TE Connectivity - Versatile interconnection system for wire-to-board and wire-to-wire applications (AMPMODU) | Heisener Electronics
Contactez nous
SalesDept@heisener.com +86-755-83210559-836
Language Translation

* Please refer to the English Version as our Official Version.

TE Connectivity - Versatile interconnection system for wire-to-board and wire-to-wire applications (AMPMODU)

Technology Cover
Date de Parution: 2015-08-10
TE Connectivity's AMPMODU MTE interconnect system is targeted at wire-to-board and wire-to-wire applications and can be found in many types of electronic devices, including computers, copiers, commercial printers, appliances, medical equipment and automotive controls. This product implements Insulated Displacement Contacts (IDC) or crimp-in contacts to meet the individual needs of the end user.