Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC MODULAR ISDN NT INTELL TQFP64
|
paquet: 64-LQFP |
Stock4 768 |
|
HDLC, ISDN, SCI | 1 | 3.3V | 30mA | - | 0°C ~ 70°C | Surface Mount | 64-LQFP | P-TQFP-64 |
||
Microsemi Corporation |
IC SYNCHRONIZER T1/E1/OC3 48SSOP
|
paquet: 48-BSSOP (0.295", 7.50mm Width) |
Stock20 244 |
|
- | 1 | 3 V ~ 3.6 V | 50mA | - | -40°C ~ 85°C | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
Microsemi Corporation |
IC LINE CARD LCAS 1CH 16SOIC
|
paquet: 16-SOIC (0.295", 7.50mm Width) |
Stock26 964 |
|
- | 1 | 4.5 V ~ 5.5 V | - | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Maxim Integrated |
IC LIU T1/E1/J1 SCT 100P CSBGA
|
paquet: 100-LFBGA, CSPBGA |
Stock7 168 |
|
E1, HDLC, J1, T1 | 1 | 3.14 V ~ 3.47 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LFBGA, CSPBGA | 100-CSBGA (10x10) |
||
Silicon Labs |
IC PROSLIC LINE FEED 150V 16SOIC
|
paquet: 16-SOIC (0.154", 3.90mm Width) |
Stock35 952 |
|
GCI, PCM, SPI | 4 | 3.3V | - | - | - | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Exar Corporation |
IC JITTER ATTENUATOR 3CH 64TQFP
|
paquet: 64-LQFP |
Stock5 264 |
|
Serial | 1 | 3.135 V ~ 5.25 V | 160mA | - | -40°C ~ 85°C | Surface Mount | 64-LQFP | 64-TQFP (10x10) |
||
Exar Corporation |
IC LIU T1/E1 SGL 28SOJ
|
paquet: 28-BSOJ (0.300", 7.62mm Width) |
Stock5 616 |
|
LIU | 1 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 28-BSOJ (0.300", 7.62mm Width) | 28-SOJ |
||
IDT, Integrated Device Technology Inc |
IC LIU E1 2CH SHORT HAUL 80-TQFP
|
paquet: 80-LQFP |
Stock6 064 |
|
LIU | - | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 80-LQFP | 80-TQFP (14x14) |
||
Silicon Labs |
IC SLIC/CODEC 1CH 38TSSOP
|
paquet: 38-TFSOP (0.173", 4.40mm Width) |
Stock4 080 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | -40°C ~ 85°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
Maxim Integrated |
IC TXRX E1 1-CHIP 5V IND 44-PLCC
|
paquet: 44-LCC (J-Lead) |
Stock2 528 |
|
E1 | 1 | 4.8 V ~ 5.25 V | 65mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Maxim Integrated |
IC 32PORT TDM OVER PACKET 676BGA
|
paquet: 676-BGA |
Stock2 032 |
|
TDMoP | 1 | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 676-BGA | 676-PBGA (27x27) |
||
Maxim Integrated |
IC TXRX T1 1-CHIP 5V 100-LQFP
|
paquet: 100-LQFP |
Stock5 568 |
|
E1, HDLC, J1, T1 | 1 | 4.75 V ~ 5.25 V | 75mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Microsemi Corporation |
IC SLIC 2CH UNIV 100V 48TQFP
|
paquet: - |
Stock98 400 |
|
Parallel | 2 | 3.3V | 40mA | - | - | Surface Mount | - | 48-eTQFP |
||
Silicon Labs |
IC SYSTEM-SIDE DAA 20TSSOP
|
paquet: 20-TSSOP (0.173", 4.40mm Width) |
Stock343 224 |
|
GCI, PCM, SPI | 1 | 3 V ~ 3.6 V | 8.5mA | - | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microsemi Corporation |
IC TRACKING BATT 150V 2CH 64QFN
|
paquet: 64-VFQFN Exposed Pad |
Stock139 812 |
|
PCM | 1 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 64-VFQFN Exposed Pad | 64-QFN (9x9) |
||
Silicon Labs |
IC SLIC/CODEC 1CH 38QFN
|
paquet: 38-VFQFN Exposed Pad |
Stock16 236 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | 0°C ~ 70°C | Surface Mount | 38-VFQFN Exposed Pad | 38-QFN (5x7) |
||
Microchip Technology |
84/63 CHAN T1/E1 VT1.5/VT2 MAPPE
|
paquet: - |
Stock6 992 |
|
E1, T1 | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC VOICEPORT FXS 8KHZ 44LQFP
|
paquet: 44-LQFP |
Stock4 352 |
|
PCM | 1 | 3V, 5V | - | - | - | Surface Mount | 44-LQFP | 44-eLQFP |
||
Microchip Technology |
IC ECHO CANCELLER DUAL 28PLCC
|
paquet: 28-LCC |
Stock5 568 |
|
Serial | 2 | 4.5V ~ 5.5V | 50mA | - | -40°C ~ 85°C | Surface Mount | 28-LCC | 28-PLCC |
||
Microchip Technology |
EIGHT CHANNEL COMBINED T1/E1/J1
|
paquet: - |
Stock4 928 |
|
E1, J1, SPI, T1 | 8 | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | - | 256-CABGA (17x17) |
||
Harris Corporation |
3 REN RINGING SLIC FOR ISDN MODE
|
paquet: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | 4.75V ~ 5.25V | 6mA | 300 mW | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Broadcom Limited |
TRANSCEIVER
|
paquet: - |
Request a Quote |
|
Ethernet | 2 | - | - | - | - | - | - | - |
||
Cirrus Logic Inc. |
CS61577 - T1/ E1 LINE INTERFACE
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
4 PORT SKU FOR EPON/GPON/10G, I
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
PMC-Sierra |
TELECOM CIRCUIT, BIPOLAR, PDSO24
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Cirrus Logic Inc. |
CS61574 - T1/E1 LINE INTERFACE
|
paquet: - |
Request a Quote |
|
E1, T1 | 1 | 4.75V ~ 5.25V | - | 350 mW | -40°C ~ 85°C | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
||
Broadcom Limited |
BCM63137USP00
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - |
||
Harris Corporation |
EIA/ITU PABX SLIC
|
paquet: - |
Request a Quote |
|
2-Wire, 4-Wire | 1 | -42V ~ -58V, 4.75V ~ 5.25V, 10.8V ~ 13.2V | - | 690 mW | -40°C ~ 85°C | Through Hole | 24-DIP (0.600", 15.24mm) | 24-PDIP |