TE Connectivity - Versatile interconnection system for wire-to-board and wire-to-wire applications (AMPMODU) | Heisener Electronics
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TE Connectivity - Versatile interconnection system for wire-to-board and wire-to-wire applications (AMPMODU)

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Date de Parution: 2015-08-10
TE Connectivity's AMPMODU MTE interconnect system is targeted at wire-to-board and wire-to-wire applications and can be found in many types of electronic devices, including computers, copiers, commercial printers, appliances, medical equipment and automotive controls. This product implements Insulated Displacement Contacts (IDC) or crimp-in contacts to meet the individual needs of the end user.