The FX27 series 0.8mm spacing board to board connectors of Hirose Electric allow flexible stacking height. It only needs to change the length of the printed circuit board (PCB) socket, eliminating the need for connectors with different heights. The FX27 connector has an increased XY axis floating range compared to the previous high-speed FunctionMAX series connectors. The floating range of ± 1.2 mm is now supported in the X and Y directions. These connectors absorb the stress caused by misalignment, while the tightening screws and PCB shrink due to high temperature.
FX27 series operates in the environment of - 55 ° C to+105 ° C, including temperature rise through current flow, and provides 0.5 a current per pin capacity. The recommended PCB layout is 60 positions for installation, insertion and clipping design. In addition to industrial and automotive environments, the series is designed for a wide range of applications, including base stations, servo drives, servers, servo motors, cash registers, ultrasonic diagnostic equipment, plc, and so on.
FX27 series high-speed clamped connector also has a wide self-aligning range of ± 0.7 mm in X and Y directions. Floating contact and self calibrating designs simplify the assembly process and provide time and cost savings, especially when mating multiple connectors on the same board. A friction lock on one side ensures that the insertion plate remains on the required connector when it does not fit. Supports the PCI Express Gen 1 interface standard, which provides data transmission speeds of up to 2.5 Gbps. When used as stacked connectors, their stacking height, cabling, and component installation are customizable. Conductors with flexible height adjustment can also be provided to transmit power.
The dual beam contact design of the board to board connector provides a self-cleaning function. The first beam eliminates the dust on the contact path, ensuring the ultra reliable contact path of the second beam. The contacts on the two sockets are enclosed in the housing, providing advanced dust protection. This feature also reduces the risk of dust adhesion due to solder waste and flux during installation.
