Fairchild Semiconductor - Smart power module delivers efficiency and EMI protection (FSBB10CH120DF) | Heisener Electronics
Contactez nous
SalesDept@heisener.com 86-755-83210559-802
Language Translation

* Please refer to the English Version as our Official Version.

Fairchild Semiconductor - Smart power module delivers efficiency and EMI protection (FSBB10CH120DF)

Technology Cover
Date de Parution: 2015-09-09, Fairchild/ON Semiconductor
The FSBB10CH120DF Motion SPM 3 series module is part of Fairchild Semiconductor's Motion SPM 3 module series. FSBB10CH120DF is an intelligent power module (SPM) with a 1200V, 10A three-phase inverter with an insulated gate bipolar transistor (IGBT) rated short-circuit current, which can provide integrated gate drivers and protection functions, To minimize EMI. The fully functional module can provide high-performance inverter output stage, suitable for various AC induction, BLDC and PMSM motor control applications. FSBB10CH120DF helps to improve efficiency while simplifying system design, reducing board space, improving system reliability and speeding time to market. Like other modules in the Fairchild Motion SPM 3 series, the FSBB10CH120DF module provides optimized packaging for thermal performance, high power density, and rugged assembly to minimize conduction and switching losses. The module has extremely low thermal resistance, high-speed HVIC, three-phase circuit sensing, LVIC temperature sensing, and an isolation rating of 2500 Vrms / 1 min. Fairchild FSBB10CH120DF Motion SPM 3 series modules provide three-phase DC / AC power conversion, in which the collector current of each IGBT is rated at 10A and the collector-emitter voltage is rated at 1200V. The unit has multiple on-module protection designs, including undervoltage lockout, overcurrent shutdown, thermal monitoring of the driver IC, and fault signal / report. The module uses alumina DBC substrate to achieve very low thermal resistance, and lists the standard operating temperature of 40C to + 150C. Other features include an open-emitter pin separate from the low-side IGBT for three-phase current sensing and built-in LVIC temperature sensing. The integrated high-speed HVIC converts the input logic level gate input to the high-voltage, high-current drive signal required to properly drive the IGBT inside the module. Each phase also provides independent IGBT negative terminals to support the most extensive control algorithms. The FSBB10CH120DF has a through-hole mounting style, and its compact size makes it an ideal solution for various industrial motors (AC 400V class) and general motor control applications.