Vishay - Miniature housing enables rapid prototyping for IR reflective presence / proximity sensors | Heisener Electronics
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Vishay - Miniature housing enables rapid prototyping for IR reflective presence / proximity sensors

Technology Cover
Date de Parution: 2015-09-23
Vishay has expanded its optoelectronics portfolio by announcing miniature plastic housings to rapidly develop prototypes of reflective presence and proximity sensors. The company says the unique design of the enclosure provides optical isolation between the 3mm (T1) infrared (IR) transmitter and any Vishay TSSP type presence or proximity sensor. For reflective sensor applications, such as automatic hand dryers, automatic towel dispensers, toys and vending machines, optical isolation between the transmitter and the sensor is absolutely necessary. Thanks to its extremely high sensitivity, Vishay Semiconductors TSSP sensors can be inadvertently activated even with small light leaks. To avoid this, designers have traditionally had to spend precious time constructing their own mechanical enclosures and optical isolation. To speed prototyping and small-scale production, Vishay's TSSP-HA plastic housing provides designers with the required optical isolation while aligning transmitter and sensor leads to the grid on a standard breadboard. In addition, the cavities on each side of the stand are designed with recessed top edges for cover pieces, simplifying the task of designing holes (if needed) for the sight tube of the sensor or transmitter. TSSP-HA can withstand the wave soldering temperature on the other side of the PCB, is RoHS compliant and halogen-free.