Page 38 - Embarqués - Modules de FPGA, microcontrôleurs, microprocesseurs | Circuits intégrés (CI)

Référence	Fabricant	Description	paquet	Stock	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
CC-MX-PE47-MQ	Digi International	MODULE CONNECTCORE I.MX280 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Stock3 552	-	-	-	-	-	-	-	-
TE0745-01-45-1C	Trenz Electronic GmbH	SOM SOC Z7 XC7Z045-1FBG676C 1GB Module/Board Type: MCU, FPGA Core Processor: ARM? Cortex?-A9 Co-Processor: Zynq-7000 (Z-7045) Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec UFPS Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock5 920	ARM? Cortex?-A9	Zynq-7000 (Z-7045)	-	32MB	1GB	Samtec UFPS	2.05" x 2.99" (52mm x 76mm)	0°C ~ 70°C
TE0723-02	Trenz Electronic GmbH	SOM ARDUZYNQ 7Z10 USBOTG MICROSD Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7010) Speed: 12MHz Flash Size: 16MB RAM Size: 128MB Connector Type: Arduino Size / Dimension: - Operating Temperature: 0°C ~ 70°C	paquet: -	Stock4 784	ARM Cortex-A9	Zynq-7000 (Z-7010)	12MHz	16MB	128MB	Arduino	-	0°C ~ 70°C
TE0600-02B	Trenz Electronic GmbH	SOM GIGABEE XC6SLX100 2X128MB 2I Module/Board Type: FPGA Core Processor: Spartan-6 LX-100 Co-Processor: - Speed: 125MHz Flash Size: 16MB RAM Size: 256MB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock6 224	Spartan-6 LX-100	-	125MHz	16MB	256MB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
SOMAM1808-10-1602AHCR	Logic	SYSTEM ON MODULE AM1808 Module/Board Type: MPU Core Core Processor: ARM926EJ-S, AM1808 Co-Processor: - Speed: 450MHz Flash Size: 8MB RAM Size: 128MB Connector Type: - Size / Dimension: 1.18" x 1.57" (30mm x 40mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock4 128	ARM926EJ-S, AM1808	-	450MHz	8MB	128MB	-	1.18" x 1.57" (30mm x 40mm)	0°C ~ 70°C
MOD5270BXXE	NXP	MOD NETBURNER MOD5270 10 UNITS Module/Board Type: MCU, Ethernet Core Core Processor: ColdFire 5270 Co-Processor: - Speed: 95MHz Flash Size: 512KB RAM Size: 2.064MB Connector Type: RJ-45, 2x50 Header Size / Dimension: 2.6" x 2" (66.04mm x 50.8mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock3 440	ColdFire 5270	-	95MHz	512KB	2.064MB	RJ-45, 2x50 Header	2.6" x 2" (66.04mm x 50.8mm)	0°C ~ 70°C
CENGPXA270-520-10-504HCR	Logic	CARD ENGINE 32MB FLASH 64MB RAM Module/Board Type: MCU Core Core Processor: PXA270 Co-Processor: - Speed: 520MHz Flash Size: 32MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock5 984	PXA270	-	520MHz	32MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
101-0673	Digi International	MODULE RABBITCORE RCM3610 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 22.1MHz Flash Size: 256KB RAM Size: 128KB Connector Type: IDC Header 2x20 Size / Dimension: 1.23" x 2.11" (31mm x 54mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock3 568	Rabbit 3000	-	22.1MHz	256KB	128KB	IDC Header 2x20	1.23" x 2.11" (31mm x 54mm)	-40°C ~ 85°C
TE0715-04-15-2I	Trenz Electronic GmbH	SOM SOC 7Z015-2CLG485I 1GB DDR3 Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7015) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock3 184	ARM Cortex-A9	Zynq-7000 (Z-7015)	125MHz	32MB	1GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
20-101-0955	Digi International	MODULE RABBITCORE RCM2260 ROHS Module/Board Type: MPU Core Core Processor: Rabbit 2000 Co-Processor: - Speed: 22.1MHz Flash Size: 512KB RAM Size: 512KB Connector Type: 2 IDC Headers 2x13 Size / Dimension: 1.6" x 2.3" (41mm x 58mm) Operating Temperature: -40°C ~ 70°C	paquet: -	Stock3 792	Rabbit 2000	-	22.1MHz	512KB	512KB	2 IDC Headers 2x13	1.6" x 2.3" (41mm x 58mm)	-40°C ~ 70°C
6711-AB-3X3-RC	Critical Link LLC	DSP-XM SOM TMS320C6711 200MHZ Module/Board Type: DSP, FPGA Core Core Processor: TMS320C6711 Co-Processor: Spartan-3, XC3S1000 Speed: 200MHz Flash Size: 16MB RAM Size: 64KB (Internal), 32MB (External) Connector Type: SO-DIMM-144 Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock6 560	TMS320C6711	Spartan-3, XC3S1000	200MHz	16MB	64KB (Internal), 32MB (External)	SO-DIMM-144	2.66" x 1.5" (67.6mm x 38.1mm)	0°C ~ 70°C
CC-9P-T236-Z1	Digi International	MODULE 9P 64MB SDRAM 64MB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Stock6 060	-	-	-	-	-	-	-	-
DC-ME-Y402-S	Digi International	MOD ME 9210 8MB SDRAM 4MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9210 Co-Processor: - Speed: 75MHz Flash Size: 4MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 80°C	paquet: -	Stock3 728	ARM926EJ-S, NS9210	-	75MHz	4MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 80°C
XP3002000-01R	Lantronix, Inc.	XPORT AR EXTENDED TEMP -40 TO 85 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Stock6 768	-	-	-	-	-	-	-	-
TE0712-03-81I36-A	Trenz Electronic GmbH	FPGA MODULE ARTIX7 Module/Board Type: FPGA Core Core Processor: Artix-7 XC7A200T-1FBG484I Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	Artix-7 XC7A200T-1FBG484I	-	-	32MB	1GB	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0715-05-21C33-A	Trenz Electronic GmbH	SOC MODULE WITH XILINX ZYNQ Z-70 Module/Board Type: MPU Core Core Processor: Zynq™ XC7Z012S-1CLG485C Co-Processor: ARM Cortex-A9 Speed: 766MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Request a Quote	Zynq™ XC7Z012S-1CLG485C	ARM Cortex-A9	766MHz	32MB	1GB	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
ME-ZX5-30-1I-D10-R3-2	Enclustra FPGA Solutions	SOM ZYNQ 7Z030 1GB Module/Board Type: FPGA Core Core Processor: ARM® Dual-Core Cortex-A9 Co-Processor: Artix-7, Kintex-7 Speed: 1GHz Flash Size: 512MB RAM Size: 512MB, 1GB Connector Type: 168 Pin Size / Dimension: 2.200" L x 2.130" W (56.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock186	ARM® Dual-Core Cortex-A9	Artix-7, Kintex-7	1GHz	512MB	512MB, 1GB	168 Pin	2.200" L x 2.130" W (56.00mm x 54.00mm)	-40°C ~ 85°C
TE0808-04-6BE21-A	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 4GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	paquet: -	Request a Quote	Zynq UltraScale+ XCZU6EG-1FFVC900E	-	-	128MB	4GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
DC-VA-H264-10B-60-1080-MD00C-A200T	System-On-Chip (SOC) Technologies Inc.	MOD H264 DEC 60FPS 1080 SODIMM Module/Board Type: DSP, FPGA Core Core Processor: - Co-Processor: Xilinx Artix-7 XC7A200T Speed: - Flash Size: 32MB RAM Size: 512MB Connector Type: SO-DIMM Size / Dimension: - Operating Temperature: -	paquet: -	Request a Quote	-	Xilinx Artix-7 XC7A200T	-	32MB	512MB	SO-DIMM	-	-
ME-XU7-15EG-2I-D12E-R3	Enclustra FPGA Solutions	IC MOD ARM 533MHZ/1.333GHZ 2GB Module/Board Type: MPU, FPGA Core Core Processor: ARM® Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU Co-Processor: - Speed: 533MHz, 1.333GHz Flash Size: 16GB RAM Size: 2GB, 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	ARM® Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU	-	533MHz, 1.333GHz	16GB	2GB, 4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
TE0820-05-4BI21PL	Trenz Electronic GmbH	MOD MPSOC 2GB DDR4 Module/Board Type: MPU Core Core Processor: - Co-Processor: - Speed: - Flash Size: 64GB eMMC, 128MB QSPI RAM Size: 2GB Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Request a Quote	-	-	-	64GB eMMC, 128MB QSPI	2GB	-	-	-
TE0820-04-2AE21FA	Trenz Electronic GmbH	MOD MPSOC ZU2CG-1E 2GB DDR4 IND Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	paquet: -	Request a Quote	Zynq UltraScale+ XCZU2CG-1SFVC784E	-	-	128MB	2GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
TE0724-04-41I32-A	Trenz Electronic GmbH	SOC MODULE WITH XILINX ZYNQ XC7Z Module/Board Type: MPU Core Core Processor: Zynq™ XC7Z010-1CLG400I Co-Processor: ARM Cortex-A9 Speed: 667MHz Flash Size: 32MB RAM Size: 1GB Connector Type: 1 x 160 Pin Size / Dimension: 2.362" L x 1.575" W (60.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	Zynq™ XC7Z010-1CLG400I	ARM Cortex-A9	667MHz	32MB	1GB	1 x 160 Pin	2.362" L x 1.575" W (60.00mm x 40.00mm)	-40°C ~ 85°C
ME-XU9-7EG-2E-D11E-L13-R2-1	Enclustra FPGA Solutions	SOM XU9 ZYNQ 7EG REV2.1 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Request a Quote	-	-	-	-	-	-	-	-
TE0813-02-2BE81-A	Trenz Electronic GmbH	MPSOC MODULE WITH AMD ZYNQ ULTRA Module/Board Type: MPU Core Core Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 4 x 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	paquet: -	Request a Quote	Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 4 x 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
CC-WST-DX58-NK	Digi	CC STM32MP133 802.11 BLUETOOTH Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Co-Processor: - Speed: 209MHz, 650MHz Flash Size: 256MB RAM Size: 256MB Connector Type: Pin(s) Size / Dimension: 1.142" L x 1.142" W (29.00mm x 29.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock6	ARM® Cortex®-A7, ARM® Cortex®-M4	-	209MHz, 650MHz	256MB	256MB	Pin(s)	1.142" L x 1.142" W (29.00mm x 29.00mm)	-40°C ~ 85°C
TE0745-02-92I31-F	Trenz Electronic GmbH	MOD SOM DDR3L 1GB Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7045) Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7045)	-	64MB	1GB	Board-to-Board (BTB) Socket - 480	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C
TE0712-02-72C03-M	Trenz Electronic GmbH	IC MODULE ARTIX7 Module/Board Type: FPGA Core Core Processor: - Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	paquet: -	Request a Quote	-	-	200MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C

CC-MX-PE47-MQ

Digi International

MODULE CONNECTCORE I.MX280

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Stock3 552

-

TE0745-01-45-1C

Trenz Electronic GmbH

SOM SOC Z7 XC7Z045-1FBG676C 1GB

Module/Board Type: MCU, FPGA
Core Processor: ARM? Cortex?-A9
Co-Processor: Zynq-7000 (Z-7045)
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec UFPS
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock5 920

ARM? Cortex?-A9

Zynq-7000 (Z-7045)

-

32MB

1GB

Samtec UFPS

2.05" x 2.99" (52mm x 76mm)

0°C ~ 70°C

TE0723-02

Trenz Electronic GmbH

SOM ARDUZYNQ 7Z10 USBOTG MICROSD

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7010)
Speed: 12MHz
Flash Size: 16MB
RAM Size: 128MB
Connector Type: Arduino
Size / Dimension: -
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock4 784

ARM Cortex-A9

Zynq-7000 (Z-7010)

12MHz

16MB

128MB

Arduino

-

0°C ~ 70°C

TE0600-02B

Trenz Electronic GmbH

SOM GIGABEE XC6SLX100 2X128MB 2I

Module/Board Type: FPGA
Core Processor: Spartan-6 LX-100
Co-Processor: -
Speed: 125MHz
Flash Size: 16MB
RAM Size: 256MB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock6 224

Spartan-6 LX-100

-

125MHz

16MB

256MB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

0°C ~ 70°C

SOMAM1808-10-1602AHCR

Logic

SYSTEM ON MODULE AM1808

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, AM1808
Co-Processor: -
Speed: 450MHz
Flash Size: 8MB
RAM Size: 128MB
Connector Type: -
Size / Dimension: 1.18" x 1.57" (30mm x 40mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock4 128

ARM926EJ-S, AM1808

-

450MHz

8MB

128MB

-

1.18" x 1.57" (30mm x 40mm)

0°C ~ 70°C

MOD5270BXXE

NXP

MOD NETBURNER MOD5270 10 UNITS

Module/Board Type: MCU, Ethernet Core
Core Processor: ColdFire 5270
Co-Processor: -
Speed: 95MHz
Flash Size: 512KB
RAM Size: 2.064MB
Connector Type: RJ-45, 2x50 Header
Size / Dimension: 2.6" x 2" (66.04mm x 50.8mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock3 440

ColdFire 5270

-

95MHz

512KB

2.064MB

RJ-45, 2x50 Header

2.6" x 2" (66.04mm x 50.8mm)

0°C ~ 70°C

CENGPXA270-520-10-504HCR

Logic

CARD ENGINE 32MB FLASH 64MB RAM

Module/Board Type: MCU Core
Core Processor: PXA270
Co-Processor: -
Speed: 520MHz
Flash Size: 32MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock5 984

PXA270

-

520MHz

32MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

101-0673

Digi International

MODULE RABBITCORE RCM3610

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 256KB
RAM Size: 128KB
Connector Type: IDC Header 2x20
Size / Dimension: 1.23" x 2.11" (31mm x 54mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock3 568

Rabbit 3000

-

22.1MHz

256KB

128KB

IDC Header 2x20

1.23" x 2.11" (31mm x 54mm)

-40°C ~ 85°C

TE0715-04-15-2I

Trenz Electronic GmbH

SOM SOC 7Z015-2CLG485I 1GB DDR3

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7015)
Speed: 125MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock3 184

ARM Cortex-A9

Zynq-7000 (Z-7015)

125MHz

32MB

1GB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

20-101-0955

Digi International

MODULE RABBITCORE RCM2260 ROHS

Module/Board Type: MPU Core
Core Processor: Rabbit 2000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 512KB
RAM Size: 512KB
Connector Type: 2 IDC Headers 2x13
Size / Dimension: 1.6" x 2.3" (41mm x 58mm)
Operating Temperature: -40°C ~ 70°C

paquet: -

Stock3 792

Rabbit 2000

-

22.1MHz

512KB

2 IDC Headers 2x13

1.6" x 2.3" (41mm x 58mm)

-40°C ~ 70°C

6711-AB-3X3-RC

Critical Link LLC

DSP-XM SOM TMS320C6711 200MHZ

Module/Board Type: DSP, FPGA Core
Core Processor: TMS320C6711
Co-Processor: Spartan-3, XC3S1000
Speed: 200MHz
Flash Size: 16MB
RAM Size: 64KB (Internal), 32MB (External)
Connector Type: SO-DIMM-144
Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock6 560

TMS320C6711

Spartan-3, XC3S1000

200MHz

16MB

64KB (Internal), 32MB (External)

SO-DIMM-144

2.66" x 1.5" (67.6mm x 38.1mm)

0°C ~ 70°C

CC-9P-T236-Z1

Digi International

MODULE 9P 64MB SDRAM 64MB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Stock6 060

-

DC-ME-Y402-S

Digi International

MOD ME 9210 8MB SDRAM 4MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9210
Co-Processor: -
Speed: 75MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 80°C

paquet: -

Stock3 728

ARM926EJ-S, NS9210

-

75MHz

4MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 80°C

XP3002000-01R

Lantronix, Inc.

XPORT AR EXTENDED TEMP -40 TO 85

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Stock6 768

-

TE0712-03-81I36-A

Trenz Electronic GmbH

FPGA MODULE ARTIX7

Module/Board Type: FPGA Core
Core Processor: Artix-7 XC7A200T-1FBG484I
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Request a Quote

Artix-7 XC7A200T-1FBG484I

-

32MB

1GB

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0715-05-21C33-A

Trenz Electronic GmbH

SOC MODULE WITH XILINX ZYNQ Z-70

Module/Board Type: MPU Core
Core Processor: Zynq™ XC7Z012S-1CLG485C
Co-Processor: ARM Cortex-A9
Speed: 766MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Request a Quote

Zynq™ XC7Z012S-1CLG485C

ARM Cortex-A9

766MHz

32MB

1GB

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

ME-ZX5-30-1I-D10-R3-2

Enclustra FPGA Solutions

SOM ZYNQ 7Z030 1GB

Module/Board Type: FPGA Core
Core Processor: ARM® Dual-Core Cortex-A9
Co-Processor: Artix-7, Kintex-7
Speed: 1GHz
Flash Size: 512MB
RAM Size: 512MB, 1GB
Connector Type: 168 Pin
Size / Dimension: 2.200" L x 2.130" W (56.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock186

ARM® Dual-Core Cortex-A9

Artix-7, Kintex-7

1GHz

512MB

512MB, 1GB

168 Pin

2.200" L x 2.130" W (56.00mm x 54.00mm)

-40°C ~ 85°C

TE0808-04-6BE21-A

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 4GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU6EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

paquet: -

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Zynq UltraScale+ XCZU6EG-1FFVC900E

-

128MB

4GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

0°C ~ 85°C

DC-VA-H264-10B-60-1080-MD00C-A200T

System-On-Chip (SOC) Technologies Inc.

MOD H264 DEC 60FPS 1080 SODIMM

Module/Board Type: DSP, FPGA Core
Core Processor: -
Co-Processor: Xilinx Artix-7 XC7A200T
Speed: -
Flash Size: 32MB
RAM Size: 512MB
Connector Type: SO-DIMM
Size / Dimension: -
Operating Temperature: -

paquet: -

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-

Xilinx Artix-7 XC7A200T

-

32MB

512MB

SO-DIMM

-

ME-XU7-15EG-2I-D12E-R3

Enclustra FPGA Solutions

IC MOD ARM 533MHZ/1.333GHZ 2GB

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU
Co-Processor: -
Speed: 533MHz, 1.333GHz
Flash Size: 16GB
RAM Size: 2GB, 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

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ARM® Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU

-

533MHz, 1.333GHz

16GB

2GB, 4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

TE0820-05-4BI21PL

Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

Module/Board Type: MPU Core
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: 64GB eMMC, 128MB QSPI
RAM Size: 2GB
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

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-

64GB eMMC, 128MB QSPI

2GB

-

TE0820-04-2AE21FA

Trenz Electronic GmbH

MOD MPSOC ZU2CG-1E 2GB DDR4 IND

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2CG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

paquet: -

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Zynq UltraScale+ XCZU2CG-1SFVC784E

-

128MB

2GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

TE0724-04-41I32-A

Trenz Electronic GmbH

SOC MODULE WITH XILINX ZYNQ XC7Z

Module/Board Type: MPU Core
Core Processor: Zynq™ XC7Z010-1CLG400I
Co-Processor: ARM Cortex-A9
Speed: 667MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: 1 x 160 Pin
Size / Dimension: 2.362" L x 1.575" W (60.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

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Zynq™ XC7Z010-1CLG400I

ARM Cortex-A9

667MHz

32MB

1GB

1 x 160 Pin

2.362" L x 1.575" W (60.00mm x 40.00mm)

-40°C ~ 85°C

ME-XU9-7EG-2E-D11E-L13-R2-1

Enclustra FPGA Solutions

SOM XU9 ZYNQ 7EG REV2.1

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

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-

TE0813-02-2BE81-A

Trenz Electronic GmbH

MPSOC MODULE WITH AMD ZYNQ ULTRA

Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

paquet: -

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Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E

-

128MB

4GB

Board-to-Board (BTB) Socket - 4 x 240

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

CC-WST-DX58-NK

Digi

CC STM32MP133 802.11 BLUETOOTH

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Co-Processor: -
Speed: 209MHz, 650MHz
Flash Size: 256MB
RAM Size: 256MB
Connector Type: Pin(s)
Size / Dimension: 1.142" L x 1.142" W (29.00mm x 29.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock6

ARM® Cortex®-A7, ARM® Cortex®-M4

-

209MHz, 650MHz

256MB

Pin(s)

1.142" L x 1.142" W (29.00mm x 29.00mm)

-40°C ~ 85°C

TE0745-02-92I31-F

Trenz Electronic GmbH

MOD SOM DDR3L 1GB

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7045)
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket - 480
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

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ARM Cortex-A9

Zynq-7000 (Z-7045)

-

64MB

1GB

Board-to-Board (BTB) Socket - 480

2.050" L x 2.990" W (52.00mm x 76.00mm)

-40°C ~ 85°C

TE0712-02-72C03-M

Trenz Electronic GmbH

IC MODULE ARTIX7

Module/Board Type: FPGA Core
Core Processor: -
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

paquet: -

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-

200MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C