Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Input Type | Output Type | Interface | Current - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
STMicroelectronics |
IC DRIVER ISO 9141 8SOIC
|
paquet: - |
Stock4 880 |
|
- | - | - | - | - | - | - | - |
|
|
Microchip Technology |
IC SMOKE DETECT PHOTO MEM 16SOIC
|
paquet: 16-SOIC (0.295", 7.50mm Width) |
Stock6 976 |
|
Photoelectric | Voltage | - | 6µA | -25°C ~ 75°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
|
|
|
Texas Instruments |
IC IMAGE SENSOR
|
paquet: - |
Stock6 928 |
|
Logic | Logic | - | 2mA | -20°C ~ 45°C | - | - | - |
|
|
ON Semiconductor |
IC TACH/SPEEDO DRIVER 16-DIP
|
paquet: 16-DIP (0.300", 7.62mm) |
Stock5 760 |
|
Voltage | Differential | - | 125mA | -40°C ~ 105°C | Through Hole | 16-DIP (0.300", 7.62mm) | 16-DIP |
|
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Texas Instruments |
IC V TO I CONVERTER/XMTR 16 DIP
|
paquet: 16-DIP (0.300", 7.62mm) |
Stock6 720 |
|
Voltage | Current | - | 20mA | 0°C ~ 70°C | Through Hole | 16-DIP (0.300", 7.62mm) | 16-PDIP |
|
|
Analog Devices Inc. |
IC THERMOCOUPLE A W/COMP 8MSOP
|
paquet: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock4 192 |
|
Differential | Analog | - | 250µA | 25°C ~ 100°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
|
|
|
Melexis Technologies NV |
IC OPTICAL PROXIMITY 24QFN
|
paquet: - |
Stock4 176 |
|
- | - | - | 2.1mA | -40°C ~ 125°C | - | - | - |
|
|
Microchip Technology |
IC SENSOR FUSION MOVEA 84TFBGA
|
paquet: 84-TFBGA |
Stock6 352 |
|
- | - | I2C | - | - | Surface Mount | 84-TFBGA | 84-TFBGA (6x6) |
|
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|
Melexis Technologies NV |
IC OPTICAL PROXIMITY
|
paquet: - |
Stock4 512 |
|
- | - | - | - | - | - | - | - |
|
|
|
Analog Devices Inc. |
IC THRMOCPLE COLD JNC COMP 8MSOP
|
paquet: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock7 792 |
|
Differential | Analog | - | 250µA | 0°C ~ 50°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
|
|
Maxim Integrated |
IC CONV THERMOCOUPLE-DGTL 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock7 744 |
|
Thermocouple (J) | Digital | SPI | 900µA | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
|
|
Texas Instruments |
IC FDC CAPTIVE SENSING 16WQFN
|
paquet: 16-WFQFN Exposed Pad |
Stock5 616 |
|
Capacitive | I2C | - | 2.1mA | -40°C ~ 125°C | Surface Mount | 16-WFQFN Exposed Pad | 16-WQFN (4x4) |
|
|
Maxim Integrated |
IC HALL EFFECT SENSOR 10UMAX
|
paquet: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Stock6 832 |
|
Logic | Analog, Digital | 2-Wire | 1mA | -40°C ~ 125°C | Surface Mount | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-uMAX |
|
|
Microchip Technology |
IC PROXIMITY DETECTOR 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock4 256 |
|
- | - | I2C | - | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
|
|
|
Microchip Technology |
IC HORN DRIVER DUAL 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock7 360 |
|
Logic | Logic | Logic | 100nA | 0°C ~ 50°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
|
|
Analog Devices Inc. |
IC SIGNAL COND STRAIN GAUGE 28DI
|
paquet: 28-DIP (0.600", 15.24mm) |
Stock6 800 |
|
Voltage | Voltage | - | 10mA | -40°C ~ 85°C | Through Hole | 28-DIP (0.600", 15.24mm) | 28-PDIP |
|
|
|
Maxim Integrated |
IC CONV THERMOCOUPLE-DGTL SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock253 860 |
|
Thermocouple (Multiple) | Digital | SPI | 900µA | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
|
|
Maxim Integrated |
IC TIME-TO-DGTL CONV W/AFE TQFP
|
paquet: 32-TQFP Exposed Pad |
Stock6 384 |
|
CMOS | CMOS | Serial | - | -40°C ~ 85°C | Surface Mount | 32-TQFP Exposed Pad | 32-TQFP (5x5) |
|
|
Texas Instruments |
IC 4-20 MA I-TRANSMITTER 14-DIP
|
paquet: 14-DIP (0.300", 7.62mm) |
Stock6 048 |
|
Differential | Voltage | 3-Wire | 20mA | -40°C ~ 85°C | Through Hole | 14-DIP (0.300", 7.62mm) | 14-PDIP |
|
|
Texas Instruments |
IC KNOCK SENSOR INTERFACE 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock109 788 |
|
Serial | Serial | SPI | 20mA | -40°C ~ 125°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
|
|
Maxim Integrated |
IC SENSOR INTERFACE VARI 16-QSOP
|
paquet: 16-SSOP (0.154", 3.90mm Width) |
Stock5 808 |
|
Differential | Logic | Differential | 10mA | -40°C ~ 125°C | Surface Mount | 16-SSOP (0.154", 3.90mm Width) | 16-QSOP |
|
|
Melexis Technologies NV |
AUTOMOTIVE SENSOR INTERFACE
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock2 384 |
|
Differential | - | - | 8mA | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
|
|
Microchip Technology |
THERMOCOUPLE I2C CONVERTER
|
paquet: 20-VQFN Exposed Pad |
Stock19 020 |
|
Thermocouple | I²C | - | 2.5mA | -40°C ~ 125°C (TA) | Surface Mount | 20-VQFN Exposed Pad | 20-MQFN (5x5) |
|
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|
Renesas Electronics Corporation |
AUTOMOTIVE SENSOR SIGNAL CONDITI
|
paquet: - |
Stock15 000 |
|
- | 1-Wire®, I2C | - | - | -40°C ~ 150°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
|
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|
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
|
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|
Renesas Electronics Corporation |
DICE (WAFER SAWN) - WAFFLE PACK
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
|
|
|
Analog Devices Inc. |
MULTI-MODAL OPTICAL AFE, I2C
|
paquet: - |
Stock4 440 |
|
Analog, Digital | I2C, SPI | - | 10 µA | -40°C ~ 85°C (TA) | Surface Mount | 33-UFBGA, WLCSP | 33-WLCSP (3.11x2.14) |
|
|
|
Renesas Electronics Corporation |
DICE (WAFER SAWN) - FRAME
|
paquet: - |
Request a Quote |
|
- | - | - | - | - | - | - | - |
