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Produits Xilinx Inc.

Dossiers 7 167
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XCZU19EG-L2FFVD1760E
Xilinx Inc.

IC FPGA 308 I/O 1760FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
paquet: 1760-BBGA, FCBGA
Stock6 208
XCZU5EG-L2FBVB900E
Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
paquet: 900-BBGA, FCBGA
Stock4 992
XCZU4EG-3FBVB900E
Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
paquet: 900-BBGA, FCBGA
Stock7 072
XC7Z014S-1CLG400C
Xilinx Inc.

IC FPGA SOC 200I/O 400BGA

  • Architecture: MCU, FPGA
  • Core Processor: Single ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 667MHz
  • Primary Attributes: Artix?-7 FPGA, 65K Logic Cells
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 400-LFBGA, CSPBGA
  • Supplier Device Package: 400-CSPBGA (17x17)
paquet: 400-LFBGA, CSPBGA
Stock4 544
XCV300-5BG352I
Xilinx Inc.

IC FPGA 260 I/O 352MBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 65536
  • Number of I/O: 260
  • Number of Gates: 322970
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
paquet: 352-LBGA, Metal
Stock5 248
hot XCV2000E-6FG680I
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 9600
  • Number of Logic Elements/Cells: 43200
  • Total RAM Bits: 655360
  • Number of I/O: 512
  • Number of Gates: 2541952
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
paquet: 680-LBGA Exposed Pad
Stock4 976
hot XCS10-4TQ144C
Xilinx Inc.

IC FPGA 112 I/O 144TQFP

  • Number of LABs/CLBs: 196
  • Number of Logic Elements/Cells: 466
  • Total RAM Bits: 6272
  • Number of I/O: 112
  • Number of Gates: 10000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
paquet: 144-LQFP
Stock10 572
XC4013XL-2PQ208I
Xilinx Inc.

IC FPGA 160 I/O 208QFP

  • Number of LABs/CLBs: 576
  • Number of Logic Elements/Cells: 1368
  • Total RAM Bits: 18432
  • Number of I/O: 160
  • Number of Gates: 13000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
paquet: 208-BFQFP
Stock7 376
XC4010XL-2PQ208C
Xilinx Inc.

IC FPGA 160 I/O 208QFP

  • Number of LABs/CLBs: 400
  • Number of Logic Elements/Cells: 950
  • Total RAM Bits: 12800
  • Number of I/O: 160
  • Number of Gates: 10000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
paquet: 208-BFQFP
Stock7 712
XCKU115-3FLVF1924E
Xilinx Inc.

IC FPGA 728 I/O 1924FCBGA

  • Number of LABs/CLBs: 82920
  • Number of Logic Elements/Cells: 1451100
  • Total RAM Bits: 77721600
  • Number of I/O: 728
  • Number of Gates: -
  • Voltage - Supply: 0.970 V ~ 1.030 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1924-BBGA, FCBGA
  • Supplier Device Package: 1924-FCBGA (45x45)
paquet: 1924-BBGA, FCBGA
Stock5 472
XCKU095-2FFVB2104I
Xilinx Inc.

IC FPGA 702 I/O 2104FCBGA

  • Number of LABs/CLBs: 67200
  • Number of Logic Elements/Cells: 1176000
  • Total RAM Bits: 60518400
  • Number of I/O: 702
  • Number of Gates: -
  • Voltage - Supply: 0.922 V ~ 0.979 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 2104-BBGA, FCBGA
  • Supplier Device Package: 2104-FCBGA (47.5x47.5)
paquet: 2104-BBGA, FCBGA
Stock6 000
XC7K410T-2FFV900C
Xilinx Inc.

IC FPGA 500 I/O 900FCBGA

  • Number of LABs/CLBs: 31775
  • Number of Logic Elements/Cells: 406720
  • Total RAM Bits: 29306880
  • Number of I/O: 500
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
paquet: 900-BBGA, FCBGA
Stock5 296
XCKU5P-2SFVB784E
Xilinx Inc.

XCKU5P-2SFVB784E

  • Number of LABs/CLBs: 27120
  • Number of Logic Elements/Cells: 474600
  • Total RAM Bits: 35737600
  • Number of I/O: 304
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: -
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock5 456
hot XC4VSX35-10FF668I
Xilinx Inc.

IC FPGA 448 I/O 668FCBGA

  • Number of LABs/CLBs: 3840
  • Number of Logic Elements/Cells: 34560
  • Total RAM Bits: 3538944
  • Number of I/O: 448
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 668-BBGA, FCBGA
  • Supplier Device Package: 668-FCBGA (27x27)
paquet: 668-BBGA, FCBGA
Stock16 020
hot XC4VSX25-10FFG668I
Xilinx Inc.

IC FPGA 320 I/O 668FCBGA

  • Number of LABs/CLBs: 2560
  • Number of Logic Elements/Cells: 23040
  • Total RAM Bits: 2359296
  • Number of I/O: 320
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 668-BBGA, FCBGA
  • Supplier Device Package: 668-FCBGA (27x27)
paquet: 668-BBGA, FCBGA
Stock12 768
XC6SLX150-L1FG676C
Xilinx Inc.

IC FPGA 498 I/O 676FCBGA

  • Number of LABs/CLBs: 11519
  • Number of Logic Elements/Cells: 147443
  • Total RAM Bits: 4939776
  • Number of I/O: 498
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
paquet: 676-BBGA, FCBGA
Stock2 848
XA7A100T-2CSG324I
Xilinx Inc.

IC FPGA 285 I/O 324BGA

  • Number of LABs/CLBs: 7925
  • Number of Logic Elements/Cells: 101440
  • Total RAM Bits: 4976640
  • Number of I/O: 210
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 324-LFBGA, CSPBGA
  • Supplier Device Package: 324-CSPBGA (15x15)
paquet: 324-LFBGA, CSPBGA
Stock3 504
hot XC2VP2-5FGG456C
Xilinx Inc.

IC FPGA 156 I/O 456FGBGA

  • Number of LABs/CLBs: 352
  • Number of Logic Elements/Cells: 3168
  • Total RAM Bits: 221184
  • Number of I/O: 156
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
paquet: 456-BBGA
Stock9 408
XC7A15T-2CSG324C
Xilinx Inc.

IC FPGA ARTIX7 210 I/O 324CSBGA

  • Number of LABs/CLBs: 1300
  • Number of Logic Elements/Cells: 16640
  • Total RAM Bits: 921600
  • Number of I/O: 210
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 324-LFBGA, CSPBGA
  • Supplier Device Package: 324-CSPBGA (15x15)
paquet: 324-LFBGA, CSPBGA
Stock5 248
XC7A15T-2FTG256I
Xilinx Inc.

IC FPGA ARTIX7 170 I/O 256FTBGA

  • Number of LABs/CLBs: 1300
  • Number of Logic Elements/Cells: 16640
  • Total RAM Bits: 921600
  • Number of I/O: 170
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
paquet: 256-LBGA
Stock4 928
hot XC3S700A-4FT256C
Xilinx Inc.

IC FPGA 161 I/O 256FTBGA

  • Number of LABs/CLBs: 1472
  • Number of Logic Elements/Cells: 13248
  • Total RAM Bits: 368640
  • Number of I/O: 161
  • Number of Gates: 700000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
paquet: 256-LBGA
Stock5 536
hot XC2S100-5PQ208I
Xilinx Inc.

IC FPGA 140 I/O 208QFP

  • Number of LABs/CLBs: 600
  • Number of Logic Elements/Cells: 2700
  • Total RAM Bits: 40960
  • Number of I/O: 140
  • Number of Gates: 100000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
paquet: 208-BFQFP
Stock6 504
XA3S250E-4CPG132I
Xilinx Inc.

IC FPGA 92 I/O 132CSBGA

  • Number of LABs/CLBs: 612
  • Number of Logic Elements/Cells: 5508
  • Total RAM Bits: 221184
  • Number of I/O: 92
  • Number of Gates: 250000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 132-TFBGA, CSPBGA
  • Supplier Device Package: 132-CSPBGA (8x8)
paquet: 132-TFBGA, CSPBGA
Stock6 032
XCKU035-1SFVA784C
Xilinx Inc.

IC FPGA 468 I/O 784FCBGA

  • Number of LABs/CLBs: 25391
  • Number of Logic Elements/Cells: 444343
  • Total RAM Bits: 19456000
  • Number of I/O: 468
  • Number of Gates: -
  • Voltage - Supply: 0.922 V ~ 0.979 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCCSPBGA (23x23)
paquet: 784-BBGA, FCBGA
Stock7 728
hot XC3S50AN-4TQG144I
Xilinx Inc.

IC FPGA 108 I/O 144TQFP

  • Number of LABs/CLBs: 176
  • Number of Logic Elements/Cells: 1584
  • Total RAM Bits: 55296
  • Number of I/O: 108
  • Number of Gates: 50000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
paquet: 144-LQFP
Stock12 672
XC2C64A-7CP56I
Xilinx Inc.

IC CPLD 64MC 6.7NS 56BGA

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 6.7ns
  • Voltage Supply - Internal: 1.7 V ~ 1.9 V
  • Number of Logic Elements/Blocks: 4
  • Number of Macrocells: 64
  • Number of Gates: 1500
  • Number of I/O: 45
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-LFBGA, CSPBGA
  • Supplier Device Package: 56-CSBGA (6x6)
paquet: 56-LFBGA, CSPBGA
Stock5 808
XC7A12T-2CPG238I
Xilinx Inc.

XC7A12T-2CPG238I

  • Number of LABs/CLBs: 1000
  • Number of Logic Elements/Cells: 12800
  • Total RAM Bits: 737280
  • Number of I/O: 106
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 238-LFBGA, CSPBGA
  • Supplier Device Package: 236-CSBGA (10x10)
paquet: 238-LFBGA, CSPBGA
Stock5 648
XC7S25-1CSGA225I
Xilinx Inc.

XC7S25-1CSGA225I

  • Number of LABs/CLBs: 1825
  • Number of Logic Elements/Cells: 23360
  • Total RAM Bits: 1658880
  • Number of I/O: 150
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 225-LFBGA, CSPBGA
  • Supplier Device Package: 225-CSGA (13x13)
paquet: 225-LFBGA, CSPBGA
Stock6 128