The satellite communications product family includes the first dual beam active beamforming IC series | Heisener Electronics
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The satellite communications product family includes the first dual beam active beamforming IC series

Technology Cover
Date de Parution: 2022-01-30, Renesas Electronics America

   Renesas Electronics has expanded its mmWave LNAs and Tx BFC product portfolio with the introduction of three new dual-beam active beamforming chips.

   These new integrated circuits offer first-class power consumption, noise, compact size and simple integration, and are key drivers of the next generation of low-delay electronic navigation antennas for flight connections, maritime, mobile satellite communications and ground terminals in low Earth orbit.

   The new F61xx Rx device is believed to be the first commercial product to offer dual-beam capability for simultaneous multi-satellite, multi-orbit operations over the full Ku and Ka satellite communications bands. They provide Oems with flexibility in LNA selection and layout to improve noise metrics and system G/T performance. Taking advantage of these features, major satellite communications solution providers and Oems have designed integrated circuits for half-duplex and full-duplex systems, with production expected to begin in 2022.

   Naveen Yanduru, Vice President of Renesas RF Communications Products, said, "Our customers face three major challenges as they move from mechanical antennas to electronic navigation antennas: thermal management, physical integration and affordability. "The new dual-beam F61xx device offers a combination of low cost, energy saving, low noise and compact size, which is the industry's demand for next-generation low-delay satellite communications, radar and communications systems that will connect more people in more places."

   The new device offers lower power consumption, increased on-chip beam memory, and dual-beam operation (configurable single beam saves 40% power), as well as highly improved RF performance. They complement the established sub-6ghz RFIC product portfolio and the recent 5G millimeter wave product line. The second generation of dual beamforming ics addresses the thermal, integration, and cost challenges faced by designers as they transition from bulky, mechanically controlled antennas to lighter, slimmer active electronically scanned arrays.

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