Osram's new ambient light/proximity sensor TCS3720 has higher sensitivity and signal-to-noise ratio, and maintains excellent measurement performance under the new low transmittance OLED screen; can be used without compromising display management or proximity sensing capabilities It meets the expectations of mobile phone manufacturers for extremely high display performance and can reliably support a 5cm proximity sensing range.
Melexis, a spherical microelectronics engineering company, has announced the introduction of a new current sensor chip simulation tool that simplifies the design and implementation of current detection solutions using our proprietary IMC-Hall® technology. This tool helps customers select suitable devices and shields.
NXP integrates the latest Industry 4.0 technologies into a comprehensive hardware and software platform to help develop smart, secure industrial iot applications. The flexible modular I. Mx RT industrial drive development platform supports multi-motor control and deterministic TSN communication, while laying a solid foundation for standards-compliant industrial network security. The hardware of the platform relies on I. MX RT1170 crossover MCU series and EdgeLock® SE05x security components.
Analog Devices Inc. ADMV8526 Digitally Tunable Filters, available now from Mouser, are RF band-pass filters that feature a digitally selectable frequency of operation. This device offers a 1.25GHz to 2.6GHz adjustable FCENTER frequency range and uses an 8-bit value (256 states) incorporating a patent-pending interpolation technique.
China has developed the first "3D packaging" chip, which means the birth of China's first 7nm chip! The so-called "3D packaged" chip previously referred to TSMC's production technology. According to relevant data, the "3D packaged" chip broke through the 7nm process limit and integrated 60 billion transistors.
Flex Logix, Inc., a leading provider of reconfigurable computing solutions, architecture and software, and CEVA, Inc., a leading global licensor of wireless connectivity and smart sensing technologies and integrated IP solutions, announce the successful launch of the world's first Flex Logix EFLX embedded FPGA (eFPGA) chip product with integrated CEVA-X2 DSP instruction extension interface. Called SOC2, the ASIC device supports a flexible and changeable instruction set to meet demanding and changing processing workloads.
TDK has developed the new TFM201208BLE series of inductors to optimize space-constrained smartphone power circuits. These inductors are available in 0.24, 0.33 and 0.47 µH versions
Holtek launched a new generation of integrated Flash MCU BD66FM6550G dedicated to brushless DC motors, integrating MCU, LDO and 3-channel 48V gate-driver (Gate-Driver), very suitable for small PCB space, can support square wave and sine wave control, with Sensorless enhanced The filter can make the starting or low speed more stable, which is very suitable for the application of power tools, pumps, fans and other products below 8 series lithium batteries.
Globally diversified chemical company Saudi Basic Industries Corporation (SABIC) today launched an ecosystem called BLUEHERO™ designed to accelerate the world's energy transition to electricity in support of global climate change goals. This ever-expanding ecosystem encompasses a wide range of materials, solutions, expertise and projects. As a first step in the program, SABIC will focus on improving battery structural components through unique flame retardant materials and solutions to support the automotive industry in developing better, safer and more efficient electric vehicles.
Posifa Technologies has introduced its new PVC6100 series of MEMS Pirani gauges for atmosphere (ATM) to medium vacuum applications. Delivering a wide range from 10-4 Torr to ATM, the gauges offer high accuracy and long-term stability while providing an interchangeable probe and customisable output voltages to reduce the total cost of ownership for users by eradicating the requirement for calibration of replacement probes.
Solidigm has introduced new solid-state drives (SSDS) for data centers and enterprise applications, d7-P5520 and D7-P5620, to extend its performance optimized D7 product line. These disks are optimized for real-world computing and storage server workloads and come with a wide range of dimensions and capacity options. These products take up less space and use less power, leading to faster computing performance and a lower total cost of ownership
The world's leading supplier of Internet connectivity products and services di into international released is suitable for bad environment Digi IX30, through the industry's leading edge intelligent solid design, in order to achieve higher levels of reliability and flexibility. Digi IX30 works with Digi Remote Manager® to form an all-in-one solution for applications ranging from power distribution and automation to Remote machine and sensor monitoring for oil and gas production, water utilities, smart cities and outdoor signage industries.
Sensirion has added the digital automotive sensor SHT4xA to its range of humidity and temperature sensors. With integrated diagnostic capability, AEC-Q100 product qualification, optional wettable flanks and low annual drift, the device sets the highest standards for demanding applications.
The biggest characteristic of ceramic capacitor is that its insulation is very good, so it is widely used in electronics, electrical appliances and anti-shock industries.
Codasip, a leader in intellectual property (IP) and processor design automation for customizable RISC-V processors, has announced that Veridify Security's Anti-Quantum Security tool is now available to support Codasip's RISC-V processors with Security startup capabilities.
The Renesas RZ/V2L microprocessor is equipped with Renesas' unique AI dynamic Configurable processor (DRP-AI), so it can support a variety of image processing purposes, including color correction and noise reduction of input/output images. RZ/V2L microprocessors come in 15 mm x 15 mm or 21 mm x 21 mm BGA packages, both of which are compatible with Renesas RZ/G2L pins, making it easy to upgrade and reuse software without modifying system configurations.
AR pioneer Magic Leap is expected to launch its latest AR device, The Magic Leap 2. Magic Leap 2 is designed specifically for enterprise applications and will be one of the most immersive enterprise AR headsets on the market. With its ergonomic design, industry-leading optical technology and powerful computing power, Magic Leap 2 enables operators to work more efficiently, helps companies optimize complex processes and enables seamless collaboration among employees.
Power Integrations has announced the addition of InnoSwitch™4-CZ series of high frequency, zero voltage switching (ZVS) flyback IC. When used in conjunction with Power Integrations' ClampZero™ Active clamp IC or the recently released HiperPFS™-5 Gallium nitride Power factor correction IC, the new IC easily meets the latest USB PD 3.1 standard, designed for adapters and chargers up to 220W.
