  • Program Memory Size: 36KB (36K x 8)
  • Program Memory Type: ROM
  • EEPROM Size: -
  • RAM Size: 1.28K x 8
  • Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: 0°C ~ 70°C
  • Mounting Type: Surface Mount
  • Package / Case: Die
  • Supplier Device Package: Die
paquet: Die
Stock7 248
16-Bit
12MHz
-
Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
24
36KB (36K x 8)
ROM
-
1.28K x 8
1.7V ~ 3.6V
-
-
0°C ~ 70°C
Surface Mount
Die
Die
MAXQ61HX-2047+
Maxim Integrated

MODULE MCU 16BIT

  • Core Processor: MAXQ
  • Core Size: 16-Bit
  • Speed: 12MHz
  • Connectivity: -
  • Peripherals: Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
  • Number of I/O: 24
  • Program Memory Size: 36KB (36K x 8)
  • Program Memory Type: ROM
  • EEPROM Size: -
  • RAM Size: 1.28K x 8
  • Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: 0°C ~ 70°C
  • Mounting Type: Surface Mount
  • Package / Case: Die
  • Supplier Device Package: Die
paquet: Die
Stock2 688
16-Bit
12MHz
-
Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
24
36KB (36K x 8)
ROM
-
1.28K x 8
1.7V ~ 3.6V
-
-
0°C ~ 70°C
Surface Mount
Die
Die