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Intégré - Système sur puce (SoC)

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Image
Référence
Fabricant
Description
paquet
Stock
Quantité
Core Processor
Flash Size
RAM Size
Peripherals
Connectivity
Speed
Primary Attributes
Operating Temperature
Package / Case
Supplier Device Package
5ASXFB5H4F40C6NES
Altera

IC FPGA 528 I/O 1517FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 700MHz
  • Primary Attributes: FPGA - 462K Logic Elements
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
paquet: 1517-BBGA, FCBGA
Stock3 920
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
700MHz
FPGA - 462K Logic Elements
0°C ~ 85°C (TJ)
1517-BBGA, FCBGA
1517-FBGA (40x40)
5ASXBB3D4F35C5N
Altera

IC FPGA 350 I/O 1152FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: FPGA - 350K Logic Elements
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FBGA (35x35)
paquet: 1152-BBGA, FCBGA
Stock2 704
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
64KB
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz
FPGA - 350K Logic Elements
0°C ~ 85°C (TJ)
1152-BBGA, FCBGA
1152-FBGA (35x35)
5CSEBA6U23C7SN
Altera

IC FPGA 145 I/O 672UBGA

  • Architecture: MCU, FPGA
  • Core Processor: Single ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 800MHz
  • Primary Attributes: FPGA - 110K Logic Elements
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-FBGA
  • Supplier Device Package: 672-UBGA (23x23)
paquet: 672-FBGA
Stock3 264
Single ARM? Cortex?-A9 MPCore? with CoreSight?
-
64KB
DMA, POR, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz
FPGA - 110K Logic Elements
0°C ~ 85°C (TJ)
672-FBGA
672-UBGA (23x23)
XCZU6EG-2FFVB1156I
Xilinx Inc.

IC FPGA 328 I/O 1156FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 469K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock4 160
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
-
256KB
DMA, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.5GHz
Zynq?UltraScale+? FPGA, 469K+ Logic Cells
-40°C ~ 100°C (TJ)
1156-BBGA, FCBGA
1156-FCBGA (35x35)
XCZU5CG-1FBVB900I
Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 1.3GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
paquet: 900-BBGA, FCBGA
Stock5 824
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
-
256KB
DMA, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.3GHz
Zynq?UltraScale+? FPGA, 256K+ Logic Cells
-40°C ~ 100°C (TJ)
900-BBGA, FCBGA
900-FCBGA (31x31)
XCZU3CG-2SFVC784I
Xilinx Inc.

XCZU3CG-2SFVC784I

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 1.3GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
paquet: 784-BBGA, FCBGA
Stock5 568
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
-
256KB
DMA, WDT
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.3GHz
Zynq?UltraScale+? FPGA, 154K+ Logic Cells
-40°C ~ 100°C (TJ)
784-BBGA, FCBGA
784-FCBGA (23x23)
M2S150T-1FCS536
Microsemi Corporation

IC FPGA SOC 150K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 512KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 150K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 536-LFBGA
  • Supplier Device Package: 536-BGA (16x16)
paquet: 536-LFBGA
Stock6 304
ARM? Cortex?-M3
512KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 150K Logic Modules
0°C ~ 85°C (TJ)
536-LFBGA
536-BGA (16x16)
XC7Z020-3CLG484E
Xilinx Inc.

IC SOC CORTEX-A9 ARTIX-7 484BGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 866MHz
  • Primary Attributes: Artix?-7 FPGA, 85K Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 484-LFBGA, CSPBGA
  • Supplier Device Package: 484-CSPBGA (19x19)
paquet: 484-LFBGA, CSPBGA
Stock6 128
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
256KB
DMA
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
866MHz
Artix?-7 FPGA, 85K Logic Cells
0°C ~ 100°C (TJ)
484-LFBGA, CSPBGA
484-CSPBGA (19x19)
XC7Z020-3CLG400E
Xilinx Inc.

IC SOC CORTEX-A9 ARTIX-7 400BGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 866MHz
  • Primary Attributes: Artix?-7 FPGA, 85K Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 400-LFBGA, CSPBGA
  • Supplier Device Package: 400-CSPBGA (17x17)
paquet: 400-LFBGA, CSPBGA
Stock6 704
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
256KB
DMA
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
866MHz
Artix?-7 FPGA, 85K Logic Cells
0°C ~ 100°C (TJ)
400-LFBGA, CSPBGA
400-CSPBGA (17x17)
M2S050-FG484I
Microsemi Corporation

IC FPGA SOC 50K LUTS 484FBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 50K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FPBGA (23x23)
paquet: 484-BGA
Stock2 400
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 50K Logic Modules
-40°C ~ 100°C (TJ)
484-BGA
484-FPBGA (23x23)
M2S050-1FCSG325I
Microsemi Corporation

IC FPGA SOC 50K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 50K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 325-TFBGA
  • Supplier Device Package: 325-BGA (11x11)
paquet: 325-TFBGA
Stock6 896
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 50K Logic Modules
-40°C ~ 100°C (TJ)
325-TFBGA
325-BGA (11x11)
M2S025T-VF400
Microsemi Corporation

IC FPGA SOC 25K LUTS 400VFBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 25K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 400-LFBGA
  • Supplier Device Package: 400-VFBGA (17x17)
paquet: 400-LFBGA
Stock2 624
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 25K Logic Modules
0°C ~ 85°C (TJ)
400-LFBGA
400-VFBGA (17x17)
M2S010TS-1VF256
Microsemi Corporation

IC FPGA SOC 10K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 256KB
  • RAM Size: 64KB
  • Peripherals: DDR, PCIe, SERDES
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 10K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-VFBGA
  • Supplier Device Package: 256-BGA (17x17)
paquet: 256-VFBGA
Stock5 024
ARM? Cortex?-M3
256KB
64KB
DDR, PCIe, SERDES
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 10K Logic Modules
0°C ~ 85°C (TJ)
256-VFBGA
256-BGA (17x17)
M2S005-1FG484I
Microsemi Corporation

IC FPGA SOC 5K LUTS 484FBGA

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 128KB
  • RAM Size: 64KB
  • Peripherals: DDR
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 5K Logic Modules
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BGA
  • Supplier Device Package: 484-FPBGA (23x23)
paquet: 484-BGA
Stock3 376
ARM? Cortex?-M3
128KB
64KB
DDR
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 5K Logic Modules
-40°C ~ 100°C (TJ)
484-BGA
484-FPBGA (23x23)
M2S005S-TQ144
Microsemi Corporation

IC FPGA SOC 5K LUTS

  • Architecture: MCU, FPGA
  • Core Processor: ARM? Cortex?-M3
  • Flash Size: 128KB
  • RAM Size: 64KB
  • Peripherals: DDR
  • Connectivity: CAN, Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 166MHz
  • Primary Attributes: FPGA - 5K Logic Modules
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
paquet: 144-LQFP
Stock6 848
ARM? Cortex?-M3
128KB
64KB
DDR
CAN, Ethernet, I2C, SPI, UART/USART, USB
166MHz
FPGA - 5K Logic Modules
0°C ~ 85°C (TJ)
144-LQFP
144-TQFP (20x20)
XC7Z030-1FBG484C
Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 484FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 667MHz
  • Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA, FCBGA
  • Supplier Device Package: 484-FCBGA (23x23)
paquet: 484-BBGA, FCBGA
Stock6 064
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-
256KB
DMA
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
667MHz
Kintex?-7 FPGA, 125K Logic Cells
0°C ~ 85°C (TJ)
484-BBGA, FCBGA
484-FCBGA (23x23)
10AS057N2F40I2SG
Intel

IC SOC FPGA 588 I/O 1517FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 570K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
paquet: 1517-BBGA, FCBGA
Stock4 672
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
256KB
DMA, POR, WDT
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 570K Logic Elements
-40°C ~ 100°C (TJ)
1517-BBGA, FCBGA
1517-FCBGA (40x40)
5CSXFC6C6U23I7NTS
Intel

672-PIN UBGA

  • Architecture: -
  • Core Processor: -
  • Flash Size: -
  • RAM Size: -
  • Peripherals: -
  • Connectivity: -
  • Speed: -
  • Primary Attributes: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock5 360
-
-
-
-
-
-
-
-
-
-
hot 5CSEBA2U19C8N
Intel

IC FPGA 240 I/O 484UBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz
  • Primary Attributes: FPGA - 25K Logic Elements
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-FBGA
  • Supplier Device Package: 484-UBGA (19x19)
paquet: 484-FBGA
Stock6 336
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
64KB
DMA, POR, WDT
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz
FPGA - 25K Logic Elements
0°C ~ 85°C (TJ)
484-FBGA
484-UBGA (19x19)
5CSEBA2U19I7LN
Intel

484-PIN UBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 925MHz
  • Primary Attributes: FPGA - 25K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-FBGA
  • Supplier Device Package: 484-UBGA (19x19)
paquet: 484-FBGA
Stock4 896
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
64KB
DMA, POR, WDT
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
925MHz
FPGA - 25K Logic Elements
-40°C ~ 100°C (TJ)
484-FBGA
484-UBGA (19x19)
XCVM1402-2MSENSVF1369
AMD

IC VERSALPRIME ACAP FPGA 1369BGA

  • Architecture: MPU, FPGA
  • Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
  • Flash Size: -
  • RAM Size: -
  • Peripherals: DDR, DMA, PCIe
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.4GHz
  • Primary Attributes: Versal™ Prime FPGA, 1.2M Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1369-BFBGA
  • Supplier Device Package: 1369-BGA (35x35)
paquet: -
Request a Quote
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
-
-
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
600MHz, 1.4GHz
Versal™ Prime FPGA, 1.2M Logic Cells
0°C ~ 100°C (TJ)
1369-BFBGA
1369-BGA (35x35)
AGIB027R31A1I2VB
Intel

IC FPGA AGILEX-I 3184FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.7M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 3184-BFBGA Exposed Pad
  • Supplier Device Package: 3184-BGA (56x45)
paquet: -
Request a Quote
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 2.7M Logic Elements
-40°C ~ 100°C (TJ)
3184-BFBGA Exposed Pad
3184-BGA (56x45)
TCI6630K2LSCMSA
Texas Instruments

PROTOTYPE

  • Architecture: DSP, MPU
  • Core Processor: Dual ARM® Cortex®-A15 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 3MB
  • Peripherals: DDR, DMA, PCIe, POR, WDT
  • Connectivity: Ethernet, I2C, PCIe, SPI, UART/USART, USB
  • Speed: 1GHz
  • Primary Attributes: -
  • Operating Temperature: -40°C ~ 100°C (TC)
  • Package / Case: 900-BFBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (25x25)
paquet: -
Request a Quote
Dual ARM® Cortex®-A15 MPCore™ with CoreSight™
-
3MB
DDR, DMA, PCIe, POR, WDT
Ethernet, I2C, PCIe, SPI, UART/USART, USB
1GHz
-
-40°C ~ 100°C (TC)
900-BFBGA, FCBGA
900-FCBGA (25x25)
XCZU43DR-2FSVG1517I
AMD

IC ZUP RFSOC A53 FPGA 1517BGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DDR, DMA, PCIe
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 1.333GHz
  • Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
paquet: -
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
-
256KB
DDR, DMA, PCIe
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
533MHz, 1.333GHz
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
-40°C ~ 100°C (TJ)
1517-BBGA, FCBGA
1517-FCBGA (40x40)
1SX085HN3F43I3VG
Intel

IC FPGA STRATIX 10 1760FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 850K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA (42.5x42.5)
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.5GHz
FPGA - 850K Logic Elements
-40°C ~ 100°C (TJ)
1760-BBGA, FCBGA
1760-FBGA (42.5x42.5)
TCI6638K2KDXAAW2LE
Texas Instruments

PROTOTYPE

  • Architecture: DSP, MPU
  • Core Processor: C66x, Quad ARM® Cortex®-A15 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: -
  • Peripherals: DDR, DMA, PCIe, POR, WDT
  • Connectivity: Ethernet, I2C, SPI, UART/USART, USB
  • Speed: 1.2GHz
  • Primary Attributes: -
  • Operating Temperature: 0°C ~ 100°C (TC)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
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C66x, Quad ARM® Cortex®-A15 MPCore™ with CoreSight™
-
-
DDR, DMA, PCIe, POR, WDT
Ethernet, I2C, SPI, UART/USART, USB
1.2GHz
-
0°C ~ 100°C (TC)
1517-BBGA, FCBGA
1517-FCBGA (40x40)
AGIB027R29A2I1V
Intel

IC

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.7M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2957-BFBGA Exposed Pad
  • Supplier Device Package: 2957-BGA (56x45)
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 2.7M Logic Elements
-40°C ~ 100°C (TJ)
2957-BFBGA Exposed Pad
2957-BGA (56x45)
AGFB019R25A3E3E
Intel

IC FPGA AGILEX-F 2581FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.9M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
-
256KB
DMA, WDT
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
1.4GHz
FPGA - 1.9M Logic Elements
0°C ~ 100°C (TJ)
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