Page 37 - Embarqués - Modules de FPGA, microcontrôleurs, microprocesseurs | Circuits intégrés (CI)

Référence	Fabricant	Description	paquet	Stock	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
M5485HFEE-E	Logic	MODULE FIRE ENGINE Module/Board Type: MPU Core Core Processor: ColdFire V4e, MCF5485 Co-Processor: - Speed: 200MHz Flash Size: 16MB (NOR), 2MB (Boot) RAM Size: 64MB Connector Type: - Size / Dimension: 3.7" x 4.5" (95mm x 114mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock6 736	ColdFire V4e, MCF5485	-	200MHz	16MB (NOR), 2MB (Boot)	64MB	-	3.7" x 4.5" (95mm x 114mm)	-40°C ~ 85°C
CC-9C-V212-Z1-B	Digi International	MODULE 9C 16MB SDRAM 4MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9360 Co-Processor: - Speed: 155MHz Flash Size: 4MB RAM Size: 16MB Connector Type: SO-DIMM-144 Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock3 168	ARM926EJ-S, NS9360	-	155MHz	4MB	16MB	SO-DIMM-144	3.59" x 2.06" (91.2mm x 52.2mm)	-40°C ~ 85°C
DC-ME-Y413-S-B	Digi International	ME 9210 16MB SDRAM 8MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9210 Co-Processor: - Speed: 75MHz Flash Size: 16MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 80°C	paquet: -	Stock5 216	ARM926EJ-S, NS9210	-	75MHz	16MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 80°C
101-0961	Digi International	MODULE RABBITCORE RCM3720 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 22.1MHz Flash Size: 512KB (Internal), 1MB (External) RAM Size: 256KB Connector Type: IDC Header 2x20 Size / Dimension: 1.2" x 2.95" (30mm x 75mm) Operating Temperature: -40°C ~ 70°C	paquet: -	Stock5 408	Rabbit 3000	-	22.1MHz	512KB (Internal), 1MB (External)	256KB	IDC Header 2x20	1.2" x 2.95" (30mm x 75mm)	-40°C ~ 70°C
CENGSH7760-10-504HCR	Logic	CARD ENGINE 32MB FLASH 64MB RAM Module/Board Type: MPU Core Core Processor: SH7760 Co-Processor: - Speed: 198MHz Flash Size: 32MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock5 328	SH7760	-	198MHz	32MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
CENGLH7A404-11-403EC	Logic	CARD ENGINE 16MB FLASH 32MB RAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A404 Co-Processor: - Speed: 200MHz Flash Size: 16MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock2 496	ARM922T, LH7A404	-	200MHz	16MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
DC-SP-01-C-W-25	Digi International	ADAPTER SP CUSTOMIZABLE 25PK Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 16MB Connector Type: RJ45 Size / Dimension: 3.88" x 1.68" (98.5mm x 42.7mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock2 688	ARM7TDMI, NS7520	-	55MHz	4MB	16MB	RJ45	3.88" x 1.68" (98.5mm x 42.7mm)	-40°C ~ 85°C
CC-MX-PF58-ZM-B	Digi International	MOD WI-IMX287 256M FLASH 25/PK Module/Board Type: MPU Core Core Processor: ARM926EJ-S i.mx287 Co-Processor: - Speed: 454MHz Flash Size: 256MB RAM Size: 256MB Connector Type: Edge Connector - 52 Size / Dimension: 2" x 1.38" (51mm x 35mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock3 008	ARM926EJ-S i.mx287	-	454MHz	256MB	256MB	Edge Connector - 52	2" x 1.38" (51mm x 35mm)	-40°C ~ 85°C
6711-KA-1X1-RI	Critical Link LLC	MITYDSP SOM TMS320C6711 167MHZ Module/Board Type: DSP, FPGA Core Core Processor: TMS320C6711 Co-Processor: Spartan-3, XC3S400 Speed: 167MHz Flash Size: 2MB RAM Size: 64KB (Internal), 8MB (External) Connector Type: SO-DIMM-144 Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock5 840	TMS320C6711	Spartan-3, XC3S400	167MHz	2MB	64KB (Internal), 8MB (External)	SO-DIMM-144	2.66" x 1.5" (67.6mm x 38.1mm)	-40°C ~ 85°C
CC-MX-MB6B-ZK	Digi International	MODULE I.MX51 600MHZ 3GB FLASH Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Stock7 632	-	-	-	-	-	-	-	-
TE0728-04-1Q	Trenz Electronic GmbH	XILINX ZYNQ XA7Z020-1CLG484Q AUT Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 16MB RAM Size: 512MB Connector Type: Samtec SEM Size / Dimension: 2.36" x 2.36" (60mm x 60mm) Operating Temperature: -	paquet: -	Stock6 640	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	16MB	512MB	Samtec SEM	2.36" x 2.36" (60mm x 60mm)	-
CC-9P-V502-C-B	Digi International	MOD 9P 8MB SDRAM 4MB FLASH 25PAK Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9215 Co-Processor: - Speed: 150MHz Flash Size: 4MB RAM Size: 8MB Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 1.97" x 1.97" (50mm x 50mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock7 856	ARM926EJ-S, NS9215	-	150MHz	4MB	8MB	Board-to-Board (BTB) Socket - 160	1.97" x 1.97" (50mm x 50mm)	-40°C ~ 85°C
20-101-1154	Digi International	MODULE RCM4120 RABBITCORE Module/Board Type: MPU Core Core Processor: Rabbit 4000 Co-Processor: - Speed: 58.98MHz Flash Size: 512KB RAM Size: 1MB Connector Type: IDC Header 2x25, 2x5 Size / Dimension: 1.41" x 1.88" (36mm x 48mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock7 568	Rabbit 4000	-	58.98MHz	512KB	1MB	IDC Header 2x25, 2x5	1.41" x 1.88" (36mm x 48mm)	-40°C ~ 85°C
DLP-HS-FPGA-A	DLP Design Inc.	MODULE USB-TO-FPGA SPARTAN3 Module/Board Type: FPGA, USB Core Core Processor: Spartan-3A, XC3S200A Co-Processor: FT2232H Speed: 66MHz Flash Size: - RAM Size: 32MB Connector Type: USB - B, Pin Header Size / Dimension: 3" x 1.2" (76.2mm x 30.5mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Stock6 816	Spartan-3A, XC3S200A	FT2232H	66MHz	-	32MB	USB - B, Pin Header	3" x 1.2" (76.2mm x 30.5mm)	0°C ~ 70°C
SOMDM3730-11-1783JFIR	Logic	DM3730 SOM-LV TYPE III 800MHZ 25 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Stock4 800	-	-	-	-	-	-	-	-
OSD3358-512M-IND	Octavo Systems LLC	SIP SOM AM3358 512MB DDR3 Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A8, AM3358 Co-Processor: NEON™ SIMD Speed: 1GHz Flash Size: - RAM Size: 512MB Connector Type: 400-BGA Size / Dimension: 1.06" x 1.06" (27.0mm x 27.0mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock7 080	ARM® Cortex®-A8, AM3358	NEON™ SIMD	1GHz	-	512MB	400-BGA	1.06" x 1.06" (27.0mm x 27.0mm)	-40°C ~ 85°C
OSD32MP157C-512M-IAA	Octavo Systems LLC	SIP ARM CORTEX STM32MP157C Module/Board Type: MPU Core Core Processor: Arm® Dual Cortex®-A7, Arm® Cortex®-M4 Co-Processor: NEON™ SIMD Speed: 650MHz, 209MHz Flash Size: - RAM Size: - Connector Type: 302-BGA Size / Dimension: 0.709" L x 0.709" W (18.00mm x 18.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock1 929	Arm® Dual Cortex®-A7, Arm® Cortex®-M4	NEON™ SIMD	650MHz, 209MHz	-	-	302-BGA	0.709" L x 0.709" W (18.00mm x 18.00mm)	-40°C ~ 85°C
MYC-CZU3EG-V2-4E4D-1200-C	MYIR Tech Limited	System-On-Module, ZU3EG Module/Board Type: MPU, FPGA Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E / XCZU4EV-1SFVC784I/ XCZU5EV-2SFVC784I Speed: 2.4GHz Flash Size: 4GB eMMC, 128MB QSPI RAM Size: 4GB Connector Type: Pin(s) Size / Dimension: 2.362" L x 2.047" W (60.00mm x 52.00mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E / XCZU4EV-1SFVC784I/ XCZU5EV-2SFVC784I	2.4GHz	4GB eMMC, 128MB QSPI	4GB	Pin(s)	2.362" L x 2.047" W (60.00mm x 52.00mm)	0°C ~ 70°C
TE0726-04-41C94-A	Trenz Electronic GmbH	IC MODULE ZYNQBERRY Module/Board Type: FPGA Core Processor: Zynq™ XC7Z010-1CLG225C Co-Processor: - Speed: - Flash Size: 16MB RAM Size: 512MB Connector Type: RJ45 Size / Dimension: 3.661" L x 2.500" W (93.00mm x 63.50mm) Operating Temperature: 0°C ~ 70°C	paquet: -	Request a Quote	Zynq™ XC7Z010-1CLG225C	-	-	16MB	512MB	RJ45	3.661" L x 2.500" W (93.00mm x 63.50mm)	0°C ~ 70°C
20-101-0030	Digi	BL1600 CONTROLLER Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Request a Quote	-	-	-	-	-	-	-	-
MA-ZX3-20-2I-D10-R7	Enclustra FPGA Solutions	SOM ZYNQ 7Z020 1GB Module/Board Type: MPU Core Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: 50MHz Flash Size: 1GB (NAND) RAM Size: 1.024GB Connector Type: 200 Pin Size / Dimension: 2.660" L x 1.180" W (67.60mm x 30.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7020)	50MHz	1GB (NAND)	1.024GB	200 Pin	2.660" L x 1.180" W (67.60mm x 30.00mm)	-40°C ~ 85°C
TE0600-03IC4	Trenz Electronic GmbH	IC MODULE GIGABEE Module/Board Type: FPGA Core Core Processor: Spartan-6 LX-45 Co-Processor: - Speed: 125MHz Flash Size: 16MB RAM Size: 256MB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	Spartan-6 LX-45	-	125MHz	16MB	256MB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
ME-XU1-9EG-3E-D12E-R5-0	Enclustra FPGA Solutions	SOM ZYNQ XU1 US+ ZU9EG Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU9EG-3FFVC900E Speed: 600MHz, 1.5GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: 0°C ~ 85°C	paquet: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU9EG-3FFVC900E	600MHz, 1.5GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	0°C ~ 85°C
TE0630-02IBFC1	Trenz Electronic GmbH	FPGA MODULE SPARTAN-6 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	paquet: -	Request a Quote	-	-	-	-	-	-	-	-
MA-ZX2-20-2I-D9-R2	Enclustra FPGA Solutions	SOM ZYNQ 7Z020 512MB Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 64MB RAM Size: 512MB Connector Type: 200 Pin Size / Dimension: 2.660" L x 1.180" W (67.60mm x 30.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Stock96	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	64MB	512MB	200 Pin	2.660" L x 1.180" W (67.60mm x 30.00mm)	-40°C ~ 85°C
TE0818-01-9GI21-AK	Trenz Electronic GmbH	ULTRASOM+ MPSOC-MODUL WITH ZYNQ Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU9EG-2FFVC900I Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	Zynq UltraScale+ XCZU9EG-2FFVC900I	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	-40°C ~ 85°C
TE0741-05-B2I-1-A	Trenz Electronic GmbH	MODULE FPGA KINTEX Module/Board Type: FPGA Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FBG676I Co-Processor: - Speed: - Flash Size: 32MB RAM Size: - Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	Xilinx Kintex-7 FPGA XC7K160T-2FBG676I	-	-	32MB	-	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0745-02-92I31-AK	Trenz Electronic GmbH	MOD SOM DDR3L 1GB Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7045) Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	paquet: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7045)	-	64MB	1GB	Board-to-Board (BTB) Socket - 480	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C

M5485HFEE-E

Logic

MODULE FIRE ENGINE

Module/Board Type: MPU Core
Core Processor: ColdFire V4e, MCF5485
Co-Processor: -
Speed: 200MHz
Flash Size: 16MB (NOR), 2MB (Boot)
RAM Size: 64MB
Connector Type: -
Size / Dimension: 3.7" x 4.5" (95mm x 114mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock6 736

ColdFire V4e, MCF5485

-

200MHz

16MB (NOR), 2MB (Boot)

64MB

-

3.7" x 4.5" (95mm x 114mm)

-40°C ~ 85°C

CC-9C-V212-Z1-B

Digi International

MODULE 9C 16MB SDRAM 4MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9360
Co-Processor: -
Speed: 155MHz
Flash Size: 4MB
RAM Size: 16MB
Connector Type: SO-DIMM-144
Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock3 168

ARM926EJ-S, NS9360

-

155MHz

4MB

16MB

SO-DIMM-144

3.59" x 2.06" (91.2mm x 52.2mm)

-40°C ~ 85°C

DC-ME-Y413-S-B

Digi International

ME 9210 16MB SDRAM 8MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9210
Co-Processor: -
Speed: 75MHz
Flash Size: 16MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 80°C

paquet: -

Stock5 216

ARM926EJ-S, NS9210

-

75MHz

16MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 80°C

101-0961

Digi International

MODULE RABBITCORE RCM3720

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 512KB (Internal), 1MB (External)
RAM Size: 256KB
Connector Type: IDC Header 2x20
Size / Dimension: 1.2" x 2.95" (30mm x 75mm)
Operating Temperature: -40°C ~ 70°C

paquet: -

Stock5 408

Rabbit 3000

-

22.1MHz

512KB (Internal), 1MB (External)

256KB

IDC Header 2x20

1.2" x 2.95" (30mm x 75mm)

-40°C ~ 70°C

CENGSH7760-10-504HCR

Logic

CARD ENGINE 32MB FLASH 64MB RAM

Module/Board Type: MPU Core
Core Processor: SH7760
Co-Processor: -
Speed: 198MHz
Flash Size: 32MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock5 328

SH7760

-

198MHz

32MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

CENGLH7A404-11-403EC

Logic

CARD ENGINE 16MB FLASH 32MB RAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A404
Co-Processor: -
Speed: 200MHz
Flash Size: 16MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock2 496

ARM922T, LH7A404

-

200MHz

16MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

DC-SP-01-C-W-25

Digi International

ADAPTER SP CUSTOMIZABLE 25PK

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 16MB
Connector Type: RJ45
Size / Dimension: 3.88" x 1.68" (98.5mm x 42.7mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock2 688

ARM7TDMI, NS7520

-

55MHz

4MB

16MB

RJ45

3.88" x 1.68" (98.5mm x 42.7mm)

-40°C ~ 85°C

CC-MX-PF58-ZM-B

Digi International

MOD WI-IMX287 256M FLASH 25/PK

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S i.mx287
Co-Processor: -
Speed: 454MHz
Flash Size: 256MB
RAM Size: 256MB
Connector Type: Edge Connector - 52
Size / Dimension: 2" x 1.38" (51mm x 35mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock3 008

ARM926EJ-S i.mx287

-

454MHz

256MB

Edge Connector - 52

2" x 1.38" (51mm x 35mm)

-40°C ~ 85°C

6711-KA-1X1-RI

Critical Link LLC

MITYDSP SOM TMS320C6711 167MHZ

Module/Board Type: DSP, FPGA Core
Core Processor: TMS320C6711
Co-Processor: Spartan-3, XC3S400
Speed: 167MHz
Flash Size: 2MB
RAM Size: 64KB (Internal), 8MB (External)
Connector Type: SO-DIMM-144
Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock5 840

TMS320C6711

Spartan-3, XC3S400

167MHz

2MB

64KB (Internal), 8MB (External)

SO-DIMM-144

2.66" x 1.5" (67.6mm x 38.1mm)

-40°C ~ 85°C

CC-MX-MB6B-ZK

Digi International

MODULE I.MX51 600MHZ 3GB FLASH

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Stock7 632

-

TE0728-04-1Q

Trenz Electronic GmbH

XILINX ZYNQ XA7Z020-1CLG484Q AUT

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 16MB
RAM Size: 512MB
Connector Type: Samtec SEM
Size / Dimension: 2.36" x 2.36" (60mm x 60mm)
Operating Temperature: -

paquet: -

Stock6 640

ARM Cortex-A9

Zynq-7000 (Z-7020)

-

16MB

512MB

Samtec SEM

2.36" x 2.36" (60mm x 60mm)

-

CC-9P-V502-C-B

Digi International

MOD 9P 8MB SDRAM 4MB FLASH 25PAK

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9215
Co-Processor: -
Speed: 150MHz
Flash Size: 4MB
RAM Size: 8MB
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 1.97" x 1.97" (50mm x 50mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock7 856

ARM926EJ-S, NS9215

-

150MHz

4MB

8MB

Board-to-Board (BTB) Socket - 160

1.97" x 1.97" (50mm x 50mm)

-40°C ~ 85°C

20-101-1154

Digi International

MODULE RCM4120 RABBITCORE

Module/Board Type: MPU Core
Core Processor: Rabbit 4000
Co-Processor: -
Speed: 58.98MHz
Flash Size: 512KB
RAM Size: 1MB
Connector Type: IDC Header 2x25, 2x5
Size / Dimension: 1.41" x 1.88" (36mm x 48mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock7 568

Rabbit 4000

-

58.98MHz

512KB

1MB

IDC Header 2x25, 2x5

1.41" x 1.88" (36mm x 48mm)

-40°C ~ 85°C

DLP-HS-FPGA-A

DLP Design Inc.

MODULE USB-TO-FPGA SPARTAN3

Module/Board Type: FPGA, USB Core
Core Processor: Spartan-3A, XC3S200A
Co-Processor: FT2232H
Speed: 66MHz
Flash Size: -
RAM Size: 32MB
Connector Type: USB - B, Pin Header
Size / Dimension: 3" x 1.2" (76.2mm x 30.5mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

Stock6 816

Spartan-3A, XC3S200A

FT2232H

66MHz

-

32MB

USB - B, Pin Header

3" x 1.2" (76.2mm x 30.5mm)

0°C ~ 70°C

SOMDM3730-11-1783JFIR

Logic

DM3730 SOM-LV TYPE III 800MHZ 25

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Stock4 800

-

OSD3358-512M-IND

Octavo Systems LLC

SIP SOM AM3358 512MB DDR3

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A8, AM3358
Co-Processor: NEON™ SIMD
Speed: 1GHz
Flash Size: -
RAM Size: 512MB
Connector Type: 400-BGA
Size / Dimension: 1.06" x 1.06" (27.0mm x 27.0mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock7 080

ARM® Cortex®-A8, AM3358

NEON™ SIMD

1GHz

-

512MB

400-BGA

1.06" x 1.06" (27.0mm x 27.0mm)

-40°C ~ 85°C

OSD32MP157C-512M-IAA

Octavo Systems LLC

SIP ARM CORTEX STM32MP157C

Module/Board Type: MPU Core
Core Processor: Arm® Dual Cortex®-A7, Arm® Cortex®-M4
Co-Processor: NEON™ SIMD
Speed: 650MHz, 209MHz
Flash Size: -
RAM Size: -
Connector Type: 302-BGA
Size / Dimension: 0.709" L x 0.709" W (18.00mm x 18.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock1 929

Arm® Dual Cortex®-A7, Arm® Cortex®-M4

NEON™ SIMD

650MHz, 209MHz

-

302-BGA

0.709" L x 0.709" W (18.00mm x 18.00mm)

-40°C ~ 85°C

MYC-CZU3EG-V2-4E4D-1200-C

MYIR Tech Limited

System-On-Module, ZU3EG

Module/Board Type: MPU, FPGA
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E / XCZU4EV-1SFVC784I/ XCZU5EV-2SFVC784I
Speed: 2.4GHz
Flash Size: 4GB eMMC, 128MB QSPI
RAM Size: 4GB
Connector Type: Pin(s)
Size / Dimension: 2.362" L x 2.047" W (60.00mm x 52.00mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E / XCZU4EV-1SFVC784I/ XCZU5EV-2SFVC784I

2.4GHz

4GB eMMC, 128MB QSPI

4GB

Pin(s)

2.362" L x 2.047" W (60.00mm x 52.00mm)

0°C ~ 70°C

TE0726-04-41C94-A

Trenz Electronic GmbH

IC MODULE ZYNQBERRY

Module/Board Type: FPGA
Core Processor: Zynq™ XC7Z010-1CLG225C
Co-Processor: -
Speed: -
Flash Size: 16MB
RAM Size: 512MB
Connector Type: RJ45
Size / Dimension: 3.661" L x 2.500" W (93.00mm x 63.50mm)
Operating Temperature: 0°C ~ 70°C

paquet: -

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Zynq™ XC7Z010-1CLG225C

-

16MB

512MB

RJ45

3.661" L x 2.500" W (93.00mm x 63.50mm)

0°C ~ 70°C

20-101-0030

Digi

BL1600 CONTROLLER

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Request a Quote

-

MA-ZX3-20-2I-D10-R7

Enclustra FPGA Solutions

SOM ZYNQ 7Z020 1GB

Module/Board Type: MPU Core
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: 50MHz
Flash Size: 1GB (NAND)
RAM Size: 1.024GB
Connector Type: 200 Pin
Size / Dimension: 2.660" L x 1.180" W (67.60mm x 30.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

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ARM Cortex-A9

Zynq-7000 (Z-7020)

50MHz

1GB (NAND)

1.024GB

200 Pin

2.660" L x 1.180" W (67.60mm x 30.00mm)

-40°C ~ 85°C

TE0600-03IC4

Trenz Electronic GmbH

IC MODULE GIGABEE

Module/Board Type: FPGA Core
Core Processor: Spartan-6 LX-45
Co-Processor: -
Speed: 125MHz
Flash Size: 16MB
RAM Size: 256MB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

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Spartan-6 LX-45

-

125MHz

16MB

256MB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

ME-XU1-9EG-3E-D12E-R5-0

Enclustra FPGA Solutions

SOM ZYNQ XU1 US+ ZU9EG

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU9EG-3FFVC900E
Speed: 600MHz, 1.5GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: 0°C ~ 85°C

paquet: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU9EG-3FFVC900E

600MHz, 1.5GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

0°C ~ 85°C

TE0630-02IBFC1

Trenz Electronic GmbH

FPGA MODULE SPARTAN-6

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

paquet: -

Request a Quote

-

MA-ZX2-20-2I-D9-R2

Enclustra FPGA Solutions

SOM ZYNQ 7Z020 512MB

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 64MB
RAM Size: 512MB
Connector Type: 200 Pin
Size / Dimension: 2.660" L x 1.180" W (67.60mm x 30.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

Stock96

ARM Cortex-A9

Zynq-7000 (Z-7020)

-

64MB

512MB

200 Pin

2.660" L x 1.180" W (67.60mm x 30.00mm)

-40°C ~ 85°C

TE0818-01-9GI21-AK

Trenz Electronic GmbH

ULTRASOM+ MPSOC-MODUL WITH ZYNQ

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU9EG-2FFVC900I
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

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Zynq UltraScale+ XCZU9EG-2FFVC900I

-

128MB

4GB

Board-to-Board (BTB) Socket - 240

2.990" L x 2.050" W (76.00mm x 52.00mm)

-40°C ~ 85°C

TE0741-05-B2I-1-A

Trenz Electronic GmbH

MODULE FPGA KINTEX

Module/Board Type: FPGA
Core Processor: Xilinx Kintex-7 FPGA XC7K160T-2FBG676I
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: -
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

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Xilinx Kintex-7 FPGA XC7K160T-2FBG676I

-

32MB

-

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0745-02-92I31-AK

Trenz Electronic GmbH

MOD SOM DDR3L 1GB

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7045)
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket - 480
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

paquet: -

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ARM Cortex-A9

Zynq-7000 (Z-7045)

-

64MB

1GB

Board-to-Board (BTB) Socket - 480

2.050" L x 2.990" W (52.00mm x 76.00mm)

-40°C ~ 85°C