Page 200 - Intégré - Système sur puce (SoC) | Circuits intégrés (CI)

Référence	Fabricant	Description	paquet	Stock	Core Processor	Flash Size	RAM Size	Peripherals	Connectivity	Speed	Primary Attributes	Operating Temperature	Package / Case	Supplier Device Package
10AS066N2F40I1SG	Altera	IC SOC FPGA 588 I/O 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 660K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	paquet: 1517-BBGA, FCBGA	Stock5 040	Dual ARM? Cortex?-A9 MPCore? with CoreSight?	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 660K Logic Elements	-40°C ~ 100°C (TJ)	1517-BBGA, FCBGA	1517-FCBGA (40x40)
XC7Z100-1FF900I	Xilinx Inc.	IC SOC CORTEX-A9 KINTEX7 900BGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Kintex?-7 FPGA, 444K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	paquet: 900-BBGA, FCBGA	Stock2 448	Dual ARM? Cortex?-A9 MPCore? with CoreSight?	-	256KB	DMA	CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	667MHz	Kintex?-7 FPGA, 444K Logic Cells	-40°C ~ 100°C (TJ)	900-BBGA, FCBGA	900-FCBGA (31x31)
10AS066K1F40I1SG	Intel	IC SOC FPGA 696 I/O 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 660K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	paquet: 1517-BBGA, FCBGA	Stock6 272	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 660K Logic Elements	-40°C ~ 100°C (TJ)	1517-BBGA, FCBGA	1517-FBGA (40x40)
10AS057N2F40I1HG	Intel	IC SOC FPGA 588 I/O 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 570K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA (40x40)	paquet: 1517-BBGA, FCBGA	Stock5 952	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 570K Logic Elements	-40°C ~ 100°C (TJ)	1517-BBGA, FCBGA	1517-FBGA (40x40)
10AS032H2F34I2LG	Intel	1152-PIN FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 320K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	paquet: -	Stock7 424	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 320K Logic Elements	-40°C ~ 100°C (TJ)	-	-
10AS027E1F27E1HG	Intel	IC SOC FPGA 240 I/O 672FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 270K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 672-BBGA, FCBGA Supplier Device Package: 672-FBGA (27x27)	paquet: 672-BBGA, FCBGA	Stock2 240	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 270K Logic Elements	0°C ~ 100°C (TJ)	672-BBGA, FCBGA	672-FBGA (27x27)
10AS022E3F29E2SG	Intel	780-PIN FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 220K Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	paquet: -	Stock5 840	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 220K Logic Elements	0°C ~ 100°C (TJ)	-	-
TDA3MDDBABFQ1	Texas Instruments	LOW POWER SOC W/ FULL-FEATURED P Architecture: DSP, MPU Core Processor: ARM® Cortex®-M4, C66x Flash Size: - RAM Size: 512kB Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB Speed: 212.8MHz, 500MHz Primary Attributes: - Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 367-BFBGA, FCBGA Supplier Device Package: 367-FCBGA (15x15)	paquet: -	Request a Quote	ARM® Cortex®-M4, C66x	-	512kB	DMA, POR, PWM, WDT	CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB	212.8MHz, 500MHz	-	-40°C ~ 125°C (TJ)	367-BFBGA, FCBGA	367-FCBGA (15x15)
5ASXBB5D6F40C6G	Intel	IC SOC CORTEX-A9 700MHZ 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 700MHz Primary Attributes: FPGA - 462K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA, FC (40x40)	paquet: -	Request a Quote	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	700MHz	FPGA - 462K Logic Elements	0°C ~ 85°C (TJ)	1517-BBGA, FCBGA	1517-FBGA, FC (40x40)
AGFA022R31C3I3V	Intel	IC FPGA AGILEX-F 3184FBGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.2M Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: - Supplier Device Package: -	paquet: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 2.2M Logic Elements	-40°C ~ 100°C (TJ)	-	-
1SX280LN3F43I2VP	Intel	IC FPGA STRATIX 10 1760FBGA Architecture: MCU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.5GHz Primary Attributes: FPGA - 2800K Logic Elements Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FBGA (42.5x42.5)	paquet: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.5GHz	FPGA - 2800K Logic Elements	-40°C ~ 100°C (TJ)	1760-BBGA, FCBGA	1760-FBGA (42.5x42.5)
XCZU63DR-2FFVE1156I	AMD	XCZU63DR-2FFVE1156I Architecture: - Core Processor: - Flash Size: - RAM Size: - Peripherals: - Connectivity: - Speed: - Primary Attributes: - Operating Temperature: - Package / Case: - Supplier Device Package: -	paquet: -	Request a Quote	-	-	-	-	-	-	-	-	-	-
5ASXFB5H4F40C5G	Intel	IC SOC CORTEX-A9 800MHZ 1517FBGA Architecture: MCU, FPGA Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Flash Size: - RAM Size: 64KB Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 800MHz Primary Attributes: FPGA - 462K Logic Elements Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FBGA, FC (40x40)	paquet: -	Request a Quote	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	800MHz	FPGA - 462K Logic Elements	0°C ~ 85°C (TJ)	1517-BBGA, FCBGA	1517-FBGA, FC (40x40)
AGFB023R24C3E3V	Intel	IC FPGA AGILEX-F 2340BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 2.3M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2340-BFBGA Exposed Pad Supplier Device Package: 2340-BGA (45x42)	paquet: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 2.3M Logic Elements	0°C ~ 100°C (TJ)	2340-BFBGA Exposed Pad	2340-BGA (45x42)
MPFS160TS-1FCVG484I	Microchip Technology	IC SOC RISC-V 484FCBGA Architecture: MPU, FPGA Core Processor: RISC-V Flash Size: 128kB RAM Size: 1.4125MB Peripherals: DMA, PCI, PWM Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG Speed: - Primary Attributes: FPGA - 161K Logic Modules Operating Temperature: -40°C ~ 100°C Package / Case: 484-BFBGA, FCBGA Supplier Device Package: 484-FCBGA (19x19)	paquet: -	Stock9	RISC-V	128kB	1.4125MB	DMA, PCI, PWM	CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG	-	FPGA - 161K Logic Modules	-40°C ~ 100°C	484-BFBGA, FCBGA	484-FCBGA (19x19)
XCVP1102-2LLEVSVA2785	AMD	IC VERSAL PREM ACAP FPGA 2785BGA Architecture: MPU, FPGA Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ Flash Size: - RAM Size: 256KB Peripherals: DDR, DMA, PCIe Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 450MHz, 1.08GHz Primary Attributes: Versal™ Premium FPGA, 1.575M Logic Cells Operating Temperature: 0°C ~ 110°C (TJ) Package / Case: 2785-BFBGA, FCBGA Supplier Device Package: 2785-FCBGA (50x50)	paquet: -	Request a Quote	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	-	256KB	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	450MHz, 1.08GHz	Versal™ Premium FPGA, 1.575M Logic Cells	0°C ~ 110°C (TJ)	2785-BFBGA, FCBGA	2785-FCBGA (50x50)
AGFA019R24C2E1VB	Intel	IC FPGA AGILEX-F 2340BGA Architecture: MPU, FPGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 1.4GHz Primary Attributes: FPGA - 1.9M Logic Elements Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2340-BFBGA Exposed Pad Supplier Device Package: 2340-BGA (45x42)	paquet: -	Request a Quote	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	-	256KB	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	1.4GHz	FPGA - 1.9M Logic Elements	0°C ~ 100°C (TJ)	2340-BFBGA Exposed Pad	2340-BGA (45x42)

10AS066N2F40I1SG

Altera

IC SOC FPGA 588 I/O 1517FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 660K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

paquet: 1517-BBGA, FCBGA

Stock5 040

Dual ARM? Cortex?-A9 MPCore? with CoreSight?

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 660K Logic Elements

-40°C ~ 100°C (TJ)

1517-BBGA, FCBGA

1517-FCBGA (40x40)

XC7Z100-1FF900I

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 900BGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 667MHz
Primary Attributes: Kintex?-7 FPGA, 444K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

paquet: 900-BBGA, FCBGA

Stock2 448

Dual ARM? Cortex?-A9 MPCore? with CoreSight?

-

256KB

DMA

CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

667MHz

Kintex?-7 FPGA, 444K Logic Cells

-40°C ~ 100°C (TJ)

900-BBGA, FCBGA

900-FCBGA (31x31)

10AS066K1F40I1SG

Intel

IC SOC FPGA 696 I/O 1517FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 660K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

paquet: 1517-BBGA, FCBGA

Stock6 272

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 660K Logic Elements

-40°C ~ 100°C (TJ)

1517-BBGA, FCBGA

1517-FBGA (40x40)

10AS057N2F40I1HG

Intel

IC SOC FPGA 588 I/O 1517FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 570K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA (40x40)

paquet: 1517-BBGA, FCBGA

Stock5 952

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 570K Logic Elements

-40°C ~ 100°C (TJ)

1517-BBGA, FCBGA

1517-FBGA (40x40)

10AS032H2F34I2LG

Intel

1152-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 320K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

paquet: -

Stock7 424

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 320K Logic Elements

-40°C ~ 100°C (TJ)

-

10AS027E1F27E1HG

Intel

IC SOC FPGA 240 I/O 672FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 270K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 672-BBGA, FCBGA
Supplier Device Package: 672-FBGA (27x27)

paquet: 672-BBGA, FCBGA

Stock2 240

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 270K Logic Elements

0°C ~ 100°C (TJ)

672-BBGA, FCBGA

672-FBGA (27x27)

10AS022E3F29E2SG

Intel

780-PIN FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 220K Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

paquet: -

Stock5 840

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

256KB

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 220K Logic Elements

0°C ~ 100°C (TJ)

-

TDA3MDDBABFQ1

Texas Instruments

LOW POWER SOC W/ FULL-FEATURED P

Architecture: DSP, MPU
Core Processor: ARM® Cortex®-M4, C66x
Flash Size: -
RAM Size: 512kB
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB
Speed: 212.8MHz, 500MHz
Primary Attributes: -
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 367-BFBGA, FCBGA
Supplier Device Package: 367-FCBGA (15x15)

paquet: -

Request a Quote

ARM® Cortex®-M4, C66x

-

512kB

DMA, POR, PWM, WDT

CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB

212.8MHz, 500MHz

-

-40°C ~ 125°C (TJ)

367-BFBGA, FCBGA

367-FCBGA (15x15)

5ASXBB5D6F40C6G

Intel

IC SOC CORTEX-A9 700MHZ 1517FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 700MHz
Primary Attributes: FPGA - 462K Logic Elements
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA, FC (40x40)

paquet: -

Request a Quote

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

64KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

700MHz

FPGA - 462K Logic Elements

0°C ~ 85°C (TJ)

1517-BBGA, FCBGA

1517-FBGA, FC (40x40)

AGFA022R31C3I3V

Intel

IC FPGA AGILEX-F 3184FBGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.2M Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: -
Supplier Device Package: -

paquet: -

Request a Quote

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

-

256KB

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.4GHz

FPGA - 2.2M Logic Elements

-40°C ~ 100°C (TJ)

-

1SX280LN3F43I2VP

Intel

IC FPGA STRATIX 10 1760FBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.5GHz
Primary Attributes: FPGA - 2800K Logic Elements
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FBGA (42.5x42.5)

paquet: -

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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

-

256KB

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.5GHz

FPGA - 2800K Logic Elements

-40°C ~ 100°C (TJ)

1760-BBGA, FCBGA

1760-FBGA (42.5x42.5)

XCZU63DR-2FFVE1156I

AMD

XCZU63DR-2FFVE1156I

Architecture: -
Core Processor: -
Flash Size: -
RAM Size: -
Peripherals: -
Connectivity: -
Speed: -
Primary Attributes: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

paquet: -

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-

5ASXFB5H4F40C5G

Intel

IC SOC CORTEX-A9 800MHZ 1517FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: -
RAM Size: 64KB
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: FPGA - 462K Logic Elements
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FBGA, FC (40x40)

paquet: -

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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

-

64KB

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

800MHz

FPGA - 462K Logic Elements

0°C ~ 85°C (TJ)

1517-BBGA, FCBGA

1517-FBGA, FC (40x40)

AGFB023R24C3E3V

Intel

IC FPGA AGILEX-F 2340BGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 2.3M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2340-BFBGA Exposed Pad
Supplier Device Package: 2340-BGA (45x42)

paquet: -

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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

-

256KB

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.4GHz

FPGA - 2.3M Logic Elements

0°C ~ 100°C (TJ)

2340-BFBGA Exposed Pad

2340-BGA (45x42)

MPFS160TS-1FCVG484I

Microchip Technology

IC SOC RISC-V 484FCBGA

Architecture: MPU, FPGA
Core Processor: RISC-V
Flash Size: 128kB
RAM Size: 1.4125MB
Peripherals: DMA, PCI, PWM
Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Speed: -
Primary Attributes: FPGA - 161K Logic Modules
Operating Temperature: -40°C ~ 100°C
Package / Case: 484-BFBGA, FCBGA
Supplier Device Package: 484-FCBGA (19x19)

paquet: -

Stock9

RISC-V

128kB

1.4125MB

DMA, PCI, PWM

CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG

-

FPGA - 161K Logic Modules

-40°C ~ 100°C

484-BFBGA, FCBGA

484-FCBGA (19x19)

XCVP1102-2LLEVSVA2785

AMD

IC VERSAL PREM ACAP FPGA 2785BGA

Architecture: MPU, FPGA
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size: -
RAM Size: 256KB
Peripherals: DDR, DMA, PCIe
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 450MHz, 1.08GHz
Primary Attributes: Versal™ Premium FPGA, 1.575M Logic Cells
Operating Temperature: 0°C ~ 110°C (TJ)
Package / Case: 2785-BFBGA, FCBGA
Supplier Device Package: 2785-FCBGA (50x50)

paquet: -

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Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

-

256KB

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

450MHz, 1.08GHz

Versal™ Premium FPGA, 1.575M Logic Cells

0°C ~ 110°C (TJ)

2785-BFBGA, FCBGA

2785-FCBGA (50x50)

AGFA019R24C2E1VB

Intel

IC FPGA AGILEX-F 2340BGA

Architecture: MPU, FPGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 1.4GHz
Primary Attributes: FPGA - 1.9M Logic Elements
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2340-BFBGA Exposed Pad
Supplier Device Package: 2340-BGA (45x42)

paquet: -

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Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

-

256KB

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

1.4GHz

FPGA - 1.9M Logic Elements

0°C ~ 100°C (TJ)

2340-BFBGA Exposed Pad

2340-BGA (45x42)