Toshiba joined the BLE lineup

The new IC complies with the Bluetooth version, the new high-speed features of 2M PHY and Code PHY (500kbps and 125kbps). 5.0 standard and supports all necessary data rates. ＆nbsp; The receiver sensitivity is -105dBps -105dBm, which is in the leading position in the industry. The built-in high-efficiency power amplifier in the transmission module can provide up to +8 dBm transmit power. All these features make long-distance communication and low current consumption possible. ＆nbsp; The new IC based on the ARM Cortex-M0 processor integrates 256kB Mask ROM and 144kB RAM with Bluetooth baseband processing function, which can process Bluetooth applications and data. They support HCI and GATT profiles, including server and client functions. ＆nbsp; An 18-port GPIO interface is also included to set the SPI, I2C and UART to 2 channels respectively, so that the complete architecture of the system can interface with various peripherals. These GPIOs can be configured for wake-up, 4-channel PWM, 5-channel ADC interface, etc. They can choose to configure the control interface of an external amplifier for remote communication. ＆nbsp; It only consumes 11.0mA when transmitting equipment. The reception is reduced to 5.1mA, and the current consumption is very low (100nA) in deep sleep mode. Both devices are packaged in a 5mm x 5mm QFN40 package with a pin pitch of 0.4mm. ＆nbsp; TC35680FSG contains a 128KB ROM, which is used to store user programs and related data for various applications, and can run independently without external non-volatile memory. This reduces the number of external components and reduces the required PCB area and BOM cost. ＆nbsp; TC35681FSG has no built-in Flash ROM, so it can be used with external non-volatile memory or host processor. The wide operating range of -40 ° to + 125 ° C makes it ideal for applications that may withstand high temperatures. ＆nbsp; By adding new products to its product lineup, Toshiba ensures that Bluetooth low energy technology can be easily integrated into IoT devices to meet the growing demand for high throughput and long-distance communications. The wide operating temperature range makes these devices suitable for industrial applications and increases product value for users in many applications.