Page 72 - Produits Xilinx Inc. | Heisener Electronics
Contactez nous
SalesDept@heisener.com +86-755-83210559 ext. 816
Connexion/S'inscrire
Language Translation

* Please refer to the English Version as our Official Version.

BOM
Chariot 0

Produits Xilinx Inc.

Dossiers 7 167
Page  72/256
Image
Référence
Fabricant
Description
paquet
Stock
Quantité
XCMECH-FFG672
Xilinx Inc.

FFG672 MECHANICAL SAMPLE

  • Type: Mechanical Sample
  • Applications: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock7 504
XCZU11EG-2FFVF1517I
Xilinx Inc.

IC FPGA 464 I/O 1517FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
paquet: 1517-BBGA, FCBGA
Stock5 344
XCZU15EG-2FFVC900E
Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 747K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
paquet: 900-BBGA, FCBGA
Stock5 280
XCZU5EV-3SFVC784E
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
paquet: 784-BBGA, FCBGA
Stock2 032
XCZU5EG-2FBVB900E
Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
paquet: 900-BBGA, FCBGA
Stock4 976
XCZU7CG-1FFVC1156E
Xilinx Inc.

IC FPGA 360 I/O 1156FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 533MHz, 1.3GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock2 608
XC7Z035-1FFG900C
Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 900BGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 667MHz
  • Primary Attributes: Kintex?-7 FPGA, 275K Logic Cells
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
paquet: 900-BBGA, FCBGA
Stock4 464
hot XC2V3000-4FGG676I
Xilinx Inc.

IC FPGA 484 I/O 676FBGA

  • Number of LABs/CLBs: 3584
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 1769472
  • Number of I/O: 484
  • Number of Gates: 3000000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
paquet: 676-BGA
Stock4 912
XA3S200-4PQG208Q
Xilinx Inc.

IC FPGA 141 I/O 208QFP

  • Number of LABs/CLBs: 480
  • Number of Logic Elements/Cells: 4320
  • Total RAM Bits: 221184
  • Number of I/O: 141
  • Number of Gates: 200000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
paquet: 208-BFQFP
Stock6 528
hot XCV100E-6PQG240C
Xilinx Inc.

IC FPGA 158 I/O 240QFP

  • Number of LABs/CLBs: 600
  • Number of Logic Elements/Cells: 2700
  • Total RAM Bits: 81920
  • Number of I/O: 158
  • Number of Gates: 128236
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
paquet: 240-BFQFP
Stock7 472
XCV200E-8FG456C
Xilinx Inc.

IC FPGA 284 I/O 456FBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 114688
  • Number of I/O: 284
  • Number of Gates: 306393
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
paquet: 456-BBGA
Stock3 616
hot XCS10-4VQ100C
Xilinx Inc.

IC FPGA 77 I/O 100VQFP

  • Number of LABs/CLBs: 196
  • Number of Logic Elements/Cells: 466
  • Total RAM Bits: 6272
  • Number of I/O: 77
  • Number of Gates: 10000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-VQFP (14x14)
paquet: 100-TQFP
Stock43 596
XC4013E-4PQ240I
Xilinx Inc.

IC FPGA 192 I/O 240QFP

  • Number of LABs/CLBs: 576
  • Number of Logic Elements/Cells: 1368
  • Total RAM Bits: 18432
  • Number of I/O: 192
  • Number of Gates: 13000
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
paquet: 240-BFQFP
Stock5 952
XC4010E-3HQ208C
Xilinx Inc.

IC FPGA 160 I/O 208HQFP

  • Number of LABs/CLBs: 400
  • Number of Logic Elements/Cells: 950
  • Total RAM Bits: 12800
  • Number of I/O: 160
  • Number of Gates: 10000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 208-BFQFP Exposed Pad
  • Supplier Device Package: 208-PQFP (28x28)
paquet: 208-BFQFP Exposed Pad
Stock2 688
hot XC4020E-2HQ240C
Xilinx Inc.

IC FPGA 193 I/O 240HQFP

  • Number of LABs/CLBs: 784
  • Number of Logic Elements/Cells: 1862
  • Total RAM Bits: 25088
  • Number of I/O: 193
  • Number of Gates: 20000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
paquet: 240-BFQFP Exposed Pad
Stock6 368
hot XC3142A-3PQ100C
Xilinx Inc.

IC FPGA 82 I/O 100QFP

  • Number of LABs/CLBs: 144
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 30784
  • Number of I/O: 82
  • Number of Gates: 3000
  • Voltage - Supply: 4.25 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 100-BQFP
  • Supplier Device Package: 100-PQFP (14x20)
paquet: 100-BQFP
Stock12 456
hot XC3064A-7PQ160C
Xilinx Inc.

IC FPGA 120 I/O 160QFP

  • Number of LABs/CLBs: 224
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 46064
  • Number of I/O: 120
  • Number of Gates: 4500
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 160-BQFP
  • Supplier Device Package: 160-PQFP (28x28)
paquet: 160-BQFP
Stock6 720
hot XC5VFX200T-2FFG1738C
Xilinx Inc.

IC FPGA 960 I/O 1738FCBGA

  • Number of LABs/CLBs: 15360
  • Number of Logic Elements/Cells: 196608
  • Total RAM Bits: 16809984
  • Number of I/O: 960
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1738-BBGA, FCBGA
  • Supplier Device Package: 1738-FCBGA (42.5x42.5)
paquet: 1738-BBGA, FCBGA
Stock14 712
XC6VLX550T-1FF1760C
Xilinx Inc.

IC FPGA 1200 I/O 1760FBGA

  • Number of LABs/CLBs: 42960
  • Number of Logic Elements/Cells: 549888
  • Total RAM Bits: 23298048
  • Number of I/O: 1200
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
paquet: 1760-BBGA, FCBGA
Stock3 952
hot XC6VSX315T-2FFG1759C
Xilinx Inc.

IC FPGA 720 I/O 1759FCBGA

  • Number of LABs/CLBs: 24600
  • Number of Logic Elements/Cells: 314880
  • Total RAM Bits: 25952256
  • Number of I/O: 720
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1759-FCBGA (42.5x42.5)
paquet: 1760-BBGA, FCBGA
Stock6 336
XC6VCX240T-1FFG1156C
Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

  • Number of LABs/CLBs: 18840
  • Number of Logic Elements/Cells: 241152
  • Total RAM Bits: 15335424
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock3 472
XC6VCX195T-2FF1156C
Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

  • Number of LABs/CLBs: 15600
  • Number of Logic Elements/Cells: 199680
  • Total RAM Bits: 12681216
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
paquet: 1156-BBGA, FCBGA
Stock4 032
hot XC6SLX16-2FTG256I
Xilinx Inc.

IC FPGA 186 I/O 256FTBGA

  • Number of LABs/CLBs: 1139
  • Number of Logic Elements/Cells: 14579
  • Total RAM Bits: 589824
  • Number of I/O: 186
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
paquet: 256-LBGA
Stock4 784
hot XC7A100T-2FGG676C
Xilinx Inc.

IC FPGA 300 I/O 676FCBGA

  • Number of LABs/CLBs: 7925
  • Number of Logic Elements/Cells: 101440
  • Total RAM Bits: 4976640
  • Number of I/O: 300
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
paquet: 676-BGA
Stock4 432
XC6SLX75-3FGG676I
Xilinx Inc.

IC FPGA 408 I/O 676FBGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 408
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
paquet: 676-BGA
Stock6 780
XCR3384XL-12FTG256I
Xilinx Inc.

IC CPLD 384MC 10.8NS 256BGA

  • Programmable Type: In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max: 10.8ns
  • Voltage Supply - Internal: 2.7 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 24
  • Number of Macrocells: 384
  • Number of Gates: 9000
  • Number of I/O: 212
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
paquet: 256-LBGA
Stock6 016
hot XCR3128XL-10VQG100C
Xilinx Inc.

IC CPLD 128MC 9.1NS 100VQFP

  • Programmable Type: In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max: 9.1ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 8
  • Number of Macrocells: 128
  • Number of Gates: 3000
  • Number of I/O: 84
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-VQFP (14x14)
paquet: 100-TQFP
Stock30 552
XCKU15P-L1FFVE1517I
Xilinx Inc.

XCKU15P-L1FFVE1517I

  • Number of LABs/CLBs: 65340
  • Number of Logic Elements/Cells: 1143450
  • Total RAM Bits: 82329600
  • Number of I/O: 512
  • Number of Gates: -
  • Voltage - Supply: 0.698 V ~ 0.876 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
paquet: 1517-BBGA, FCBGA
Stock7 776