Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC CONTROLLER PCM 44LCC
|
paquet: 44-LCC (J-Lead) |
Stock5 072 |
|
ISDN, PCM | 1 | 5V | 9.5mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | P-LCC-44 |
||
Microsemi Corporation |
IC TIMING-OVER-PACKET 324BGA
|
paquet: 324-BGA |
Stock2 832 |
|
- | 1 | 3 V ~ 3.6 V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microsemi Corporation |
IC CESOP PROCESSOR 552BGA
|
paquet: 552-BGA |
Stock6 448 |
|
TDM | 1 | 1.65 V ~ 1.95 V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
||
Silicon Labs |
IC PROSLIC FXS DUAL -140V 50QFN
|
paquet: - |
Stock2 288 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | - | 50-QFN (6x8) |
||
Silicon Labs |
IC PROSLIC FXS DTMF -110V 42QFN
|
paquet: 42-WFQFN Exposed Pad |
Stock13 452 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | - | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Maxim Integrated |
IC MUX FRAMER T3 E3 256BGA
|
paquet: 256-BGA |
Stock2 416 |
|
Parallel/Serial | - | 3.135 V ~ 3.465 V | 150mA | - | 0°C ~ 70°C | Surface Mount | 256-BGA | 256-PBGA (27x27) |
||
Silicon Labs |
IC SLIC/CODEC 2CHANNEL 64TQFP
|
paquet: 64-TQFP |
Stock4 352 |
|
GCI, PCM, SPI | 2 | 3.3V | - | - | - | Surface Mount | 64-TQFP | 64-TQFP (10x10) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 SGL 144CSBGA
|
paquet: 144-BGA, CSPBGA |
Stock7 456 |
|
LIU | 1 | 3.135 V ~ 3.465 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/J1/E1 28+1CH 640BGA
|
paquet: 640-BGA Exposed Pad |
Stock7 936 |
|
LIU | - | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 640-BGA Exposed Pad | 640-PBGA-EP (31x31) |
||
Intersil |
IC SLIC UNIVERSAL LP 28-PLCC
|
paquet: 28-LCC (J-Lead) |
Stock3 120 |
|
- | 1 | 4.75 V ~ 5.25 V | 2.25mA | 1.5W | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Maxim Integrated |
IC QUAD DS3/E3 TXRX 400BGA
|
paquet: 400-BBGA |
Stock4 624 |
|
DS3, E3 | 4 | 3.135 V ~ 3.465 V | 725mA | - | -40°C ~ 85°C | Surface Mount | 400-BBGA | 400-PBGA (27x27) |
||
Silicon Labs |
IC SLIC/CODEC 1CH 38QFN
|
paquet: 38-VFQFN Exposed Pad |
Stock6 848 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | 0°C ~ 70°C | Surface Mount | 38-VFQFN Exposed Pad | 38-QFN (5x7) |
||
Rohm Semiconductor |
IC PCM CODEC DUAL MIC VQFP48
|
paquet: 48-LQFP |
Stock7 856 |
|
- | 1 | 2.7 V ~ 3.3 V | - | 400mW | -30°C ~ 85°C | Surface Mount | 48-LQFP | 48-VQFP (7x7) |
||
Maxim Integrated |
IC TRANSCEIVER T1 44-PLCC
|
paquet: 44-LCC (J-Lead) |
Stock7 776 |
|
T1 | 1 | 4.5 V ~ 5.5 V | 3mA | - | 0°C ~ 70°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
IDT, Integrated Device Technology Inc |
IC TXRX T1/J1/E1 2CHAN 100TQFP
|
paquet: 100-LQFP |
Stock4 976 |
|
SPI | 2 | 3 V ~ 3.6 V | - | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-TQFP (14x20) |
||
IDT, Integrated Device Technology Inc |
IC LIU E1 8CH SHORT HAUL 144TQFP
|
paquet: 144-LQFP |
Stock5 952 |
|
- | - | 3.13 V ~ 3.47 V | - | - | - | Surface Mount | 144-LQFP | 144-TQFP (20x20) |
||
Silicon Labs |
IC PROSLIC PCM/SPI -110V 42QFN
|
paquet: 42-WFQFN Exposed Pad |
Stock7 360 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Silicon Labs |
IC SLIC/CODEC PROG 1CH 38TSSOP
|
paquet: 38-TFSOP (0.173", 4.40mm Width) |
Stock22 644 |
|
PCM, SPI | 1 | 3.3V, 5V | 88mA | 700mW | 0°C ~ 70°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
IXYS Integrated Circuits Division |
DAA LITELINK III RING DETECT
|
paquet: - |
Stock6 432 |
|
- | - | - | - | - | - | - | - | - |
||
Exar Corporation |
IC LIU LH/SH T1/E1 SGL 64TQFP
|
paquet: 64-LQFP |
Stock7 764 |
|
LIU | 1 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 64-LQFP | 64-TQFP (10x10) |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
paquet: - |
Stock5 376 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CESOP PROCESSOR 32CH 324BGA
|
paquet: 324-BGA |
Stock6 528 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC TXRX SGL T1/E1 100MQFP
|
paquet: 100-BQFP |
Stock7 552 |
|
- | 1 | 4.75V ~ 5.25V | 200mA | - | -40°C ~ 85°C | Surface Mount | 100-BQFP | 100-MQFP (14x20) |
||
Microchip Technology |
IC TDM/TSI SWITCH 256X256 44PLCC
|
paquet: 44-LCC (J-Lead) |
Stock6 192 |
|
- | 1 | 3V ~ 3.6V | 4mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.51x16.51) |
||
Infineon Technologies |
VINAX 8-CHANNEL 17MHZ LD
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Freescale Semiconductor |
TELEPHONE RINGER CIRCUIT
|
paquet: - |
Request a Quote |
|
- | 1 | 5V | 20mA | 1 W | -20°C ~ 60°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Broadcom Limited |
SWITCH FABRIC
|
paquet: - |
Request a Quote |
|
PCI Express | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
1000BASE-T1 PHY
|
paquet: - |
Request a Quote |
|
PHY | - | - | - | - | - | - | - | - |