Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Input Type | Output Type | Interface | Current - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ON Semiconductor |
IC SENSOR QUAD 24SOIC
|
paquet: 24-SOIC (0.295", 7.50mm Width) |
Stock4 160 |
|
- | - | Differential | 24mA | - | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SOIC |
||
Texas Instruments |
IC PROG SENSOR
|
paquet: Die |
Stock5 168 |
|
Voltage | Voltage | UART | 1.6mA | 0°C ~ 70°C | Surface Mount | Die | Die |
||
Texas Instruments |
IC 4-20MA TRANSMITTER 16-SOIC
|
paquet: 16-SOIC (0.295", 7.50mm Width) |
Stock5 200 |
|
Differential | Voltage | 2-Wire | 20mA | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Melexis Technologies NV |
TOF COMPANION CHIP
|
paquet: - |
Stock7 072 |
|
- | - | I2C | - | -20°C ~ 85°C | - | - | - |
||
Texas Instruments |
IC CRNT TRANSMITTER WAFFLE PACK
|
paquet: Die |
Stock3 200 |
|
Voltage | Voltage | 2-Wire | 20mA | -55°C ~ 125°C | - | Die | - |
||
ams |
ULTRASONIC FLOW SENSOR 32QFN
|
paquet: 32-VFQFN |
Stock4 352 |
|
Logic | Logic | SPI, UART | 1.9µA | -40°C ~ 85°C | Surface Mount | 32-VFQFN | 32-QFN (5x5) |
||
Maxim Integrated |
IC CONV THRMCPLE-DIG K TYPE TDFN
|
paquet: 10-WFDFN Exposed Pad |
Stock4 992 |
|
Thermocouple (Multiple) | Digital | 1-Wire? | 900µA | -40°C ~ 125°C | Surface Mount | 10-WFDFN Exposed Pad | 10-TDFN-EP (3x4) |
||
Maxim Integrated |
IC TRANSLATOR/SERIALIZER 28TSSOP
|
paquet: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad |
Stock4 416 |
|
Analog | Digital | SPI | 1.4mA | -40°C ~ 125°C | Surface Mount | 28-TSSOP (0.173", 4.40mm Width) Exposed Pad | 28-TSSOP-EP |
||
Microchip Technology |
IC SMOKE DETECT PHOTO MEM 16DIP
|
paquet: 16-DIP (0.300", 7.62mm) |
Stock2 100 |
|
Photoelectric | Voltage | - | 6µA | -25°C ~ 75°C | Through Hole | 16-DIP (0.300", 7.62mm) | 16-PDIP |
||
Microchip Technology |
IC SMOKE DETECTOR CMOS 16-SOIC
|
paquet: 16-SOIC (0.154", 3.90mm Width) |
Stock3 600 |
|
Photoelectric | Voltage | - | 4µA | -25°C ~ 75°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC HORN DRIVER DUAL 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock54 000 |
|
Logic | Logic | Logic | 4µA | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Texas Instruments |
IC TX 4-20MA CURR-LOOP 8SON
|
paquet: 8-VDFN Exposed Pad |
Stock6 688 |
|
Voltage | Voltage | 2-Wire | 20mA | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-SON (3x3) |
||
Maxim Integrated |
4-20MA ANALOG BACKEND
|
paquet: 32-WFQFN Exposed Pad |
Stock6 368 |
|
Voltage | Voltage | 3-Wire | - | -40°C ~ 125°C | Surface Mount | 32-WFQFN Exposed Pad | 32-TQFN (5x5) |
||
Analog Devices Inc. |
IC CCD SIGNAL PROC 10BIT 48-LQFP
|
paquet: - |
Request a Quote |
|
Logic | Logic | - | - | -20°C ~ 85°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
Renesas Electronics Corporation |
WAFER (UNSAWN) - BOX
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
WAFER (UNSAWN) - WAFER BOX
|
paquet: - |
Request a Quote |
|
Analog | 1-Wire®, I2C | - | 7 mA | -40°C ~ 150°C (TA) | Surface Mount | Die | Die |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - WAFFLE PACK
|
paquet: - |
Request a Quote |
|
Analog | 1-Wire®, I2C | - | 7 mA | -40°C ~ 150°C (TA) | Surface Mount | Die | Die |
||
ScioSense |
TDC-GPX2 QFN64 TRA
|
paquet: - |
Request a Quote |
|
CMOS, LVDS | LVDS, Serial, SPI | - | 100 µA | -40°C ~ 125°C (TA) | Surface Mount | 64-LQFP | 64-QFP (10x10) |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
WAFER (SAWN) - FRAME
|
paquet: - |
Request a Quote |
|
Analog | 1-Wire®, I2C, SPI | - | 2.8 mA | -40°C ~ 125°C (TA) | Surface Mount | Die | Die |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - WAFFLE PACK
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
MSIG (MIXEDSIGNAL) RDC-IC 48LQFP
|
paquet: - |
Request a Quote |
|
Analog, Digital | Serial, SPI | - | 40 mA | -40°C ~ 85°C (TA) | Surface Mount | 48-LQFP | 48-LFQFP (7x7) |
||
Renesas Electronics Corporation |
WAFER (UNSAWN) - BOX
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
LSI/CSI |
IC SENSOR INTERFACE 16DIP
|
paquet: - |
Request a Quote |
|
Differential | - | - | 350 µA | -40°C ~ 85°C (TA) | Through Hole | 16-DIP (0.300", 7.62mm) | 16-DIP |
||
Renesas Electronics Corporation |
WAFER (UNSAWN) - BOX
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
TSSOP / 16 / 5X4MM-0
|
paquet: - |
Request a Quote |
|
Differential | 1-Wire® | - | - | -40°C ~ 150°C | Surface Mount, Wettable Flank | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Microchip Technology |
E-CAL ION SMOKE DETECTOR
|
paquet: - |
Stock2 154 |
|
Ionization | - | - | 5.3 µA | -10°C ~ 60°C (TA) | Through Hole | 16-DIP (0.300", 7.62mm) | 16-PDIP |