FTDI - High-performance single-chip solution for USB full-speed bridging | Heisener Electronics
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FTDI - High-performance single-chip solution for USB full-speed bridging

Technology Cover
Date de Parution: 2016-05-03
FTDI Chip continues to explore innovative new methods to ensure that USB technology is as simple and easy to use as possible. The company's new FT260 is a human-machine interface device (HID) class interface controller IC that provides USB 2.0 full-speed (12Mbps) connectivity for a variety of application scenarios, including touch screen, computer peripherals, and IoT sensor device connectivity And the USB interface of the microcontroller or programmable logic center system design, as well as industrial automation equipment and USB instruments. The USB bridge chip uses compact 28-pin SSOP and 28-pin QFN package options, has dual HID interface support, and has I2C and UART bus conversion functions. Because the entire USB protocol is processed on the chip, the FT260 product provides engineers with a plug-and-play solution that is easy to integrate into contemporary embedded system designs. These ICs use standard class drivers, which means there is no need to worry about installing complex vendor-specific drivers. Flexible I / O means they are compatible with 1.8V to 3.3V systems. During full operation, only 24mA is consumed, while in suspend mode, this current drops to 385uA. The FT260 is the first device of its kind to comply with the HID-over-I2C protocol, which was specified by Microsoft in the Windows 8 release. On the I2C bus, a total of 4 different speed modes (SM), fast mode (FM), fast mode plus (FM +) and high speed (HS) can be used in standard mode, and 7-bit addressing is supported. Integrated memory resources can store custom USB descriptors. The built-in oscillator PLL eliminates the need for an external crystal-saving space and reducing bill of materials costs. In addition, unlike rival ICs, the FT260 includes a USB battery charger detection mechanism, so it can benefit from more efficient charging. To further assist engineers, the IC will be supported by a range of board-level products.