Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
3M |
CONN SOCKET QFN 88POS GOLD
|
paquet: - |
Stock6 156 |
|
88 (4 x 22) | 0.016" (0.40mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.016" (0.40mm) | Gold | - | Beryllium Copper | Polyethersulfone (PES) | - |
||
3M |
CONN SOCKET QFN 48POS GOLD
|
paquet: - |
Stock6 156 |
|
48 (4 x 12) | 0.016" (0.40mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) | - |
||
3M |
CONN SOCKET PGA ZIF 441POS GOLD
|
paquet: - |
Stock8 226 |
|
441 (21 x 21) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
||
3M |
CONN SOCKET QFN 32POS GOLD
|
paquet: - |
Stock8 892 |
|
32 (4 x 8) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) | - |
||
3M |
CONN SOCKET PGA ZIF 121POS GOLD
|
paquet: - |
Stock9 084 |
|
121 (11 x 11) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
||
3M |
CONN SOCKET PGA ZIF 169POS GOLD
|
paquet: - |
Stock6 288 |
|
169 (13 x 13) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
||
3M |
CONN SOCKET SIP ZIF 20POS GOLD
|
paquet: - |
Stock7 932 |
|
20 (1 x 20) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
||
3M |
CONN SOCKET SOIC 28POS GOLD
|
paquet: - |
Stock6 360 |
|
28 (2 x 14) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled | -55°C ~ 150°C |
||
3M |
CONN TRANSIST TO-3/TO-66 3POS
|
paquet: - |
Stock6 156 |
|
3 (Rectangular) | - | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.234" (5.94mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | -55°C ~ 150°C |
||
3M |
CONN IC DIP SOCKET ZIF 40POS GLD
|
paquet: - |
Stock6 324 |
|
40 (2 x 20) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
||
3M |
CONN IC DIP SOCKET ZIF 32POS GLD
|
paquet: - |
Stock7 884 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
||
3M |
CONN SOCKET SOIC 16POS GOLD
|
paquet: - |
Stock6 012 |
|
16 (2 x 8) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled | -55°C ~ 150°C |
||
3M |
CONN SOCKET SOIC 16POS GOLD
|
paquet: - |
Stock7 896 |
|
16 (2 x 8) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled | -55°C ~ 150°C |
||
3M |
CONN IC DIP SOCKET ZIF 48POS GLD
|
paquet: - |
Stock13 524 |
|
48 (2 x 24) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
||
3M |
CONN SOCKET SOIC 14POS GOLD
|
paquet: - |
Stock7 404 |
|
14 (2 x 7) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled | -55°C ~ 150°C |
||
3M |
CONN SOCKET SOIC 8POS GOLD
|
paquet: - |
Stock22 776 |
|
8 (2 x 4) | - | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled | -55°C ~ 150°C |
||
3M |
CONN IC DIP SOCKET ZIF 40POS GLD
|
paquet: - |
Stock7 584 |
|
40 (2 x 20) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
||
3M |
CONN IC DIP SOCKET ZIF 28POS GLD
|
paquet: - |
Stock8 406 |
|
28 (2 x 14) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
||
3M |
CONN IC DIP SOCKET ZIF 16POS GLD
|
paquet: - |
Stock7 236 |
|
16 (2 x 8) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
||
3M |
CONN IC DIP SOCKET ZIF 24POS GLD
|
paquet: - |
Stock7 224 |
|
24 (2 x 12) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
||
3M |
CONN IC DIP SOCKET ZIF 20POS GLD
|
paquet: - |
Stock9 444 |
|
20 (2 x 10) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
||
3M |
CONN IC DIP SOCKET ZIF 14POS GLD
|
paquet: - |
Stock23 460 |
|
14 (2 x 7) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
||
3M |
CONN SOCKET PLCC 44POS TIN
|
paquet: - |
Stock23 196 |
|
44 (4 x 11) | 0.050" (1.27mm) | Tin | 160µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
||
3M |
CONN SOCKET PLCC 44POS TIN
|
paquet: - |
Stock100 662 |
|
44 (4 x 11) | 0.050" (1.27mm) | Tin | 160µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
||
3M |
CONN SOCKET PLCC 32POS TIN
|
paquet: - |
Stock7 140 |
|
32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | Tin | 160µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
||
3M |
CONN IC DIP SOCKET 28POS TIN
|
paquet: - |
Stock109 938 |
|
28 (2 x 14) | 0.100" (2.54mm) | Tin | 35µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 35µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled | -25°C ~ 85°C |
||
3M |
CONN IC DIP SOCKET 14POS TIN
|
paquet: - |
Stock98 028 |
|
14 (2 x 7) | 0.100" (2.54mm) | Tin | 35µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 35µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled | -25°C ~ 85°C |
||
3M |
CONN IC DIP SOCKET 16POS TIN
|
paquet: - |
Stock109 494 |
|
16 (2 x 8) | 0.100" (2.54mm) | Tin | 35µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 35µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled | -25°C ~ 85°C |